公开(公告)号：US20140138279A1

公开(公告)日：2014-05-22

申请号：US14131120

申请日：2012-07-03

申请人： Tsuyoshi Nagashima ,  Shuichi Inoue ,  Takaharu Oyama ,  Chiaki Matsutori ,  Kazumasa Ohnuki ,  Hiroyuki Shida ,  Hiroki Yamagishi

发明人： Tsuyoshi Nagashima ,  Shuichi Inoue ,  Takaharu Oyama ,  Chiaki Matsutori ,  Kazumasa Ohnuki ,  Hiroyuki Shida ,  Hiroki Yamagishi

IPC分类号： B65D43/02

CPC分类号： B65D43/02 ,  H01L21/67373

摘要： A substrate storing container includes: a container body for storing semiconductor wafers; a door that is fitted to the front of the container body; and a locking mechanism locking the door. The locking mechanism includes: a rotary driver that is supported by the door and operated from a cover plate side; and a locking bar that vertically slides as the rotary driver rotates to bring the distal end into, and out of, a locking hollow of the container body. The rotary driver is separated into first and second rotary drivers. The first and second rotary drivers are formed with first and second cam portions, respectively. The first and second cam portions are made to support the proximal end of the locking bar therebetween so that the locking bar can sway in the thickness direction of the door.

摘要翻译： 基板收容容器包括：容纳半导体晶片的容器本体; 安装在容器主体前部的门; 以及锁定机构。 锁定机构包括：旋转驱动器，其由门支撑并从盖板侧操作; 以及随着旋转驱动器旋转而垂直滑动以使远端进入和离开容器主体的锁定中空的锁定杆。 旋转驱动器分离成第一和第二旋转驱动器。 第一和第二旋转驱动器分别形成有第一和第二凸轮部分。 第一和第二凸轮部分被制成以支撑其间的锁定杆的近端，使得锁定杆可以在门的厚度方向上摆动。

公开(公告)号：US09387960B2

公开(公告)日：2016-07-12

申请号：US14131120

申请日：2012-07-03

申请人： Tsuyoshi Nagashima ,  Shuichi Inoue ,  Takaharu Oyama ,  Chiaki Matsutori ,  Kazumasa Ohnuki ,  Hiroyuki Shida ,  Hiroki Yamagishi

发明人： Tsuyoshi Nagashima ,  Shuichi Inoue ,  Takaharu Oyama ,  Chiaki Matsutori ,  Kazumasa Ohnuki ,  Hiroyuki Shida ,  Hiroki Yamagishi

IPC分类号： B65D43/02 ,  H01L21/673

CPC分类号： B65D43/02 ,  H01L21/67373

摘要： A substrate storing container includes: a container body for storing semiconductor wafers; a door that is fitted to the front of the container body; and a locking mechanism locking the door. The locking mechanism includes: a rotary driver that is supported by the door and operated from a cover plate side; and a locking bar that vertically slides as the rotary driver rotates to bring the distal end into, and out of, a locking hollow of the container body. The rotary driver is separated into first and second rotary drivers. The first and second rotary drivers are formed with first and second cam portions, respectively. The first and second cam portions are made to support the proximal end of the locking bar therebetween so that the locking bar can sway in the thickness direction of the door.

摘要翻译： 基板收容容器包括：容纳半导体晶片的容器本体; 安装在容器主体前部的门; 以及锁定机构。 锁定机构包括：旋转驱动器，其由门支撑并从盖板侧操作; 以及随着旋转驱动器旋转而垂直滑动以使远端进入和离开容器主体的锁定中空的锁定杆。 旋转驱动器分离成第一和第二旋转驱动器。 第一和第二旋转驱动器分别形成有第一和第二凸轮部分。 第一和第二凸轮部分被制成以支撑其间的锁定杆的近端，使得锁定杆可以在门的厚度方向上摆动。

公开(公告)号：US08960442B2

公开(公告)日：2015-02-24

申请号：US14356852

申请日：2011-11-08

申请人： Takaharu Oyama ,  Chiaki Matsutori ,  Tsuyoshi Nagashima ,  Shuichi Inoue ,  Hiroyuki Shida ,  Hiroki Yamagishi ,  Kazumasa Onuki

发明人： Takaharu Oyama ,  Chiaki Matsutori ,  Tsuyoshi Nagashima ,  Shuichi Inoue ,  Hiroyuki Shida ,  Hiroki Yamagishi ,  Kazumasa Onuki

IPC分类号： B65D85/48 ,  H01L21/673

CPC分类号： H01L21/67383 ,  H01L21/67386 ,  Y10S206/832

摘要： Wafer support shelves (10, 10) are each provided with wafer support projections (A, B1, B2) on which parts of the outer margins of a semiconductor wafer (W) are to be placed. In each case, one of the support projections (A, B1, B2) is provided on the far side of the center position of the semiconductor wafer (W), and two of the support projections are provided on the near side of the center of the semiconductor wafer. By means of this structure, in a state in which a lid body (3) is not attached to a wafer extraction/insertion opening (2), the flexure amount of the semiconductor wafers placed on the support projections of multiple locations in the wafer support shelves can be reduced with a minimal number of projections, so that a hindrance is not created to an operation such as extraction by a robot arm.

摘要翻译： 晶片支撑架（10,10）各自设置有晶片支撑突起（A，B1，B2），半导体晶片（W）的外边缘的一部分将被放置在其上。 在每种情况下，支撑突起（A，B1，B2）中的一个设置在半导体晶片（W）的中心位置的远侧，并且两个支撑突起设置在 半导体晶片。 通过这种结构，在盖体（3）未安装在晶片拔出/插入口（2）的状态下，放置在晶片支撑体中的多个位置的支撑突起上的半导体晶片的挠曲量 可以以最少数量的突起来减少搁架，从而不会对诸如由机器人臂提取的操作产生障碍。

公开(公告)号：US09003920B2

公开(公告)日：2015-04-14

申请号：US13089439

申请日：2011-04-19

申请人： Katsumi Nagahori ,  Tohru Izu ,  Shuichi Inoue ,  Takanori Matsumura

发明人： Katsumi Nagahori ,  Tohru Izu ,  Shuichi Inoue ,  Takanori Matsumura

IPC分类号： G05G1/50 ,  G05G1/44 ,  B60T7/06 ,  B21D53/88

CPC分类号： B60T7/06 ,  B21D53/88 ,  G05G1/50 ,  G05G1/506 ,  Y10T29/49826 ,  Y10T74/20528 ,  Y10T74/20888 ,  Y10T74/2168

摘要： A pedal arm provided with an arm main body has a first end portion, a second end portion, a pedal pad portion, and a shaft portion. The arm main body includes a first wall portion and a second wall portion in a first direction, and a third wall portion and a fourth wall portion in a second direction. One of the first wall portion and the second wall portion includes an abutting portion where the first end portion and the second end portion contacts, and the third wall portion and the fourth wall portion include a first curved portion and a second curved portion. A first depressed wall portion and a second depressed wall portion are formed on the first curved portion and the second curved portion, which are formed in inward convex shapes, respectively, and parts of the first depressed wall portion and the second depressed wall portion contact.

