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公开(公告)号：US20110074290A1
公开(公告)日：2011-03-31
申请号：US12885849
申请日：2010-09-20
申请人： MAKOTO SAKAI , Masao Segawa , Nubuo Shibano , Kiyoshi Nishimura , Kozo Ogawa , Masahiko Kamata , Toshiya Tanaka , Miho Watanabe , Shuhei Matsuda
发明人： MAKOTO SAKAI , Masao Segawa , Nubuo Shibano , Kiyoshi Nishimura , Kozo Ogawa , Masahiko Kamata , Toshiya Tanaka , Miho Watanabe , Shuhei Matsuda
IPC分类号： F21V23/00
CPC分类号： F21V29/507 , F21K9/232 , F21V3/04 , F21V29/506 , F21V29/89 , F21Y2107/00 , F21Y2107/40 , F21Y2115/10
摘要： A self-ballasted lamp includes: a base body; a light-emitting module and a globe which are provided at one end side of the base body; a cap provided at the other end side of the base body; and a lighting circuit housed between the base body and the cap. The light-emitting module has light-emitting portions each using a semiconductor light-emitting element, and a support portion projected at one end side of the base body, and the light-emitting portions are disposed at least on a circumferential surface of the support portion. A light-transmissive member is interposed between the light-emitting module and an inner face of the globe.
摘要翻译： 自镇流灯包括：基体; 发光模块和球体，其设置在所述基体的一端侧; 设置在所述基体的另一端侧的盖; 以及容纳在基体和盖之间的照明电路。 发光模块具有各自使用半导体发光元件的发光部和在基体的一端侧突出的支撑部，发光部至少设置在支撑体的周面上 一部分。 在发光模块和球体的内表面之间插入透光构件。
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2.发明授权Self-ballasted lamp having a light-transmissive member in contact with light emitting elements and lighting equipment incorporating the same 失效具有与发光元件接触的透光构件的自镇流灯和包含该发光元件的照明设备公开(公告)号：US08678618B2
公开(公告)日：2014-03-25
申请号：US12885849
申请日：2010-09-20
申请人： Makoto Sakai , Masao Segawa , Nobuo Shibano , Kiyoshi Nishimura , Kozo Ogawa , Masahiko Kamata , Toshiya Tanaka , Miho Watanabe , Shuhei Matsuda
发明人： Makoto Sakai , Masao Segawa , Nobuo Shibano , Kiyoshi Nishimura , Kozo Ogawa , Masahiko Kamata , Toshiya Tanaka , Miho Watanabe , Shuhei Matsuda
IPC分类号： F21V29/00
CPC分类号： F21V29/507 , F21K9/232 , F21V3/04 , F21V29/506 , F21V29/89 , F21Y2107/00 , F21Y2107/40 , F21Y2115/10
摘要： A self-ballasted lamp includes: a base body; a light-emitting module and a globe which are provided at one end side of the base body; a cap provided at the other end side of the base body; and a lighting circuit housed between the base body and the cap. The light-emitting module has light-emitting portions each using a semiconductor light-emitting element, and a support portion projected at one end side of the base body, and the light-emitting portions are disposed at least on a circumferential surface of the support portion. A light-transmissive member is interposed between the light-emitting module and an inner face of the globe.
