公开(公告)号：US11384446B2

公开(公告)日：2022-07-12

申请号：US17005407

申请日：2020-08-28

Applicant: MacDermid Enthone Inc.

Inventor： Kyle M. Whitten ,  Stephan I. Braye ,  Jianwen Han ,  Pingping Ye ,  Thomas B. Richardson ,  Elie H. Najjar

IPC: C25D3/38 ,  C25D5/00 ,  B82Y40/00 ,  B82Y30/00

Abstract: A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.

公开(公告)号：US20170233883A1

公开(公告)日：2017-08-17

申请号：US15412809

申请日：2017-01-23

Applicant: MacDermid Enthone Inc.

Inventor： Vincent Paneccasio, JR. ,  Kyle Whitten ,  Thomas B. Richardson ,  Ivan Li

IPC: C25D3/38 ,  H01L21/768 ,  H01L23/48 ,  H01L23/532 ,  C25D7/12 ,  H01L23/498 ,  H01L25/065 ,  H05K3/18 ,  H05K3/42 ,  C08G65/333 ,  H01L21/48

Abstract: An aqueous electrolytic composition and a process for electrodeposition of copper on a dielectric or semiconductor base structure using the aqueous electrolytic composition. The process includes (i) contacting a metalizing substrate comprising a seminal conductive layer on the base structure with an aqueous electrolytic deposition composition; and (ii) supplying electrical current to the electrolytic deposition composition to deposit copper on the substrate. The aqueous electrolytic composition comprises: (a) copper ions; (b) an acid; (c) a suppressor; and (d) a quaternized poly(epihalohydrin) comprising n repeating units corresponding to structure 1N and p repeating units corresponding to structure 1P: