Substrate storing container
    1.
    发明授权
    Substrate storing container 有权
    基材储存容器

    公开(公告)号:US09387960B2

    公开(公告)日:2016-07-12

    申请号:US14131120

    申请日:2012-07-03

    IPC分类号: B65D43/02 H01L21/673

    CPC分类号: B65D43/02 H01L21/67373

    摘要: A substrate storing container includes: a container body for storing semiconductor wafers; a door that is fitted to the front of the container body; and a locking mechanism locking the door. The locking mechanism includes: a rotary driver that is supported by the door and operated from a cover plate side; and a locking bar that vertically slides as the rotary driver rotates to bring the distal end into, and out of, a locking hollow of the container body. The rotary driver is separated into first and second rotary drivers. The first and second rotary drivers are formed with first and second cam portions, respectively. The first and second cam portions are made to support the proximal end of the locking bar therebetween so that the locking bar can sway in the thickness direction of the door.

    摘要翻译: 基板收容容器包括:容纳半导体晶片的容器本体; 安装在容器主体前部的门; 以及锁定机构。 锁定机构包括:旋转驱动器,其由门支撑并从盖板侧操作; 以及随着旋转驱动器旋转而垂直滑动以使远端进入和离开容器主体的锁定中空的锁定杆。 旋转驱动器分离成第一和第二旋转驱动器。 第一和第二旋转驱动器分别形成有第一和第二凸轮部分。 第一和第二凸轮部分被制成以支撑其间的锁定杆的近端,使得锁定杆可以在门的厚度方向上摆动。

    SUBSTRATE STORING CONTAINER
    2.
    发明申请
    SUBSTRATE STORING CONTAINER 有权
    基座储存容器

    公开(公告)号:US20140138279A1

    公开(公告)日:2014-05-22

    申请号:US14131120

    申请日:2012-07-03

    IPC分类号: B65D43/02

    CPC分类号: B65D43/02 H01L21/67373

    摘要: A substrate storing container includes: a container body for storing semiconductor wafers; a door that is fitted to the front of the container body; and a locking mechanism locking the door. The locking mechanism includes: a rotary driver that is supported by the door and operated from a cover plate side; and a locking bar that vertically slides as the rotary driver rotates to bring the distal end into, and out of, a locking hollow of the container body. The rotary driver is separated into first and second rotary drivers. The first and second rotary drivers are formed with first and second cam portions, respectively. The first and second cam portions are made to support the proximal end of the locking bar therebetween so that the locking bar can sway in the thickness direction of the door.

    摘要翻译: 基板收容容器包括:容纳半导体晶片的容器本体; 安装在容器主体前部的门; 以及锁定机构。 锁定机构包括:旋转驱动器,其由门支撑并从盖板侧操作; 以及随着旋转驱动器旋转而垂直滑动以使远端进入和离开容器主体的锁定中空的锁定杆。 旋转驱动器分离成第一和第二旋转驱动器。 第一和第二旋转驱动器分别形成有第一和第二凸轮部分。 第一和第二凸轮部分被制成以支撑其间的锁定杆的近端,使得锁定杆可以在门的厚度方向上摆动。

    Wafer storing container
    3.
    发明授权
    Wafer storing container 有权
    晶圆储存容器

    公开(公告)号:US08960442B2

    公开(公告)日:2015-02-24

    申请号:US14356852

    申请日:2011-11-08

    IPC分类号: B65D85/48 H01L21/673

    摘要: Wafer support shelves (10, 10) are each provided with wafer support projections (A, B1, B2) on which parts of the outer margins of a semiconductor wafer (W) are to be placed. In each case, one of the support projections (A, B1, B2) is provided on the far side of the center position of the semiconductor wafer (W), and two of the support projections are provided on the near side of the center of the semiconductor wafer. By means of this structure, in a state in which a lid body (3) is not attached to a wafer extraction/insertion opening (2), the flexure amount of the semiconductor wafers placed on the support projections of multiple locations in the wafer support shelves can be reduced with a minimal number of projections, so that a hindrance is not created to an operation such as extraction by a robot arm.