摘要翻译： 自镇流灯包括：基体; 发光模块和球体，其设置在所述基体的一端侧; 设置在所述基体的另一端侧的盖; 以及容纳在基体和盖之间的照明电路。 发光模块具有各自使用半导体发光元件的发光部和在基体的一端侧突出的支撑部，发光部至少设置在支撑体的周面上 一部分。 在发光模块和球体的内表面之间插入透光构件。
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公开(公告)号：US20120307493A1
公开(公告)日：2012-12-06
申请号：US13496749
申请日：2011-02-17
申请人： Nobuhiko Betsuda , Kiyoshi Nishimura , Nobuo Shibano , Masao Segawa , Shuhei Matsuda , Soichi Shibusawa
发明人： Nobuhiko Betsuda , Kiyoshi Nishimura , Nobuo Shibano , Masao Segawa , Shuhei Matsuda , Soichi Shibusawa
CPC分类号： F21V3/00 , F21K9/23 , F21K9/232 , F21V23/002 , F21V29/677 , F21V29/713 , F21V29/77 , F21Y2107/40 , F21Y2115/10 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A lamp with ferrule 10 includes a substrate 12 in which a solid light-emitting device 11 is implemented on one surface side thereof; a thermal radiation member 14 which is fixed to the other surface side of the substrate 12 by a fluid fixing member 13 having thermal conductivity; a light-emitting portion 15 constituted by the substrate 12 and the thermal radiation member 14; a thermally conductive support member 17 which constitutes a three-dimensional light source body 16 using a plurality of light-emitting portions 15; a thermally conductive main body 18 which is provided with the support member 17 so as to project the three-dimensional light source body 16 to the one end portion side; and a ferrule member 19 that is provided on the other end portion side of the main body 18.
摘要翻译： 具有套圈10的灯具具有在其表面侧设置有固体发光元件11的基板12; 热辐射部件14，其通过具有导热性的流体固定部件13固定到基板12的另一个表面侧; 由基板12和热辐射部件14构成的发光部15; 构成使用多个发光部15的三维光源体16的导热性支撑构件17; 导热主体18，其设置有支撑部件17，以将三维光源体16突出到一个端部侧; 以及设置在主体18的另一端部侧的套圈构件19。
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公开(公告)号：US20130114253A1
公开(公告)日：2013-05-09
申请号：US13496681
申请日：2011-01-12
申请人： Masao Segawa , Nobuo Shibano , Nobuhiko Betsuda , Kiyoshi Nishimura , Kozo Ogawa
发明人： Masao Segawa , Nobuo Shibano , Nobuhiko Betsuda , Kiyoshi Nishimura , Kozo Ogawa
CPC分类号： F21V29/51 , F21K9/232 , F21K9/238 , F21V3/00 , F21V21/00 , F21V23/006 , F21V29/67 , F21V29/677 , F21V29/77 , F21Y2107/40 , F21Y2115/10
摘要： A bulb-type lamp includes a base body, a heat pipe, a light-emitting body, a cap and a lighting circuit. One end side of the heat pipe protrudes from one end side of the base body, and the other end side of the heat pipe is connected to the one end side of the base body. The light-emitting body includes plural LED elements, is connected to the one end side of the heat pipe, and is attached to the heat pipe to enable heat conduction. The cap is provided at the other end side of the base body. The lighting circuit is housed in the base body.
摘要翻译： 灯泡型灯包括基体，热管，发光体，帽和照明电路。 热管的一端侧从基体的一端侧突出，并且热管的另一端侧与基体的一端侧连接。 发光体包括多个LED元件，连接到热管的一端侧，并且附接到热管以实现热传导。 盖子设置在基体的另一端侧。 照明电路容纳在基体中。
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公开(公告)号：US08872198B2
公开(公告)日：2014-10-28
申请号：US13090645
申请日：2011-04-20
申请人： Soichi Shibusawa , Kiyoshi Nishimura , Kozo Ogawa , Nobuhiko Betsuda , Shuhei Matsuda , Masatoshi Kumagai
发明人： Soichi Shibusawa , Kiyoshi Nishimura , Kozo Ogawa , Nobuhiko Betsuda , Shuhei Matsuda , Masatoshi Kumagai
IPC分类号： H01L33/00 , H01L25/075 , F21V19/00 , F21K99/00 , H05K3/28 , F21Y101/02 , F21S8/04 , H01L33/50 , F21V23/06 , F21Y103/00 , H05K1/02
CPC分类号： F21V19/0055 , F21K9/20 , F21S8/04 , F21V23/06 , F21Y2103/10 , F21Y2115/10 , H01L25/0753 , H01L33/505 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2933/0041 , H05K1/0209 , H05K1/0289 , H05K3/284 , H05K2201/10106 , H01L2924/00014
摘要： According to one embodiment, the light-emitting apparatus is provided with a substrate, a plurality of light-emitting devices, and a phosphor layer. The plurality of light-emitting devices are mounted on the substrate. The phosphor layer is formed of a translucent resin containing a phosphor and includes a phosphor portion that is formed in a convex shape and covers a predetermined number of the light-emitting device. Bases of the adjacent phosphor portions are formed by being linked with one another.
