Luminescence Sensor Using Multi-Layer Substrate Structure
    15.
    发明申请
    Luminescence Sensor Using Multi-Layer Substrate Structure 有权
    使用多层基板结构的发光传感器

    公开(公告)号:US20080197292A1

    公开(公告)日:2008-08-21

    申请号:US11995696

    申请日:2006-07-07

    IPC分类号: G01J1/58 C09K11/00

    摘要: The present invention provides a luminescence sensor (2), such as e.g. a luminescence biosensor, comprising a multi-layer structure. The multi-layer structure comprises at least a first layer (2a) formed of a first material and a second layer (2b) formed of a second material. The first material has a first binding capacity towards luminophores and the second material has a second binding capacity towards luminophores, the first binding capacity being different from the second binding capacity. The luminescence sensor (2) according to the present invention shows a high sensitivity because it provides preferred binding sites for luminophores at locations where the combined excitation and detection efficiency is the highest.

    摘要翻译: 本发明提供一种发光传感器(2),例如, 发光生物传感器,包括多层结构。 多层结构至少包括由第一材料形成的第一层(2a)和由第二材料形成的第二层(2b)。 第一材料具有朝向发光体的第一结合能力,第二材料具有朝向发光体的第二结合能力,第一结合能力不同于第二结合能力。 根据本发明的发光传感器(2)显示出高灵敏度,因为它在组合的激发和检测效率最高的位置处为发光体提供优选的结合位点。