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    Electrolytic generation of manganese (III) ions in strong sulfuric acid
    12.
    发明授权
    Electrolytic generation of manganese (III) ions in strong sulfuric acid 有权
    在强硫酸中电解生成锰（III）离子

    公开(公告)号：US09534306B2

    公开(公告)日：2017-01-03

    申请号：US13795382

    申请日：2013-03-12

    Applicant: MacDermid Acumen, Inc.

    Inventor： Trevor Pearson ,  Terence Clarke ,  Roshan V. Chapaneri ,  Craig Robinson ,  Alison Hyslop ,  Amrik Singh

    IPC: C25B1/21 ,  C25C1/10 ,  C25C7/00 ,  C25B11/12 ,  C25B9/06 ,  C09K13/04 ,  C25D5/56

    CPC classification number: C25D5/34 ,  C09K13/04 ,  C09K13/06 ,  C25B1/00 ,  C25B1/21 ,  C25B9/06 ,  C25B11/0415 ,  C25B11/0431 ,  C25B11/12 ,  C25B11/14 ,  C25C1/10 ,  C25C7/00 ,  C25D5/56

    Abstract: An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of at least one acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, woven carbon fibers, lead and lead alloy. Once the electrolyte is oxidized to form a metastable complex of manganese(III) ions, a platable plastic may be contacted with the metastable complex to etch the platable plastic. In addition, a pretreatment step may also be performed on the platable plastic prior to contacting the platable plastic with the metastable complex to condition the plastic surface.

    Abstract translation: 描述了一种电解槽和电解槽中锰（II）离子向锰（III）离子电化学氧化的方法。 电解槽包括（1）在至少一种酸的溶液中的锰（II）离子的电解液; （2）浸入电解液中的阴极; 和（3）浸在电解质溶液中并与阴极间隔开的阳极。 描述了各种阳极材料，包括玻璃碳，网状玻璃碳，编织碳纤维，铅和铅合金。 一旦电解质被氧化形成锰（III）离子的亚稳态复合物，可镀的塑料可与亚稳态络合物接触以蚀刻可镀塑料。 此外，还可以在将可镀塑料与亚稳态复合物接触之前在可镀塑料上进行预处理步骤以调节塑料表面。

    Etching of plastic using acidic solutions containing trivalent manganese
    16.
    发明授权
    Etching of plastic using acidic solutions containing trivalent manganese 有权

    公开(公告)号：US10221357B2

    公开(公告)日：2019-03-05

    申请号：US15934127

    申请日：2018-03-23

    Applicant: MacDermid Acumen, Inc.

    Inventor： Trevor Pearson ,  Craig Robinson

    IPC: C25B1/00 ,  C09K13/04 ,  C08J7/14 ,  C25D5/56

    Abstract: A method of preparing a solution capable of etching a platable plastic. The method comprises the steps of: (a) providing an electrolyte comprising a solution of manganese(II) in a solution of 9 to 15 molar sulfuric acid or phosphoric acid to an electrolytic cell; (b) applying a current to the electrolytic cell, wherein the electrolytic cell comprises an anode and a cathode; and (c) oxidizing the electrolyte to form manganese(III) ions, wherein the manganese(III) ions form a metastable sulfate complex. Thereafter, a platable plastic may be immersed in the metastable sulfate complex for a period of time to etch the platable substrate prior to subsequent plating steps.

    Etching of Plastic Using Acidic Solutions Containing Trivalent Manganese
    17.
    发明申请
    Etching of Plastic Using Acidic Solutions Containing Trivalent Manganese 审中-公开

    公开(公告)号：US20180208844A1

    公开(公告)日：2018-07-26

    申请号：US15934127

    申请日：2018-03-23

    Applicant: MacDermid Acumen, Inc.

    Inventor： Trevor Pearson ,  Craig Robinson

    IPC: C09K13/04 ,  C25B1/00

    CPC classification number: C09K13/04 ,  C08J7/14 ,  C08J2355/02 ,  C25B1/00 ,  C25D5/56

    Abstract: A method of preparing a solution capable of etching a platable plastic. The method comprises the steps of: (a) providing an electrolyte comprising a solution of manganese(II) in a solution of 9 to 15 molar sulfuric acid or phosphoric acid to an electrolytic cell; (b) applying a current to the electrolytic cell, wherein the electrolytic cell comprises an anode and a cathode; and (c) oxidizing the electrolyte to form manganese(III) ions, wherein the manganese(III) ions form a metastable sulfate complex. Thereafter, a platable plastic may be immersed in the metastable sulfate complex for a period of time to etch the platable substrate prior to subsequent plating steps.

    Treatment for Electroplating Racks to Avoid Rack Metallization
    19.
    发明申请
    Treatment for Electroplating Racks to Avoid Rack Metallization 有权
    电镀架的处理以避免机架金属化

    公开(公告)号：US20160040315A1

    公开(公告)日：2016-02-11

    申请号：US14454131

    申请日：2014-08-07

    Applicant: MacDermid Acumen, Inc.

    Inventor： Roderick D. Herdman ,  Trevor Pearson ,  Roshan V. Chapaneri ,  Alison Hyslop

    IPC: C25D17/08 ,  C25D5/34 ,  C09D181/00

    CPC classification number: C25D17/08 ,  C09D181/00 ,  C23C18/1653 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C25D5/34

    Abstract: A method of coating an electroplating rack used for supporting non-conductive substrates during a plating process. The method comprises the steps of contacting at least a portion of the electroplating rack with a plastisol composition, the plastisol composition having dispersed therein an effective amount of an additive having the structure: wherein R, R′, R″ and R′″ are either the same or are independently selected from the group consisting of benzyl, substituted benzyl, phenyl or substituted phenyl; or wherein R, R′, R″ and R′″ are either the same or are independently selected from C1-C10 alkyl (either straight or branched chain), benzyl, substituted benzyl, phenyl, or substituted phenyl and M is a divalent metal cation, preferably selected from the group consisting of nickel, copper and zinc; and heating the electroplating rack with the plastisol composition thereon to a suitable temperature and for a sufficient time to cure the plastisol and form a solid insulating coating on the electroplating rack. The coated electroplating rack may then be used for mounting non-conductive substrates for subsequent metallization steps.

    Abstract translation: 一种在电镀工艺期间涂覆用于支撑非导电衬底的电镀架的方法。 该方法包括以下步骤：使电镀架的至少一部分与增塑溶胶组合物接触，增塑溶胶组合物中分散有有效量的具有以下结构的添加剂：其中R，R'，R“和R” 相同或独立地选自苄基，取代的苄基，苯基或取代的苯基; 或其中R，R'，R“和R”“相同或独立地选自C 1 -C 10烷基（直链或支链），苄基，取代的苄基，苯基或取代的苯基，M是二价金属 阳离子，优选选自镍，铜和锌; 并将其上的增塑溶胶组合物的电镀架加热到合适的温度并持续足够的时间固化增塑溶胶并在电镀架上形成固体绝缘涂层。 然后可以将涂覆的电镀机架用于安装非导电衬底以用于随后的金属化步骤。

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