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公开(公告)号：US09417389B2
公开(公告)日：2016-08-16
申请号：US14829260
申请日：2015-08-18
Applicant: Luxtera, Inc.
Inventor： Thierry Pinguet , Attila Mekis , Steffen Gloeckner
CPC classification number: G02B6/124 , G01J1/02 , G01J1/0425 , G02B6/12004 , G02B6/30 , G02B6/34 , G02B6/4208 , G02B2006/12038 , G02B2006/12061 , G02B2006/12104 , G02B2006/12157
Abstract: A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a silicon photonic chip through a light path in a region where silicon is removed from said silicon photonic chip, wherein photonic devices may be integrated in layers on a front surface of the silicon photonic chip. Optical couplers, such as grating couplers, may receive the optical signals in the front surface. The optical signals may be coupled into the back surface of the chips via optical fibers and/or optical source assemblies. The region where silicon may be removed from said silicon photonic chip may comprise silicon dioxide. The chip may be bonded to a second chip. Optical signals may be reflected back to the optical couplers via metal reflectors, which may be integrated in dielectric layers on the chips.
Abstract translation: 公开了一种用于将光信号耦合到硅光电芯片的方法和系统，并且可以包括通过在从硅光子芯片去除硅的区域中的光路将一个或多个光信号耦合到硅光子芯片的背表面中，其中 光子器件可以集成在硅光子芯片的前表面上的层中。 诸如光栅耦合器的光耦合器可以在前表面中接收光信号。 光信号可以经由光纤和/或光源组件耦合到芯片的后表面中。 硅可以从硅光子芯片去除的区域可以包括二氧化硅。 芯片可以结合到第二芯片。 光信号可以经由金属反射器反射回到光耦合器，金属反射器可以集成在芯片上的电介质层中。
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12.发明申请公开(公告)号：US20160119057A1
公开(公告)日：2016-04-28
申请号：US14925452
申请日：2015-10-28
Applicant: Luxtera, Inc.
Inventor： Attila Mekis , Peter De Dobbelaere , Lieven Verslegers , Peng Sun , Yannick De Koninck
IPC: H04B10/25 , H04B10/516
CPC classification number: H04B10/40 , H04B10/5053 , H04B10/506 , H04J14/02
Abstract: Methods and systems for silicon photonics wavelength division multiplexing transceivers are disclosed and may include, in a transceiver integrated in a silicon photonics chip: generating a first modulated output optical signal at a first wavelength utilizing a first electrical signal, generating a second modulated output optical signal at a second wavelength utilizing a second electrical signal, communicating the first and second modulated output optical signals into an optical fiber coupled to the chip utilizing a multiplexing grating coupler in the chip. A received input optical signal may be split into a modulated input optical signal at the first wavelength and a modulated input optical signal at the second wavelength utilizing a demultiplexing grating coupler in the chip. The first and second modulated input optical signals may be converted to first and second electrical input signals utilizing first and second photodetectors in the chip.
Abstract translation: 公开了硅光子学波分复用收发器的方法和系统，并且可以包括在集成在硅光子芯片中的收发器中：利用第一电信号产生第一波长的第一调制输出光信号，产生第二调制输出光信号 在利用第二电信号的第二波长处，利用芯片中的复用光栅耦合器将第一和第二调制输出光信号传送到耦合到芯片的光纤中。 接收到的输入光信号可以利用芯片中的解复用光栅耦合器分为第一波长的调制输入光信号和第二波长的调制输入光信号。 第一和第二调制输入光信号可以利用芯片中的第一和第二光电检测器转换成第一和第二电输入信号。
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13.发明申请公开(公告)号：US20190296826A1
公开(公告)日：2019-09-26
申请号：US16424142
申请日：2019-05-28
Applicant: Luxtera, Inc.
