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公开(公告)号：US10560197B2
公开(公告)日：2020-02-11
申请号：US16268774
申请日：2019-02-06
Applicant: Luxtera, Inc.
Inventor： Gianlorenzo Masini , Subal Sahni
IPC: H04B10/60 , G01J1/44 , H01L31/0224 , H01L31/028 , H01L31/0368 , H01L31/11 , H03F3/08
Abstract: A method and system for optoelectronic receivers utilizing waveguide heterojunction phototransistors (HPTs) integrated in a wafer are disclosed and may include receiving optical signals via optical fibers operably coupled to a top surface of the chip. Electrical signals may be generated utilizing HPTs that detect the optical signals. The electrical signals may be amplified via voltage amplifiers, or transimpedance amplifiers, the outputs of which may be utilized to bias the HPTs by a feedback network. The optical signals may be coupled into opposite ends of the HPTs. A collector of the HPTs may comprise a silicon layer and a germanium layer, a base may comprise a silicon germanium alloy with germanium composition ranging from 70% to 100%, and an emitter including crystalline or poly Si or SiGe. The optical signals may be demodulated by communicating a mixer signal to a base terminal of the HPTs.
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公开(公告)号：US10365447B2
公开(公告)日：2019-07-30
申请号：US15907543
申请日：2018-02-28
Applicant: Luxtera, Inc.
Inventor： Attila Mekis , Peter De Dobbelaere , Gianlorenzo Masini , Yannick De Koninck , Thierry Pinguet
Abstract: Methods and systems for a chip-on-wafer-on-substrate assembly are disclosed and may include in an optical communication system comprising an electronics die and a substrate. The electronics die is bonded to a first surface of a photonic interposer and the substrate is coupled to a second surface of the photonic interposer opposite to the first surface. An optical fiber and a light source assembly are coupled to the second surface of the interposer in one or more cavities formed in the substrate. A continuous wave (CW) optical signal may be received in the photonic interposer from the light source assembly, and a modulated optical signal may be communicated between the optical fiber and photonic interposer. The received CW optical signal may be coupled to an optical waveguide in the photonic interposer using a grating coupler.
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公开(公告)号：US20190162988A1
公开(公告)日：2019-05-30
申请号：US16267545
申请日：2019-02-05
Applicant: Luxtera, Inc.
Inventor： Ali Ayazi , Gianlorenzo Masini , Subal Sahni , Attila Mekis , Thierry Pinguet
CPC classification number: G02F1/025 , G02F1/2257 , G02F2001/212 , G02F2201/06 , G02F2202/105
Abstract: Methods and systems for a low-parasitic silicon high-speed phase modulator are disclosed and may include in an optical phase modulator that comprises a PN junction waveguide formed in a silicon layer, wherein the silicon layer may be on an oxide layer and the oxide layer may be on a silicon substrate. The PN junction waveguide may have fingers of p-doped and n-doped regions on opposite sides along a length of the PN junction waveguide. Contacts may be formed on the fingers of p-doped and n-doped regions. The fingers of p-doped and n-doped regions may be arranged symmetrically about the PN junction waveguide or staggered along the length of the PN junction waveguide. Etch transition features may be removed along the p-doped and n-doped regions.
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公开(公告)号：US20190113822A1
公开(公告)日：2019-04-18
申请号：US16206749
申请日：2018-11-30
Applicant: Luxtera, Inc.
Inventor： Attila Mekis , Subal Sahni , Yannick De Koninck , Gianlorenzo Masini , Faezeh Gholami
Abstract: Methods and systems for a vertical junction high-speed phase modulator are disclosed and may include a semiconductor device having a semiconductor waveguide including a slab section, a rib section extending above the slab section, and raised ridges extending above the slab section on both sides of the rib section. The semiconductor device has a vertical pn junction with p-doped material and n-doped material arranged vertically with respect to each other in the rib and slab sections. The rib section may be either fully n-doped or p-doped in each cross-section along the semiconductor waveguide. Electrical connection to the p-doped and n-doped material may be enabled by forming contacts on the raised ridges, and electrical connection may be provided to the rib section from one of the contacts via periodically arranged sections of the semiconductor waveguide, where a cross-section of both the rib section and the slab section in the periodically arranged sections may be fully n-doped or fully p-doped.
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15.发明授权公开(公告)号：US10256908B2
公开(公告)日：2019-04-09
申请号：US14729826
申请日：2015-06-03
Applicant: Luxtera, Inc.
Inventor： Attila Mekis , Peter DeDobbelaere , Kosei Yokoyama , Sherif Abdalla , Steffen Gloeckner , John Guckenberger , Thierry Pinguet , Gianlorenzo Masini , Daniel Kucharski
IPC: H04B10/2575 , H04B10/40 , H01L21/84 , H01L27/12 , H01L27/06 , H01L25/16 , H01L25/065
Abstract: Methods and systems for monolithic integration of photonics and electronics in CMOS processes are disclosed and may include in an optoelectronic transceiver comprising photonic and electronic devices from two complementary metal-oxide semiconductor (CMOS) die with different silicon layer thicknesses for the photonic and electronic devices, the CMOS die bonded together by metal contacts: communicating optical signals and electronic signals to and from said optoelectronic transceiver utilizing a received continuous wave optical signal as a source signal. A first of the CMOS die includes the photonic devices and a second includes the electronic devices. Electrical signals may be communicated between electrical devices to the optical devices utilizing through-silicon vias coupled to the metal contacts. The metal contacts may include back-end metals from a CMOS process. The electronic and photonic devices may be fabricated on SOI wafers, with the SOI wafers being diced to form the CMOS die.