摘要翻译： 设置有臂主体的踏板臂具有第一端部，第二端部，踏板垫部分和轴部分。 臂主体包括在第一方向上的第一壁部分和第二壁部分，以及在第二方向上的第三壁部分和第四壁部分。 第一壁部和第二壁部中的一个包括第一端部和第二端部接触的抵接部，第三壁部和第四壁部包括第一弯曲部和第二弯曲部。 第一凹陷壁部分和第二凹陷壁部分分别形成在形成为内凸形的第一弯曲部分和第二弯曲部分上，并且第一凹陷壁部分和第二凹陷壁部分的部分接触。

公开(公告)号：US20100065599A1

公开(公告)日：2010-03-18

申请号：US11915894

申请日：2006-05-26

申请人： Yuki Nishisaka ,  Kenji Otoda ,  Shuichi Inoue ,  Toru Kumagai

发明人： Yuki Nishisaka ,  Kenji Otoda ,  Shuichi Inoue ,  Toru Kumagai

IPC分类号： B26F3/00 ,  B26D3/08 ,  B31B1/25

CPC分类号： C03B33/033 ,  B28D1/222 ,  B28D5/0011 ,  B28D5/0023 ,  B28D5/0029 ,  B65G2249/04 ,  Y02P40/57 ,  Y10T83/0333 ,  Y10T225/30 ,  Y10T225/325

摘要： A brittle material substrate cutting method and cutting apparatus are provided, which prevent cut faces of a brittle material substrate from contacting each other after the cutting in a break step of continuously cutting the brittle material substrate, so that a damage or contamination on the brittle material substrate due to the contact can be prevented. A brittle material substrate cutting apparatus includes: a cutting section (112, 122) for applying a pressing force in a vicinity of a scribe line S formed on a substrate G and cutting the pressed portion of the substrate G; and a holding section moving parallel to the scribe line S while holding the cutting section. The brittle material substrate cutting apparatus continuously cuts the substrate G along the scribe line S. The brittle material substrate cutting apparatus further includes: a cut-face separating section (113, 123), provided in the holding section, for holding and pressing at least one part of cut substrate portions of the substrate G, wherein the cut substrate portions are generated as a result of the cutting and they oppose each other, and moving cut faces of the cut substrate portions approximately parallel to a main face of the substrate G and in directions to separate the cut faces from each other.

摘要翻译： 提供了一种脆性材料基板切割方法和切割装置，其在连续切割脆性材料基板的断裂步骤中，在脆性材料基板的切割面彼此接触之后彼此接触，从而对脆性材料造成损坏或污染 可以防止由于接触引起的基板。 脆性材料基板切割装置包括：切割部分，用于在形成在基板G上的划线S附近施加按压力，并切割基板G的按压部分; 以及在保持切割部的同时平行于划线S移动的保持部。 脆性材料基板切断装置沿着切割线S连续地切断基板G.脆性材料基板切断装置还具备：切割面分离部（113,123），设置在保持部中，用于至少保持和按压 衬底G的切割衬底部分的一部分，其中由于切割而产生切割的衬底部分并且它们彼此相对，并且将切割的衬底部分的切割面大致平行于衬底G的主面移动;以及 在将切割面彼此分开的方向上。

公开(公告)号：US07256345B2

公开(公告)日：2007-08-14

申请号：US10572952

申请日：2004-09-28

申请人： Shuichi Inoue

发明人： Shuichi Inoue

IPC分类号： H01B7/00 ,  H01B7/34

CPC分类号： H01B7/00 ,  B32B15/02 ,  B32B15/06 ,  B32B25/00 ,  B32B25/02 ,  B32B25/042 ,  B32B2250/42 ,  B32B2250/44 ,  B32B2264/105 ,  B32B2307/202 ,  B32B2307/546 ,  B32B2457/00 ,  H05K1/118 ,  H05K3/4611 ,  H05K2201/0314

摘要： A cable 1 is configured of connecting portions 12 on both ends for connecting to external connecting terminals and an intermediate portion 13. Each connecting portion 12 has electroconductive portions 14 for connecting with external connecting terminals. The cable 1 is formed by layering multiple elastomer sheets 1H. Each elastomer sheet 1H is formed with an elastomer raw material having no electroconductivity as a base, with rectangular elastomer regions 1T having electroconductivity on both ends and transmission paths for connecting the rectangular elastomer regions 1T on both ends.

