公开(公告)号：US11926889B2

公开(公告)日：2024-03-12

申请号：US17630691

申请日：2020-08-05

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Kenji Morikawa ,  Naoki Miyashima ,  Kazunari Maki ,  Shinichi Funaki

IPC: C22C9/04 ,  B32B15/01 ,  B32B15/20 ,  C25D3/38 ,  C25D5/50

CPC classification number: C22C9/04 ,  B32B15/01 ,  B32B15/20 ,  C25D3/38 ,  C25D5/50

Abstract: A copper alloy plate containing in a center part of a plate thickness direction more than 2.0% (% by mass) and 32.5% or less of Zn; 0.1% or more and 0.9% or less of Sn; 0.05% or more and less than 1.0% of Ni; 0.001% or more and less than 0.1% of Fe, and 0.005% or more and 0.1% or less of P; and the balance Cu, including a surface layer part in which a surface Zn concentration in a surface is 60% or less of a center Zn concentration in the center part, having a depth from the surface to where Zn concentration is 90% of the center Zn concentration; and in the surface layer, the Zn concentration increases from the surface toward the center part in the plate thickness direction at a concentration gradient of 10% by mass/μm or more and 1000% by mass/μm or less.

公开(公告)号：US11920228B2

公开(公告)日：2024-03-05

申请号：US17784062

申请日：2020-12-08

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Yoshiteru Akisaka ,  Naoki Miyashima ,  Kazunari Maki ,  Shinichi Funaki

IPC: C22C9/00 ,  C22F1/08

CPC classification number: C22C9/00 ,  C22F1/08

Abstract: Providing a copper alloy plate, in which center Mg concentration at a center part in a plate thickness direction 0.1 mass % or more and less than 0.3 mass %, center P concentration is 0.001 mass % or more and 0.2 mass % or less, and the balance is composed of Cu and inevitable impurities; in which surface Mg concentration at a surface is 70% or less of the center Mg concentration; in which a surface layer part defined by a prescribed thickness from the surface has a concentration gradient of Mg of 0.05 mass %/μm or more and 5 mass %/μm or less increasing from surface toward center part of the plate thickness direction; and in which restraint of color change of the surface and increase of electrical contact resistance, and adhesiveness of a plating film are excellent due to maximum Mg concentration in the surface layer part is 90% of the center Mg concentration.

公开(公告)号：US11781234B2

公开(公告)日：2023-10-10

申请号：US17416551

申请日：2019-12-18

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Naoki Miyashima ,  Kazunari Maki ,  Shinichi Funaki ,  Kenji Kubota

IPC: C25D5/10 ,  C22C9/00 ,  C25D5/50

CPC classification number: C25D5/10 ,  C22C9/00 ,  C25D5/505 ,  Y10T428/12903

Abstract: A copper alloy plate including 0.3 mass % or more and 1.2 mass % or less of Mg, 0.001 mass % or more and 0.2 mass % or less of P, and the balance Cu with inevitable impurities in a thickness center portion in a plate thickness direction; Mg concentration on a plate surface is 30% or less of bulk Mg concentration at the thickness center portion; a surface layer part having a depth from the plate surface to where it is 90% of the bulk Mg concentration is provided; and in the surface layer part, the Mg concentration increases from the plate surface toward the thickness center portion with a concentration gradient 1.8 mass %/μm or more and 50 mass %/μm or less.

公开(公告)号：US20220380924A1

公开(公告)日：2022-12-01

申请号：US17764261

申请日：2020-09-29

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Naoki Miyashima ,  Kazunari Maki ,  Shinichi Funaki ,  Seiichi Ishikawa

IPC: C25D5/16 ,  H01R13/03 ,  C25D3/38 ,  C25D3/30 ,  C25D3/12 ,  C25D5/12 ,  C25D5/50 ,  C25D5/00

Abstract: A terminal material having a base material in which at least a surface is made of Cu or Cu alloy; an Ni layer with at thickness of 0.1 μm to 1.0 μm inclusive on the base material; a Cu—Sn intermetallic compound layer with a thickness of 0.2 μm to 2.5 μm inclusive on the Ni layer; and an Sn layer with a thickness of 0.5 μm to 3.0 μm inclusive on the Cu—Sn intermetallic compound layer, when cross sections of the Cu—Sn intermetallic compound layer and the Sn layer are analyzed by the EBSD method with a measuring step 0.1 μm and a boundary in which misorientation between adjacent pixels is 2° or more is deemed to be a crystal boundary, an average crystal grain size Dc of the Cu—Sn intermetallic compound layer is 0.5 μm or more, and a grain size ratio Ds/Dc is five or less.

公开(公告)号：US20220081738A1

公开(公告)日：2022-03-17

申请号：US17416551

申请日：2019-12-18

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Naoki Miyashima ,  Kazunari Maki ,  Shinichi Funaki ,  Kenji Kubota

IPC: C22C9/00 ,  C25D5/50

Abstract: A copper alloy plate including 0.3 mass % or more and 1.2 mass % or less of Mg, 0.001 mass % or more and 0.2 mass % or less of P, and the balance Cu with inevitable impurities in a thickness center portion in a plate thickness direction; Mg concentration on a plate surface is 30% or less of bulk Mg concentration at the thickness center portion; a surface layer part having a depth from the plate surface to where it is 90% of the bulk Mg concentration is provided; and in the surface layer part, the Mg concentration increases from the plate surface toward the thickness center portion with a concentration gradient 1.8 mass %/μm or more and 50 mass %/μm or less.

公开(公告)号：US10923245B2

公开(公告)日：2021-02-16

申请号：US16478256

申请日：2018-01-16

Applicant: Mitsubishi Shindoh Co., Ltd. ,  MITSUBISHI MATERIALS CORPORATION

Inventor： Yuki Inoue ,  Kazunari Maki ,  Shinichi Funaki ,  Takashi Tamagawa ,  Kiyotaka Nakaya

IPC: B32B15/01 ,  H01B1/02 ,  C25D5/12 ,  C25D5/50 ,  H01R13/03

Abstract: A terminal material for connectors, which is obtained by sequentially laminating on a substrate that is formed of copper or a copper alloy, a nickel or nickel alloy layer, a copper-tin alloy layer and a tin layer in this order, and: the tin layer has an average thickness of from 0.2 μm to 1.2 μm (inclusive); the copper-tin alloy layer is a compound alloy layer that is mainly composed of Cu6Sn5, with some of the copper in the Cu6Sn5 being substituted by nickel, and has an average crystal grain diameter of from 0.2 μm to 1.5 μm (inclusive); a part of the copper-tin alloy layer is exposed from the surface of the tin layer, with the exposure area ratio being from 1% to 60% (inclusive); the nickel or nickel alloy layer has an average thickness of from 0.05 μm to 1.0 μm (inclusive) and an average crystal grain diameter of from 0.01 μm to 0.5 μm (inclusive).