公开(公告)号：USD639497S1

公开(公告)日：2011-06-07

申请号：US29377971

申请日：2010-10-28

申请人： Kozo Ogawa ,  Toshiya Tanaka ,  Asuka Wada ,  Junichiro Yamamoto

设计人： Kozo Ogawa ,  Toshiya Tanaka ,  Asuka Wada ,  Junichiro Yamamoto

公开(公告)号：US20110074290A1

公开(公告)日：2011-03-31

申请号：US12885849

申请日：2010-09-20

申请人： MAKOTO SAKAI ,  Masao Segawa ,  Nubuo Shibano ,  Kiyoshi Nishimura ,  Kozo Ogawa ,  Masahiko Kamata ,  Toshiya Tanaka ,  Miho Watanabe ,  Shuhei Matsuda

发明人： MAKOTO SAKAI ,  Masao Segawa ,  Nubuo Shibano ,  Kiyoshi Nishimura ,  Kozo Ogawa ,  Masahiko Kamata ,  Toshiya Tanaka ,  Miho Watanabe ,  Shuhei Matsuda

IPC分类号： F21V23/00

CPC分类号： F21V29/507 ,  F21K9/232 ,  F21V3/04 ,  F21V29/506 ,  F21V29/89 ,  F21Y2107/00 ,  F21Y2107/40 ,  F21Y2115/10

摘要： A self-ballasted lamp includes: a base body; a light-emitting module and a globe which are provided at one end side of the base body; a cap provided at the other end side of the base body; and a lighting circuit housed between the base body and the cap. The light-emitting module has light-emitting portions each using a semiconductor light-emitting element, and a support portion projected at one end side of the base body, and the light-emitting portions are disposed at least on a circumferential surface of the support portion. A light-transmissive member is interposed between the light-emitting module and an inner face of the globe.

摘要翻译： 自镇流灯包括：基体; 发光模块和球体，其设置在所述基体的一端侧; 设置在所述基体的另一端侧的盖; 以及容纳在基体和盖之间的照明电路。 发光模块具有各自使用半导体发光元件的发光部和在基体的一端侧突出的支撑部，发光部至少设置在支撑体的周面上 一部分。 在发光模块和球体的内表面之间插入透光构件。

公开(公告)号：US08740422B2

公开(公告)日：2014-06-03

申请号：US13598756

申请日：2012-08-30

申请人： Toshiya Tanaka ,  Kozo Ogawa ,  Yoshihiro Nomura ,  Kunihiko Ikada

发明人： Toshiya Tanaka ,  Kozo Ogawa ,  Yoshihiro Nomura ,  Kunihiko Ikada

IPC分类号： F21V29/00

CPC分类号： F21V29/763 ,  F21K9/233 ,  F21K9/238 ,  F21V23/006 ,  F21V29/70 ,  F21V29/83 ,  F21Y2115/10

摘要： In a bulb and a luminaire according to one embodiment, plural fins for thermal radiation are provided on the outer circumferential surface of a main body in which a lighting circuit is attached, a light-emitting module is attached to a module attaching section integrated with the front of the main body, and a cylindrical section that surrounds the light-emitting module is protrudingly provided on a light extracting side.

摘要翻译： 在根据一个实施例的灯泡和照明装置中，在安装有照明电路的主体的外周面上设置有用于热辐射的多个散热片，发光模块附接到与 并且在光提取侧突出设置围绕发光模块的圆筒部。

公开(公告)号：US08690392B2

公开(公告)日：2014-04-08

申请号：US13470593

申请日：2012-05-14

申请人： Kozo Ogawa ,  Kiyoshi Nishimura ,  Nobuhiko Betsuda ,  Hiroki Tamai ,  Akiko Saito

发明人： Kozo Ogawa ,  Kiyoshi Nishimura ,  Nobuhiko Betsuda ,  Hiroki Tamai ,  Akiko Saito

IPC分类号： F21V29/00

CPC分类号： F21K9/00 ,  F21S2/005 ,  F21V17/12 ,  F21V19/0035 ,  F21V19/0055 ,  F21V23/005 ,  F21V29/505 ,  F21V29/507 ,  F21V29/713 ,  F21V29/74 ,  F21Y2105/10 ,  F21Y2113/00 ,  F21Y2115/10 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： The light source unit is provided with a substrate and a decorative cover having thermal conductivity. The substrate includes a circuit pattern area, in which a plurality of LED chips are disposed, at the middle part thereof, has thermal conductivity, and transmits heat from the circuit pattern area to an area in the outer circumferential direction thereof. The decorative cover encloses the substrate, is electrically insulated from the circuit pattern area, and is thermally coupled to the surface side of the substrate at the periphery of the circuit pattern area by being face-contacted thereto. Heat of the substrate can be radiated by the decorative cover while securing an electric insulation property with respect to the circuit pattern area.