摘要翻译： 电缆1由两端的连接部分12构成，用于连接到外部连接端子和中间部分13。 每个连接部分12具有用于与外部连接端子连接的导电部分14。 电缆1通过层叠多个弹性体片材H 1而形成。每个弹性体片材H1形成有不具有导电性的弹性体原料作为基底，在两端具有导电性的矩形弹性体区域1T和用于连接矩形的传输路径 两端的弹性体区域1T。

公开(公告)号：US20070051769A1

公开(公告)日：2007-03-08

申请号：US10554855

申请日：2004-04-27

申请人： Kenji Otoda ,  Shuichi Inoue

发明人： Kenji Otoda ,  Shuichi Inoue

IPC分类号： B26F3/00

CPC分类号： C03B33/093 ,  C03B33/027 ,  C03B33/03 ,  C03B33/033 ,  C03B33/07 ,  G02F1/133351 ,  Y10T225/12

摘要： A brittle substrate cutting system according to the present invention includes a scribing apparatus including a scribing line forming means for forming a scribing line on a first surface of a brittle substrate; and a breaking apparatus for breaking the brittle substrate along the scribing line, wherein the breaking apparatus includes a first pressing controlling means for moving a pressing force upon a second surface of the brittle substrate opposing the first surface of the brittle substrate along the scribing line while the first surface of the brittle substrate is held.

摘要翻译： 根据本发明的脆性基材切割系统包括划线装置，其包括用于在脆性基板的第一表面上形成划线的划线生成装置; 以及用于沿着划刻线破坏脆性基板的断开装置，其中断开装置包括第一按压控制装置，用于沿着划线在与脆性基板的第一表面相对的脆性基板的第二表面上移动挤压力，同时 脆性基板的第一表面被保持。

公开(公告)号：US5517212A

公开(公告)日：1996-05-14

申请号：US284243

申请日：1994-08-02

申请人： Shuichi Inoue

发明人： Shuichi Inoue

IPC分类号： G09G3/36 ,  H04N5/57 ,  H04N5/66 ,  G09G5/00

CPC分类号： G09G3/36

摘要： A contrast adjustment circuit for a liquid crystal display which is connected, when to be used, to an electronic apparatus such as a computer. The contrast adjustment circuit comprises an adjustment voltage supply circuit provided in an electronic apparatus, a reference voltage generation circuit provided in the liquid crystal display for generating a reference voltage substantially equal in absolute value to a contrast peak voltage of the liquid crystal display, and an operational amplifier for comparing the reference voltage and an adjustment voltage and supplying a voltage difference between the reference voltage and the adjustment voltage to a driving voltage input terminal of the liquid crystal display.

摘要翻译： 一种用于液晶显示器的对比度调节电路，其被连接到诸如计算机的电子设备上。 对比度调整电路包括设置在电子设备中的调整电压供给电路，设置在液晶显示器中的参考电压产生电路，用于产生与液晶显示器的对比度峰值电压绝对值基本相等的参考电压，以及 运算放大器，用于比较参考电压和调整电压，并将参考电压和调整电压之间的电压差提供给液晶显示器的驱动电压输入端。

公开(公告)号：US5467811A

公开(公告)日：1995-11-21

申请号：US167803

申请日：1993-12-16

申请人： Toshiyuki Suehiro ,  Shinichi Teraoka ,  Eiichiro Ishimaru ,  Yoshimori Fukuda ,  Shuichi Inoue

发明人： Toshiyuki Suehiro ,  Shinichi Teraoka ,  Eiichiro Ishimaru ,  Yoshimori Fukuda ,  Shuichi Inoue