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Patent Agency Ranking
公开(公告)号：US20180262275A1
公开(公告)日：2018-09-13
申请号：US15977835
申请日：2018-05-11
Applicant: Luxtera, Inc.
Inventor： Brian Welch , Gianlorenzo Masini
CPC classification number: H04B10/693 , H03F3/085 , H03G3/3084 , H03H21/0012 , H04B10/80
Abstract: Methods and systems for a distributed optoelectronic receiver are disclosed and may include an optoelectronic receiver having a grating coupler, a splitter, a plurality of photodiodes, and a plurality of transimpedance amplifiers (TIAs). The receiver receives a modulated optical signal utilizing the grating coupler, splits the received signal into a plurality of optical signals, generates a plurality of electrical signals from the plurality of optical signals utilizing the plurality of photodiodes, communicates the plurality of electrical signals to the plurality of TIAs, amplifies the plurality of electrical signals utilizing the plurality of TIAs, and generates an output electrical signal from coupled outputs of the plurality of TIAs. Each TIA may be configured to amplify signals in a different frequency range. One of the plurality of electrical signals may be DC coupled to a low frequency TIA of the plurality of TIAs.
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公开(公告)号：US20180234189A1
公开(公告)日：2018-08-16
申请号：US15950876
申请日：2018-04-11
Applicant: Luxtera, Inc.
Inventor： Peter De Dobbelaere , Attila Mekis , Gianlorenzo Masini
CPC classification number: H04B10/801 , G02B6/1228 , G02B6/34 , G02B6/4279
Abstract: Methods and systems for large silicon photonic interposers by stitching are disclosed and may include, in an integrated optical communication system including CMOS electronics die coupled to a silicon photonic interposer, where the interposer includes a plurality of reticle sections: communicating an optical signal between two of the plurality of reticle sections utilizing a waveguide. The waveguide may include a taper region at a boundary between the two reticle sections, the taper region expanding an optical mode of the communicated optical signal prior to the boundary and narrowing the optical mode after the boundary. A continuous wave (CW) optical signal may be received in a first of the reticle sections from an optical source external to the interposer. The CW optical signal may be received in the interposer from an optical source assembly coupled to a grating coupler in the first of the reticle sections in the silicon photonic interposer.
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公开(公告)号：US20180219630A1
公开(公告)日：2018-08-02
申请号：US15927521
申请日：2018-03-21
Applicant: Luxtera, Inc.
Inventor： Gianlorenzo Masini , Joseph Balardeta , Scott Denton
IPC: H04B10/40 , H04B10/077
CPC classification number: H04B10/40 , H04B10/0779
Abstract: Methods and systems for an optical connection service interface may include, in an optical data link comprising an optical fiber, a local control system, first and second transceivers at ends of the optical fiber, generating a signal for the local control system at a low frequency and communicating, utilizing the optical fiber, an optical data signal at a high frequency and an Optical Connection Service interface (OCSi) signal at an intermediate frequency. An optical signal may be modulated at the intermediate frequencies for the OCSi, and may be modulated and communicated to the second transceiver. The communicated modulated signal and the optical data signal may be detected utilizing a photodetector in the second transceiver. The detected optical signal may be demodulated, and an optical power of the optical data signal may be configured based on the demodulated signal.
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公开(公告)号：US09948402B2
公开(公告)日：2018-04-17
申请号：US15171233
申请日：2016-06-02
Applicant: Luxtera, Inc.
Inventor： Peter De Dobbelaere , Attila Mekis , Gianlorenzo Masini
CPC classification number: H04B10/801 , G02B6/1228 , G02B6/34 , G02B6/4279
Abstract: Methods and systems for large silicon photonic interposers by stitching are disclosed and may include, in an integrated optical communication system including CMOS electronics die coupled to a silicon photonic interposer, where the interposer includes a plurality of reticle sections: communicating an optical signal between two of the plurality of reticle sections utilizing a waveguide. The waveguide may include a taper region at a boundary between the two reticle sections, the taper region expanding an optical mode of the communicated optical signal prior to the boundary and narrowing the optical mode after the boundary. A continuous wave (CW) optical signal may be received in a first of the reticle sections from an optical source external to the interposer. The CW optical signal may be received in the interposer from an optical source assembly coupled to a grating coupler in the first of the reticle sections in the silicon photonic interposer.
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公开(公告)号：US20180059504A1
公开(公告)日：2018-03-01
申请号：US15694236
申请日：2017-09-01
Applicant: Luxtera, Inc.
Inventor： Attila Mekis , Subal Sahni , Yannick De Koninck , Gianlorenzo Masini , Faezeh Gholami
IPC: G02F1/225
CPC classification number: G02F1/2257 , G02F1/025 , G02F2001/212 , G02F2201/063 , G02F2201/12
Abstract: Methods and systems for a vertical junction high-speed phase modulator are disclosed and may include a semiconductor device having a semiconductor waveguide including a slab section, a rib section extending above the slab section, and raised ridges extending above the slab section on both sides of the rib section. The semiconductor device has a vertical pn junction with p-doped material and n-doped material arranged vertically with respect to each other in the rib and slab sections. The rib section may be either fully n-doped or p-doped in each cross-section along the semiconductor waveguide. Electrical connection to the p-doped and n-doped material may be enabled by forming contacts on the raised ridges, and electrical connection may be provided to the rib section from one of the contacts via periodically arranged sections of the semiconductor waveguide, where a cross-section of both the rib section and the slab section in the periodically arranged sections may be fully n-doped or fully p-doped.
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