摘要翻译： 根据一个实施例，发光装置设置有基板，多个发光装置和荧光体层。 多个发光装置安装在基板上。 荧光体层由含有荧光体的半透明树脂形成，并且包括形成为凸形并覆盖预定数量的发光器件的荧光体部分。 相邻的荧光体部分的基底通过彼此连接而形成。
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公开(公告)号：US20110254023A1
公开(公告)日：2011-10-20
申请号：US13090645
申请日：2011-04-20
申请人： Soichi SHIBUSAWA , Kiyoshi Nishimura , Kozo Ogawa , Nobuhiko Betsuda , Shuhei Matsuda , Masatoshi Kumagai
发明人： Soichi SHIBUSAWA , Kiyoshi Nishimura , Kozo Ogawa , Nobuhiko Betsuda , Shuhei Matsuda , Masatoshi Kumagai
IPC分类号： H01L27/15
CPC分类号： F21V19/0055 , F21K9/20 , F21S8/04 , F21V23/06 , F21Y2103/10 , F21Y2115/10 , H01L25/0753 , H01L33/505 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2933/0041 , H05K1/0209 , H05K1/0289 , H05K3/284 , H05K2201/10106 , H01L2924/00014
摘要： According to one embodiment, the light-emitting apparatus is provided with a substrate, a plurality of light-emitting devices, and a phosphor layer. The plurality of light-emitting devices are mounted on the substrate. The phosphor layer is formed of a translucent resin containing a phosphor and includes a phosphor portion that is formed in a convex shape and covers a predetermined number of the light-emitting device. Bases of the adjacent phosphor portions are formed by being linked with one another.
摘要翻译： 根据一个实施例，发光装置设置有基板，多个发光装置和荧光体层。 多个发光装置安装在基板上。 荧光体层由含有荧光体的半透明树脂形成，并且包括形成为凸形并覆盖预定数量的发光器件的荧光体部分。 相邻的荧光体部分的基底通过彼此连接而形成。
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公开(公告)号：US08232709B2
公开(公告)日：2012-07-31
申请号：US12909535
申请日：2010-10-21
CPC分类号： H01L33/641 , F21K9/00 , F21S8/02 , F21V17/12 , F21V23/00 , F21V29/75 , F21V29/76 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L2224/48091 , H01L2224/73265 , H01L2924/01322 , H05K1/0209 , H05K1/0306 , H05K2201/09136 , H05K2201/09781 , H01L2924/00014 , H01L2924/00
摘要： According to one embodiment, a light-emitting apparatus includes an insulating base made of ceramics, an obverse metallic component dividedly arranged on the front surface of the insulating base, semiconductor light-emitting elements mounted on the obverse metallic component, and a reverse metallic component arranged on a back surface of the insulating base and having a thickness same as or smaller than a thickness of the obverse metallic component and a volume equal to 50% or larger of a volume of the obverse metallic component.
摘要翻译： 根据一个实施例，一种发光装置包括由陶瓷制成的绝缘基底，分隔地布置在绝缘基底的前表面上的正面金属部件，安装在正面金属部件上的半导体发光元件和反向金属部件 布置在绝缘基底的背面上，其厚度等于或小于正金属成分的厚度，并且体积等于正面金属成分的体积的50％以上。
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公开(公告)号：US20110089805A1
公开(公告)日：2011-04-21
申请号：US12909535
申请日：2010-10-21
IPC分类号： F21V29/00
CPC分类号： H01L33/641 , F21K9/00 , F21S8/02 , F21V17/12 , F21V23/00 , F21V29/75 , F21V29/76 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L2224/48091 , H01L2224/73265 , H01L2924/01322 , H05K1/0209 , H05K1/0306 , H05K2201/09136 , H05K2201/09781 , H01L2924/00014 , H01L2924/00
摘要： According to one embodiment, a light-emitting apparatus includes an insulating base made of ceramics, an obverse metallic component dividedly arranged on the front surface of the insulating base, semiconductor light-emitting elements mounted on the obverse metallic component, and a reverse metallic component arranged on a back surface of the insulating base and having a thickness same as or smaller than a thickness of the obverse metallic component and a volume equal to 50% or larger of a volume of the obverse metallic component.
