摘要:
An integrated semiconductor memory includes a memory cell field having memory cells disposed in matrix form, word lines and internal bit lines forming pairs of internal bit lines for triggering the memory cells. Internal weighting circuits are each assigned to a respective one of the internal bit line pairs. An external pair of bit lines is commonly assigned to the internal bit lines. Pairs of separation transistors are each assigned to a respective one of the internal bit line pairs for electrical separation of the respective internal bit line pair from the external pair of bit lines. A bit line decoder triggers the pairs of separation transistors. An external weighting circuit is provided. A discriminator device and a precharging device are connected to the external bit line pair. The internal bit lines of each pair of internal bit lines are triggered separately from one another. The internal bit lines of each pair of internal bit lines are connected to the external bit line pair separately from one another.
摘要:
A circuit for generating a reference voltage for the reading out from and the evaluation of read output signals which are read out with a constant plate voltage from storage cells of a ferroelectric memory via bit lines. In the circuit, a reference voltage device is formed of two reference cells that are subjected to the action of complementary signals. The reference cells can be simultaneously read out in order to generate the reference voltage in a selection and evaluation device.
摘要:
A memory configuration includes a plurality of resistive ferroelectric memory cells. Each of the memory cells includes a selection transistor and a storage capacitor. The selection transistor has a given zone of a first conductivity type. The storage capacitor has a first and a second electrode. The first electrode is supplied with a fixed cell plate voltage, the second electrode is connected to the given zone of the first conductivity type. A source and a drain of a MOS transistor are supplied with the fixed cell plate voltage. The channel of the MOS transistor has a channel length extending over at least two of the memory cells. The given zone of the first conductivity type is connected, via a resistor, to the channel of the MOS transistor such that the given zone is electrically connected to the first electrode of the storage capacitor via the resistor and the MOS transistor.
摘要:
An integrated buffer circuit includes a first series circuit connected between a first supply potential and a second supply potential (ground). The first series circuit has a voltage-controlled first constant current source, a first field effect transistor having a gate forming an input of the buffer circuit, a circuit node between the first current source and the first field effect transistor forming an output of the buffer circuit, and a first control input for controlling the first current source with a reference potential having a constant potential difference relative to the first supply potential. A second series circuit is connected between the first supply potential and the second supply potential. The second series circuit has a first resistor, a second constant current source furnishing a current being independent of the first supply potential, and a circuit node between the first resistor and the second current source, establishing the reference potential and being connected to the first control input of the first current source.
摘要:
A circuit is provided for the non-destructive, self-normalizing reading-out of MRAM memory cells. Accordingly, read currents of a memory cell are normalized by currents that are maintained at a voltage at which the size of these currents is independent of the cell content. The circuit has a simple construction and without great expenditure, permits the normalization of a read signal.
摘要:
A semiconductor circuit is disclosed which contains a driving circuit which is integrated into a semiconductor substrate of a first conductivity type and includes positive voltage switching transistors for switching positive and/or zero voltage levels and negative switching transistors for switching negative and/or zero voltage levels. In addition, the driving circuit contains a control circuit which is positioned upstream from the driving circuit and is also embodied in the semiconductor substrate, which is connected to a substrate voltage. A negative voltage switching transistor of the driving circuit is configured inside an outer well which is embedded in the semiconductor substrate and is of a second conductivity type which is opposite to the first, and the outer well is connected to a supply voltage.
摘要:
A configuration for self-referencing a ferroelectric memory cell reads out the ferroelectric memory cell successively while a bit line is precharged to two different, opposing voltages. The voltage values read out from the ferroelectric memory cell are temporarily stored respectively in a first and a second capacitor and then fed to an evaluator circuit.
摘要:
An evaluation configuration has a first MOS evaluation stage, an isolation stage, and a bipolar evaluation stage. The isolation stage is connected between the first MOS evaluation stage and the bipolar evaluation stage. The isolation stage isolates the first MOS evaluation stage from the bipolar evaluation stage. The evaluation configuration can reliably detect very small read signals and allows a high integration density.
摘要:
A memory configuration includes a plurality of resistive ferroelectric memory cells. Each of the resistive ferroelectric memory cells includes a selection transistor and a storage capacitor. The selection transistor has a given zone of a first conductivity type. The storage capacitor has a first electrode and a second electrode. The first electrode is supplied with a fixed cell plate voltage. The second electrode is connected to the given zone of the first conductivity type. A semiconductor body of a second conductivity type opposite the first conductivity type is provided. A line is formed by a highly doped zone of the first conductivity type. The line is supplied with the cell plate voltage. The second electrode of the storage capacitor is connected via the resistor to the line.