公开(公告)号：US10530121B2

公开(公告)日：2020-01-07

申请号：US15488636

申请日：2017-04-17

Applicant: LG INNOTEK CO., LTD.

Inventor： Won Jin Kim ,  Ju Yeon Won ,  In Jae Lee

IPC: F21S41/16 ,  H01S5/00 ,  F21K9/64 ,  F21V9/08

Abstract: A lighting apparatus includes: a light source configured to generate laser beams; a light converter disposed in a direction in which the laser beams are emitted and configured to generate converted beams excited by the laser beams and transmitted beams of the laser beams; and a light housing disposed in front of the light converter, having an opening along a path of beam travel, and configured to adjust a light distribution of the converted beams.

公开(公告)号：US09810402B2

公开(公告)日：2017-11-07

申请号：US14621924

申请日：2015-02-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Jin Gyeong Park ,  Won Jin Kim ,  In Jae Lee

IPC: F21S8/10 ,  F21V9/16 ,  F21V9/08

CPC classification number: F21V9/30 ,  F21S41/14 ,  F21S41/147 ,  F21S41/155 ,  F21S41/16 ,  F21S41/30 ,  F21V9/08 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2924/00014

Abstract: Provided are a light conversion substrate intended for converting an excited beam into a conversion beam, and a light emitting package including the light conversion substrate, the light conversion substrate being implemented in a structure in which side parts of the light conversion substrate for converting a beam emitted from a light emitting element are formed to have different tapers so that uniform color distribution can be implemented all over the entire surface of the light conversion substrate upon packaging the light conversion substrate with the light emitting element.

公开(公告)号：US11535086B2

公开(公告)日：2022-12-27

申请号：US16471488

申请日：2017-12-05

Applicant: LG INNOTEK CO., LTD.

Inventor： Won Jin Kim ,  Dong Hwa Lee ,  In Jae Lee

IPC: B60H1/22 ,  H05B3/06 ,  H05B3/12 ,  H05B3/14 ,  H05B3/50

Abstract: According to one embodiment of the present invention, a heating rod comprises: a first thermal diffusion plate; a ceramic substrate arranged on the first thermal diffusion plate and having a heating element arranged therein; and a second thermal diffusion plate arranged on the ceramic substrate, wherein the first thermal diffusion plate and the second thermal diffusion plate are respectively stacked in a plurality of layers. Since the first thermal diffusion plate and the second thermal diffusion plate are stacked in the plurality of layers, a heating rod having a high thermal efficiency and being capable of fast heating and a vehicular heating device including the same can be obtained.

公开(公告)号：US11452179B2

公开(公告)日：2022-09-20

申请号：US16475902

申请日：2018-01-05

Applicant: LG INNOTEK CO., LTD.

Inventor： Dong Hwa Lee ,  In Seong Sohn ,  In Jae Lee

IPC: H05B3/03 ,  H05B3/48 ,  H05B3/50 ,  B60H1/00 ,  B60H1/22 ,  H05B1/02 ,  H05B3/46 ,  H05B3/18

Abstract: An embodiment discloses a heating rod comprising: a ceramic substrate; and a heat-radiating element that is arranged in the ceramic substrate, wherein the ratio of the thickness of the ceramic substrate to the thickness of the heat-radiating element is between 1:2 and 1:50. The embodiment discloses a heater comprising: a case; a heat-radiating module that is arranged inside the case; and a power module that is electrically connected to the heat-radiating module, wherein the power module includes a substrate part, a heat sink that is connected to the substrate part, and a ventilation part through which a fluid flows in and out to/from the heat sink.

公开(公告)号：US10928035B2

公开(公告)日：2021-02-23

申请号：US15629473

申请日：2017-06-21

Applicant: LG Innotek Co., Ltd.

Inventor： Won Jin Kim ,  Ju Yeon Won ,  In Jae Lee

IPC: F21V9/00 ,  F21S41/16 ,  F21V9/30 ,  F21S41/20 ,  F21S41/176 ,  F21V5/04

Abstract: Embodiments of the present invention relate to a phosphor plate and a lighting device including the phosphor plate, the phosphor plate according to an embodiment of the present invention has a light incident region on which light generated from a light source is incident and a light emitting region which converts a wavelength of the incident light and then outputs the light, wherein a ratio of a diameter of the light incident region and a diameter of the light emitting region ranges from 1:3 to 1:9.

公开(公告)号：US10527231B2

公开(公告)日：2020-01-07

申请号：US15773909

申请日：2016-11-04

Applicant: LG INNOTEK CO., LTD.

Inventor： Jin Gyeong Park ,  Won Jin Kim ,  In Jae Lee

IPC: H01L33/50 ,  F21K9/20 ,  H01L33/56 ,  F21S43/145 ,  F21S43/30 ,  H01L23/00 ,  H01L33/60 ,  F21S41/176 ,  F21Y115/15

Abstract: Embodiments of the present invention relate to a light emitting package having excellent light extraction efficiency and thermal stability, the light emitting package comprising: a light emitting unit; a photo-conversion substrate arranged on one surface of the light emitting unit; and an adhesive member arranged between the light emitting unit and the photo-conversion substrate, and comprising inorganic nanoparticles dispersed in a silicone-based resin.

公开(公告)号：US10333041B2

公开(公告)日：2019-06-25

申请号：US15746721

申请日：2016-07-21

Applicant: LG INNOTEK CO., LTD.

Inventor： In Jae Lee ,  Won Jin Kim

IPC: H01L33/62 ,  H01L33/36 ,  H01L33/50 ,  H01L33/64 ,  H01L33/58 ,  H01L25/07 ,  H01L25/16 ,  H01L25/075 ,  H01L33/56

Abstract: An integrated light-emitting package is provided for excellent light extraction efficiency and heat dissipation effect. The integrated light-emitting package includes: a light-emitting element layer including a plurality of light-emitting units arranged at predetermined intervals; an optical conversion substrate disposed along the upper portion of the light-emitting device layer; and a first adhesive member disposed in each gap between the light-emitting units.

公开(公告)号：US09911906B2

公开(公告)日：2018-03-06

申请号：US15019210

申请日：2016-02-09

Applicant: LG INNOTEK CO., LTD.

Inventor： Won Jin Kim ,  Jin Gyeong Park ,  In Jae Lee

IPC: H01L33/00 ,  H01L33/50 ,  H01L33/56 ,  H01L33/46

CPC classification number: H01L33/50 ,  H01L33/46 ,  H01L33/56 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A light emitting device package is provided. The light emitting device package may include a package body, a circuit pattern on the package body, a light emitting chip on the circuit pattern, a connector to connect the light emitting chip to the circuit pattern, a phosphor layer on the light emitting chip, and a first protective layer including a Group III nitride provided on the package body to cover the circuit pattern, the light emitting chip, and the connecting member.