摘要翻译： 光源单元设置有基板和具有导热性的装饰盖。 基板包括在其中间部分设置有多个LED芯片的电路图形区域，具有导热性，并且将热量从电路图案区域传递到其外周方向的区域。 装饰盖包围基板，与电路图形区域电绝缘，并且通过与电路图形区域的周边面接触而与基板的表面侧热耦合。 可以通过装饰盖辐射基板的热量，同时确保相对于电路图案区域的电绝缘性能。

公开(公告)号：US08197086B2

公开(公告)日：2012-06-12

申请号：US12623906

申请日：2009-11-23

申请人： Hiroaki Watanabe ,  Erika Takenaka ,  Kozo Ogawa ,  Keiichi Shimizu ,  Tatsuo Maruyama

发明人： Hiroaki Watanabe ,  Erika Takenaka ,  Kozo Ogawa ,  Keiichi Shimizu ,  Tatsuo Maruyama

IPC分类号： F21V29/00

CPC分类号： F21V29/75 ,  F21S4/28 ,  F21S8/04 ,  F21V29/745 ,  F21V29/763 ,  F21V29/89 ,  F21Y2101/00 ,  F21Y2115/10

摘要： A lighting fixture includes a light-emitting section composed of a plurality of semiconductor light-emitting devices arranged separated from one another on a planar substrate and a lighting control section configured to control lighting of the semiconductor light-emitting devices of the light-emitting section. The light-emitting section is attached at a front of a fixture main body, and a convection generation section configured to generate convection is provided at a back of the fixture main body. The convection generation section generates convection and promotes heat radiation. With the configuration, even if the lighting fixture is installed to abut on a ceiling surface, the effect of radiating heat generated by the semiconductor light-emitting devices can be ensured.

摘要翻译： 照明器具包括由在平面基板上彼此分离的多个半导体发光器件组成的发光部分和被配置为控制发光部分的半导体发光器件的点亮的点亮控制部分 。 发光部分安装在灯具主体的前部，并且在夹具主体的后部设置有构造成产生对流的对流发生部。 对流产生部产生对流并促进热辐射。 通过该结构，即使照明器具被安装成抵靠在天花板表面上，也能够确保由半导体发光元件产生的散热效果。

公开(公告)号：US20110175548A1

公开(公告)日：2011-07-21

申请号：US13005591

申请日：2011-01-13

申请人： Kiyoshi NISHIMURA ,  Kozo Ogawa ,  Soichi Shibusawa

发明人： Kiyoshi NISHIMURA ,  Kozo Ogawa ,  Soichi Shibusawa

IPC分类号： H05B37/02

CPC分类号： H05K1/0216 ,  F21K9/00 ,  F21V19/0055 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2924/3011 ,  H05B33/0803 ,  H05K1/162 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to one embodiment, a lighting apparatus includes a conductive main body at a ground potential, a light-emitting device in the main body, including an insulative substrate, a plurality of light-emitting elements mounted on a front side of the substrate, a power feeding wiring electrically connecting the light-emitting elements, and a conductor layer on a backside of the substrate, electrically connected to the power feeding wiring at a potential higher than a ground potential, and a lighting control device configured to supply power to the light-emitting device.

摘要翻译： 根据一个实施例，照明装置包括接地电位的导电主体，主体中的发光装置，包括绝缘基板，安装在基板的前侧的多个发光元件， 电连接发光元件的馈电布线以及与基底电位相比电连接到馈电布线的衬底背面的导体层;以及照明控制装置，被配置为向光提供电力 设备。

公开(公告)号：USD624887S1

公开(公告)日：2010-10-05

申请号：US29358967

申请日：2010-04-02

申请人： Akimichi Takahashi ,  Kazuto Morikawa ,  Yusuke Shibahara ,  Kozo Ogawa

设计人： Akimichi Takahashi ,  Kazuto Morikawa ,  Yusuke Shibahara ,  Kozo Ogawa

公开(公告)号：US20100149783A1

公开(公告)日：2010-06-17

申请号：US12634710

申请日：2009-12-10

申请人： Erika TAKENAKA ,  Kozo Ogawa ,  Keiichi Shimizu ,  Hiroaki Watanabe ,  Akimichi Takahashi ,  Shinji Nogi ,  Shinichi Kumashiro

发明人： Erika TAKENAKA ,  Kozo Ogawa ,  Keiichi Shimizu ,  Hiroaki Watanabe ,  Akimichi Takahashi ,  Shinji Nogi ,  Shinichi Kumashiro

IPC分类号： F21V9/16

CPC分类号： F21K9/00 ,  F21K9/232 ,  F21K9/64 ,  F21V3/00 ,  F21V9/30 ,  F21V29/502 ,  F21V29/70 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light-emitting module includes at least one light-emitting element provided on a mount surface of a substratum. A translucent member is provided so as to face the mount surface of the substratum. The translucent member is separated from the light-emitting element and contains a phosphor material that converts a wavelength of light emitted by the light-emitting element. A frame having heat conducting properties is interposed between the substratum and the translucent member. The frame surrounds the light-emitting element. The frame includes an opening that leads light emitted by the light-emitting element to the translucent member, and a heat conductor thermally connected to the translucent member. The heat conductor includes a heat radiator exposed outside of the translucent member.