IPC分类号： B22D11/06 ,  C21D8/02 ,  B22D11/16 ,  B22D11/00

CPC分类号： B22D11/0622 ,  C21D8/0205 ,  Y10T29/49991

摘要： An austenitic stainless steel sheet is produced by a twin-roll synchronous continuous casting process wherein the sheet has a Ni segregation ratio in the vicinity of its center section of 0.90 or more and .delta.Fe.sub.cal. (mass %) is 6 mass % or more. Ni segregation ratio is defined by the formula: {average Ni content of the segregated portion (%) }/{average Ni content of the cast sheet (%)}; where Ni content is expressed in % by mass. .delta.-Fe.sub.cal. (mass %) is defined by the formula: 3(Cr+1.5 Si+Mo+0.5 Nb)-2.8(Ni+0.5 Cu+0.5 Mn+30 C+30 N)-19.8; wherein the chemical elements are given in % by mass.

摘要翻译： PCT No.PCT / JP93 / 00496 Sec。 371日期：1993年12月16日 102（e）日期1993年12月16日PCT提交1993年4月16日PCT公布。 出版物WO93 / 20966 日期为1993年10月28日。奥氏体不锈钢板通过双辊同步连续铸造方法制造，其中片材在其中心部分附近的Ni偏析比为0.90以上和δ粪便。 （质量％）为6质量％以上。 Ni偏析比由下式定义：{偏析部分的平均Ni含量（％）} / {铸片的平均Ni含量（％）}; 其中Ni含量以质量％表示。 三角洲。 （质量％）由下式定义：3（Cr + 1.5 Si + Mo + 0.5 Nb）-2.8（Ni + 0.5 Cu + 0.5 Mn + 30 C + 30 N）-19.8; 其中所述化学元素以质量％计。

公开(公告)号：US20110287341A1

公开(公告)日：2011-11-24

申请号：US12989103

申请日：2009-04-23

申请人： Shuichi Inoue ,  Hidemasa Nonaka ,  Satoru Uenoyama

发明人： Shuichi Inoue ,  Hidemasa Nonaka ,  Satoru Uenoyama

IPC分类号： H01M4/86

CPC分类号： H01M8/1206 ,  H01M4/9033 ,  H01M8/0217 ,  H01M8/0228 ,  H01M8/0258 ,  H01M8/0273 ,  H01M8/0297 ,  H01M8/1231 ,  H01M8/2432 ,  H01M8/2457 ,  Y02E60/521 ,  Y02E60/525

摘要： [OBJECT] In an SOFC cell comprising a Cr-containing alloy or the like and an air electrode bonded together, the invention is to provide a cell capable of effectively restricting occurrence of Cr poisoning of the air electrode and capable also of effectively restricting occurrence of oxidation deterioration due to Cr depletion in the alloy or the like.[SOLUTION] In a cell for a solid oxide fuel cell (SOFC) comprising a Cr (chrome)-containing alloy or oxide and an air electrode bonded together, wherein on the surface of the alloy or oxide, there is formed a coating layer containing a spinel oxide comprised of a first mono metal oxide and a second mono metal oxide, the first mono metal oxide having an equilibrium dissociated oxygen partial pressure at 750° C. ranging from 1.83×10−20 to 3.44×10−13 atm., the second mono metal oxide having a lower equilibrium dissociated oxygen partial pressure at 750° C. than the first mono metal oxide.

摘要翻译： [对象]在包含含Cr合金等的SOFC电池和连接在一起的空气电极的本发明中，本发明提供能够有效地限制空气电极的Cr中毒的发生的电池，并且还能够有效地限制 由于合金等中的Cr的消耗而导致的氧化劣化。 [解决方案]在包含Cr（铬）的合金或氧化物的固体氧化物燃料电池（SOFC）和结合在一起的空气电极的电池中，其中在合金或氧化物的表面上形成包含 由第一单金属氧化物和第二单金属氧化物构成的尖晶石氧化物，所述第一单金属氧化物在750℃的平衡解离氧分压为1.83×10-20至3.44×10-13atm。 第二单金属氧化物在750℃下的平衡解离氧分压比第一单金属氧化物低。