摘要翻译： 根据一个实施例，一种发光装置包括由陶瓷制成的绝缘基底，分隔地布置在绝缘基底的前表面上的正面金属部件，安装在正面金属部件上的半导体发光元件和反向金属部件 布置在绝缘基底的背面上，其厚度等于或小于正金属成分的厚度，并且体积等于正面金属成分的体积的50％以上。
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公开(公告)号：US08963190B2
公开(公告)日：2015-02-24
申请号：US13392107
申请日：2010-08-25
申请人： Ryotaro Matsuda , Kozo Ogawa , Makoto Sakai , Akiko Takahashi , Keiichi Shimizu , Kiyoshi Nishimura
发明人： Ryotaro Matsuda , Kozo Ogawa , Makoto Sakai , Akiko Takahashi , Keiichi Shimizu , Kiyoshi Nishimura
IPC分类号： H01L33/64 , F21V3/04 , F21S8/04 , F21V29/00 , F21Y101/02 , F21Y105/00
CPC分类号： H01L33/64 , F21S8/04 , F21V3/04 , F21V29/004 , F21Y2105/10 , F21Y2115/10 , H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light-emitting device includes a substrate having a front surface on which a semiconductor light-emitting element is mounted. A front cover is provided which thermally contacts the front surface of the substrate at a periphery of the semiconductor light-emitting element and is disposed on a front side of the substrate. A heat conduction path is formed along which heat generated by the semiconductor light-emitting element is conducted in order of the substrate and the front cover and the heat is radiated from a front surface of the front cover, so that a heat radiation property from a front surface of the light-emitting device is improved.
摘要翻译： 发光装置包括其上安装有半导体发光元件的正面的基板。 提供了一种前盖，其在半导体发光元件的周围与基板的前表面热接触并设置在基板的前侧。 形成热传导路径，沿着该热传导路径，由半导体发光元件产生的热量按照基板和前盖的顺序进行，并且热量从前盖的前表面辐射，使得来自 改善了发光装置的前表面。
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公开(公告)号：US20120161194A1
公开(公告)日：2012-06-28
申请号：US13392107
申请日：2010-08-25
申请人： Ryotaro Matsuda , Kozo Ogawa , Makoto Sakai , Akiko Takahashi , Keiichi Shimizu , Kiyoshi Nishimura
发明人： Ryotaro Matsuda , Kozo Ogawa , Makoto Sakai , Akiko Takahashi , Keiichi Shimizu , Kiyoshi Nishimura
IPC分类号： H01L33/64
CPC分类号： H01L33/64 , F21S8/04 , F21V3/04 , F21V29/004 , F21Y2105/10 , F21Y2115/10 , H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light-emitting device includes a substrate having a front surface on which a semiconductor light-emitting element is mounted. A front cover is provided which thermally contacts the front surface of the substrate at a periphery of the semiconductor light-emitting element and is disposed on a front side of the substrate. A heat conduction path is formed along which heat generated by the semiconductor light-emitting element is conducted in order of the substrate and the front cover and the heat is radiated from a front surface of the front cover, so that a heat radiation property from a front surface of the light-emitting device is improved.
摘要翻译： 发光装置包括其上安装有半导体发光元件的正面的基板。 提供了一种前盖，其在半导体发光元件的周围与基板的前表面热接触并设置在基板的前侧。 形成热传导路径，沿着该热传导路径，由半导体发光元件产生的热量按照基板和前盖的顺序进行，并且热量从前盖的前表面辐射，使得来自 改善了发光装置的前表面。
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