    摘要翻译: 晶片支撑架(10,10)各自设置有晶片支撑突起(A,B1,B2),半导体晶片(W)的外边缘的一部分将被放置在其上。 在每种情况下,支撑突起(A,B1,B2)中的一个设置在半导体晶片(W)的中心位置的远侧,并且两个支撑突起设置在 半导体晶片。 通过这种结构,在盖体(3)未安装在晶片拔出/插入口(2)的状态下,放置在晶片支撑体中的多个位置的支撑突起上的半导体晶片的挠曲量 可以以最少数量的突起来减少搁架,从而不会对诸如由机器人臂提取的操作产生障碍。

    SUPPORTING BODY AND SUBSTRATE STORAGE CONTAINER
    4.
    发明申请
    SUPPORTING BODY AND SUBSTRATE STORAGE CONTAINER 有权
    支撑体和底座储物容器

    公开(公告)号:US20110100870A1

    公开(公告)日:2011-05-05

    申请号:US12997414

    申请日:2009-06-12

    CPC分类号: H01L21/67379 H01L21/67383

    摘要: A separate supporting body for supporting semiconductor wafers of φ450 mm is attached to the inner surface of either side wall of a container body. Each supporting body is formed of a front supporting piece that is projected laterally from a frame and horizontally retains the wafer on, at least, the side part in the front peripheral edge; and a rear supporting piece that is projected laterally from frame and horizontally retains the wafer on, at least, the side part in the rear peripheral edge. Front supporting piece is formed of a projected part that extends from the front of frame toward the front peripheral edge of the semiconductor wafer and a curved part that extends rearwards from projected part along the peripheral edge of the semiconductor wafer.

    摘要翻译: 用于支撑450mm的半导体晶片的单独的支撑体附接到容器主体的任一侧壁的内表面。 每个支撑体由从框架横向突出的前支撑件形成,并且将晶片水平地保持在至少在前周边边缘中的侧部; 以及从框架侧向突出并水平地将晶片保持在至少在后周缘中的侧部的后支撑件。 前支撑件由从框架的前部向半导体晶片的前周边延伸的突起部分和从投影部分沿着半导体晶片的周缘向后延伸的弯曲部分形成。

    Substrate storage container
    5.
    发明授权
    Substrate storage container 有权
    基材储存容器

    公开(公告)号:US08627959B2

    公开(公告)日:2014-01-14

    申请号:US12997414

    申请日:2009-06-12

    IPC分类号: B65D85/48 B65D85/00

    CPC分类号: H01L21/67379 H01L21/67383

    摘要: A separate supporting body for supporting semiconductor wafers of φ450 mm is attached to the inner surface of either side wall of a container body. Each supporting body is formed of a front supporting piece that is projected laterally from a frame and horizontally retains the wafer on, at least, the side part in the front peripheral edge; and a rear supporting piece that is projected laterally from frame and horizontally retains the wafer on, at least, the side part in the rear peripheral edge. Front supporting piece is formed of a projected part that extends from the front of frame toward the front peripheral edge of the semiconductor wafer and a curved part that extends rearwards from projected part along the peripheral edge of the semiconductor wafer.

    摘要翻译: 用于支撑phi450mm的半导体晶片的单独的支撑体附接到容器主体的任一侧壁的内表面。 每个支撑体由从框架横向突出的前支撑件形成,并且将晶片水平地保持在至少在前周边边缘中的侧部; 以及从框架侧向突出并水平地将晶片保持在至少在后周缘中的侧部的后支撑件。 前支撑件由从框架的前部向半导体晶片的前周边延伸的突起部分和从投影部分沿着半导体晶片的周缘向后延伸的弯曲部分形成。