Display device using semiconductor light emitting device and method for manufacturing the same

    公开(公告)号:US11735701B2

    公开(公告)日:2023-08-22

    申请号:US17153592

    申请日:2021-01-20

    Abstract: Discussed are a display device and a method of manufacturing the same, and more particularly, to a display device including a semiconductor light emitting device having a size of several μm to several tens of μm and a method of manufacturing the same. The present disclosure provides a display device, including a base portion, a plurality of transistors disposed on the base portion, a plurality of semiconductor light emitting devices disposed on the base portion, a plurality of wiring electrodes disposed on the base portion, and electrically connected to the plurality of transistors and the plurality of semiconductor light emitting devices, a partition wall disposed on the base portion, and formed to cover the plurality of transistors, and a connection electrode connecting some of the plurality of transistors and some of the plurality of wiring electrodes, wherein the connection electrode is configured to pass through the partition wall.

    Method for manufacturing a compound semiconductor solar cell

    公开(公告)号:US10529874B2

    公开(公告)日:2020-01-07

    申请号:US15951379

    申请日:2018-04-12

    Abstract: According to an aspect of the present invention, there is provided a method for manufacturing a compound semiconductor solar cell, comprising: forming a sacrificial layer on one surface of a mother substrate; forming a compound semiconductor layer on the sacrificial layer; forming a first protective layer formed of a compound semiconductor on the compound semiconductor layer; depositing a second passivation layer on the first passivation layer; attaching a first lamination film on the second protective layer; separating the compound semiconductor layer, the first and second protective layers, and the first lamination film from the mother substrate by performing an ELO process to remove the sacrificial layer; forming a back electrode on the compound semiconductor layer; attaching a second lamination film on the back electrode; removing the first lamination film; removing the second protective layer; removing the first protective layer; and forming a front electrode on the compound semiconductor layer.

    Moving robot and control method thereof

    公开(公告)号:US10300596B2

    公开(公告)日:2019-05-28

    申请号:US15436189

    申请日:2017-02-17

    Abstract: A moving robot includes a main body, a drive assembly moving the main body, and a cleaner head performing cleaning on a cleaning area in which the main body is positioned, wherein the drive assembly includes a plurality of pulleys, a motor connected to any one of the plurality of pulleys and generating a driving force, a belt rotated in contact with the plurality of pulleys, and a support shaft connected to some of the plurality of pulleys and changing a position of the pulley such that an area in which the belt is in contact with a ground or an obstacle is maintained to be equal to or greater than a reference area.

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