摘要翻译： 发光模块包括设置在基底的安装表面上的至少一个发光元件。 提供半透明构件以面对底层的安装表面。 半透明构件与发光元件分离并且包含转换由发光元件发射的光的波长的荧光体材料。 具有导热性的框架插入在基底和半透明构件之间。 框架围绕发光元件。 框架包括将由发光元件发射的光引导到半透明构件的开口，以及热连接到半透明构件的热导体。 热导体包括暴露在半透明构件外部的散热器。

公开(公告)号：US08678618B2

公开(公告)日：2014-03-25

申请号：US12885849

申请日：2010-09-20

申请人： Makoto Sakai ,  Masao Segawa ,  Nobuo Shibano ,  Kiyoshi Nishimura ,  Kozo Ogawa ,  Masahiko Kamata ,  Toshiya Tanaka ,  Miho Watanabe ,  Shuhei Matsuda

发明人： Makoto Sakai ,  Masao Segawa ,  Nobuo Shibano ,  Kiyoshi Nishimura ,  Kozo Ogawa ,  Masahiko Kamata ,  Toshiya Tanaka ,  Miho Watanabe ,  Shuhei Matsuda

IPC分类号： F21V29/00

CPC分类号： F21V29/507 ,  F21K9/232 ,  F21V3/04 ,  F21V29/506 ,  F21V29/89 ,  F21Y2107/00 ,  F21Y2107/40 ,  F21Y2115/10

摘要： A self-ballasted lamp includes: a base body; a light-emitting module and a globe which are provided at one end side of the base body; a cap provided at the other end side of the base body; and a lighting circuit housed between the base body and the cap. The light-emitting module has light-emitting portions each using a semiconductor light-emitting element, and a support portion projected at one end side of the base body, and the light-emitting portions are disposed at least on a circumferential surface of the support portion. A light-transmissive member is interposed between the light-emitting module and an inner face of the globe.

摘要翻译： 自镇流灯包括：基体; 发光模块和球体，其设置在所述基体的一端侧; 设置在所述基体的另一端侧的盖; 以及容纳在基体和盖之间的照明电路。 发光模块具有各自使用半导体发光元件的发光部和在基体的一端侧突出的支撑部，发光部至少设置在支撑体的周面上 一部分。 在发光模块和球体的内表面之间插入透光构件。

公开(公告)号：US20110291594A1

公开(公告)日：2011-12-01

申请号：US13063871

申请日：2010-02-19

申请人： Toshiya Tanaka ,  Keiichi Shimizu ,  Takumi Suwa ,  Makoto Sakai ,  Kozo Ogawa ,  Sigeru Osawa ,  Takeshi Hisayasu ,  Hitoshi Kawano

发明人： Toshiya Tanaka ,  Keiichi Shimizu ,  Takumi Suwa ,  Makoto Sakai ,  Kozo Ogawa ,  Sigeru Osawa ,  Takeshi Hisayasu ,  Hitoshi Kawano

IPC分类号： H05B37/02 ,  F21V15/00

CPC分类号： F21V19/0005 ,  F21K9/20 ,  F21S8/04 ,  F21V11/06 ,  F21V17/12 ,  F21V17/14 ,  F21V29/507 ,  F21V29/70 ,  F21V29/773 ,  F21Y2103/33 ,  F21Y2115/10

摘要： In a lamp device 12 using a GX53-type cap 31 and also using an LED 56 as a light source, there is regulated an appropriate configuration of a metallic cover 32. A cap 31 and a lighting device 36 are arranged on an upper surface side of the metallic cover 32, and a substrate 33 on which the LED 56 is mounted is arranged on a lower surface side thereof. The metallic cover 32 has an approximately cylindrical shape with a maximum outer diameter D of 80 to 150 mm, a height H of 5 to 25 mm, and 2π (D/2) H/W, that is, an area of the outer peripheral surface per gross input power W to the lamp device 12 being in a range of 200 to 800 mm2/W. The gross input power W is 5 to 20 W.

摘要翻译： 在使用GX53型盖31并且还使用LED56作为光源的灯装置12中，调节金属盖32的适当构造。帽31和照明装置36布置在上表面侧 的金属盖32和其上安装有LED 56的基板33布置在其下表面侧。 金属盖32具有近似圆筒形状，最大外径D为80至150mm，高度H为5至25mm，2＆pgr; （D / 2）H / W，即，对于灯装置12的总输入功率W的外周面的面积在200〜800mm 2 / W的范围内。 总输入功率W为5〜20W。