Inventor： Peter DeDobbelaere , Christopher Bergey , Attila Mekis
Abstract: Methods and systems for a bi-directional receiver for standard single-mode fiber based on grating couplers may include, in an integrated circuit, a multi-wavelength grating coupler, and first and second optical sources coupled to the integrated circuit: coupling first and second source optical signals at first and second wavelengths into the photonically-enabled integrated circuit using the first and second optical sources, where the second wavelength is different from the first wavelength, receiving a first optical data signal at the first wavelength from an optical fiber coupled to the multi-wavelength grating coupler, and receiving a second optical data signal at the second wavelength from the optical fiber. Third and fourth optical data signals at the first and second wavelengths may be communicated out of the optoelectronic transceiver via the multi-wavelength grating coupler.
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公开(公告)号：US10365447B2
公开(公告)日：2019-07-30
申请号：US15907543
申请日：2018-02-28
Applicant: Luxtera, Inc.
Inventor： Attila Mekis , Peter De Dobbelaere , Gianlorenzo Masini , Yannick De Koninck , Thierry Pinguet
Abstract: Methods and systems for a chip-on-wafer-on-substrate assembly are disclosed and may include in an optical communication system comprising an electronics die and a substrate. The electronics die is bonded to a first surface of a photonic interposer and the substrate is coupled to a second surface of the photonic interposer opposite to the first surface. An optical fiber and a light source assembly are coupled to the second surface of the interposer in one or more cavities formed in the substrate. A continuous wave (CW) optical signal may be received in the photonic interposer from the light source assembly, and a modulated optical signal may be communicated between the optical fiber and photonic interposer. The received CW optical signal may be coupled to an optical waveguide in the photonic interposer using a grating coupler.
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公开(公告)号：US10338309B2
公开(公告)日：2019-07-02
申请号：US14105328
申请日：2013-12-13
Applicant: Luxtera, Inc.
Inventor： Lieven Verslegers , Steffen Gloeckner , Adithyaram Narasimha , Attila Mekis
Abstract: Methods and systems for stabilized directional couplers are disclosed and may include a system comprising first and second directional couplers formed by first and second waveguides, where one of the waveguides may comprise a length extender between the directional couplers. The directional couplers may be formed by reduced spacing between the waveguides on opposite sides of the length extender. An input optical signal may be communicated into one of the waveguides, where at least a portion of the input optical signal may be coupled between the waveguides in the first directional coupler and at least a portion of the coupled optical signal may be coupled between the waveguides in the second directional coupler. Optical signals may be communicated out of the system with magnitudes at a desired percentage of the input optical signal. The length extender may add phase delay for signals in one of the first and second waveguides.
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Patent Agency Ranking
公开(公告)号：US20190170942A1
公开(公告)日：2019-06-06
申请号：US16268167
申请日：2019-02-05
Applicant: Luxtera, Inc.
Inventor： Roman Bruck , Attila Mekis
Abstract: Methods and systems for mode converters for grating couplers may include a photonic chip comprising a waveguide, a grating coupler, and a mode converter, with the waveguide being coupled to the grating coupler via the mode converter. The mode converter may include waveguide material and tapers defined by tapered regions, where the tapered regions do not have waveguide material. The photonic chip may receive an optical signal in the mode converter from the waveguide, where the received optical signal has a light profile that may be spatially deflected in the mode converter to configure a desired profile in the grating coupler. A long axis of the tapers may be parallel to a direction of travel of the optical signal. The long axis of the tapers may point towards the input waveguide of the grating couplers, which may be linear.
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公开(公告)号：US20190162988A1
公开(公告)日：2019-05-30
申请号：US16267545
申请日：2019-02-05
Applicant: Luxtera, Inc.
Inventor： Ali Ayazi , Gianlorenzo Masini , Subal Sahni , Attila Mekis , Thierry Pinguet
CPC classification number: G02F1/025 , G02F1/2257 , G02F2001/212 , G02F2201/06 , G02F2202/105
Abstract: Methods and systems for a low-parasitic silicon high-speed phase modulator are disclosed and may include in an optical phase modulator that comprises a PN junction waveguide formed in a silicon layer, wherein the silicon layer may be on an oxide layer and the oxide layer may be on a silicon substrate. The PN junction waveguide may have fingers of p-doped and n-doped regions on opposite sides along a length of the PN junction waveguide. Contacts may be formed on the fingers of p-doped and n-doped regions. The fingers of p-doped and n-doped regions may be arranged symmetrically about the PN junction waveguide or staggered along the length of the PN junction waveguide. Etch transition features may be removed along the p-doped and n-doped regions.
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公开(公告)号：US20190113822A1
公开(公告)日：2019-04-18
申请号：US16206749
申请日：2018-11-30
Applicant: Luxtera, Inc.
Inventor： Attila Mekis , Subal Sahni , Yannick De Koninck , Gianlorenzo Masini , Faezeh Gholami
Abstract: Methods and systems for a vertical junction high-speed phase modulator are disclosed and may include a semiconductor device having a semiconductor waveguide including a slab section, a rib section extending above the slab section, and raised ridges extending above the slab section on both sides of the rib section. The semiconductor device has a vertical pn junction with p-doped material and n-doped material arranged vertically with respect to each other in the rib and slab sections. The rib section may be either fully n-doped or p-doped in each cross-section along the semiconductor waveguide. Electrical connection to the p-doped and n-doped material may be enabled by forming contacts on the raised ridges, and electrical connection may be provided to the rib section from one of the contacts via periodically arranged sections of the semiconductor waveguide, where a cross-section of both the rib section and the slab section in the periodically arranged sections may be fully n-doped or fully p-doped.
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19.发明授权公开(公告)号：US10256908B2
公开(公告)日：2019-04-09
申请号：US14729826
申请日：2015-06-03
Applicant: Luxtera, Inc.
Inventor： Attila Mekis , Peter DeDobbelaere , Kosei Yokoyama , Sherif Abdalla , Steffen Gloeckner , John Guckenberger , Thierry Pinguet , Gianlorenzo Masini , Daniel Kucharski
IPC: H04B10/2575 , H04B10/40 , H01L21/84 , H01L27/12 , H01L27/06 , H01L25/16 , H01L25/065
Abstract: Methods and systems for monolithic integration of photonics and electronics in CMOS processes are disclosed and may include in an optoelectronic transceiver comprising photonic and electronic devices from two complementary metal-oxide semiconductor (CMOS) die with different silicon layer thicknesses for the photonic and electronic devices, the CMOS die bonded together by metal contacts: communicating optical signals and electronic signals to and from said optoelectronic transceiver utilizing a received continuous wave optical signal as a source signal. A first of the CMOS die includes the photonic devices and a second includes the electronic devices. Electrical signals may be communicated between electrical devices to the optical devices utilizing through-silicon vias coupled to the metal contacts. The metal contacts may include back-end metals from a CMOS process. The electronic and photonic devices may be fabricated on SOI wafers, with the SOI wafers being diced to form the CMOS die.
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20.发明申请公开(公告)号：US20190072716A1
公开(公告)日：2019-03-07
申请号：US16180725
申请日：2018-11-05
Applicant: Luxtera, Inc.
Inventor： Brian Welch , Attila Mekis , Steffen Gloeckner
CPC classification number: G02B6/12004 , G02B6/124 , G02B6/125 , G02B6/29386 , G02B6/4213 , G02B6/4215 , G02B6/4246 , G02B2006/12142 , H04B10/40 , H04B10/801 , H04J14/0256
Abstract: Methods and systems for partial integration of wavelength division multiplexing and bi-directional solutions are disclosed and may include, an optical transceiver on a silicon photonics integrated circuit coupled to a planar lightwave circuit (PLC). The silicon photonics integrated circuit may include a first modulator and first light source that operates at a first wavelength and a second modulator and second light source that operates at a second wavelength. The transceiver and PLC are operable to modulate a first continuous wave (CW) optical signal from the first light source utilizing the first modulator and modulate a second CW optical signal from the second light source utilizing the second modulator. The modulated signals may be communicated from the modulators to the PLC utilizing a first pair of grating couplers in the IC and combined in the PLC.
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