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公开(公告)号：US12204132B2
公开(公告)日：2025-01-21
申请号：US17016014
申请日：2020-09-09
Applicant: Magic Leap, Inc.
Inventor： Kevin Curtis , Heidi Leising Hall , Pierre St. Hilaire , David Tinch
Abstract: In some embodiments, a display system is provided. The display system comprises a plurality of light pipes and a plurality of light sources configured to emit light into the light pipes. The display system also comprises a spatial light modulator configured to modulate light received from the light pipes to form images. The display system may also comprise one or more waveguides configured to receive modulated light from the spatial light modulator and to relay that light to a viewer.
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公开(公告)号：US11811011B2
公开(公告)日：2023-11-07
申请号：US17671477
申请日：2022-02-14
Applicant: Magic Leap, Inc.
Inventor： Kevin Curtis
CPC classification number: H01L33/62 , G02B6/001 , G02B6/005 , G02B6/0028 , G02B6/0076 , G02B27/017 , G02B27/0172 , G02B2027/0118 , G02B2027/0134 , G02B2027/0178 , H01L33/385 , H01L33/52 , H01L2224/24225 , H01L2224/73265 , H01L2933/0066
Abstract: In some embodiments, an interconnect electrical connects a light emitter to wiring on a substrate. The interconnect may be deposited by 3D printing and lays flat on the light emitter and substrate. In some embodiments, the interconnect has a generally rectangular or oval cross-sectional profile and extends above the light emitter to a height of about 50 μm or less, or about 35 μm or less. This small height allows close spacing between an overlying optical structure and the light emitter, thereby providing high efficiency in the injection of light from the light emitter into the optical structure, such as a light pipe.
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公开(公告)号：US11428859B2
公开(公告)日：2022-08-30
申请号：US16798236
申请日：2020-02-21
Applicant: Magic Leap, Inc.
Inventor： Kevin Curtis , Hui-Chuan Cheng , Paul M. Greco , William Hudson Welch , Eric C. Browy , Miller Schuck , Bradley Jay Sissom
IPC: G06F3/147 , G09G3/00 , G09G3/20 , G02B27/01 , G02B7/00 , G02B5/30 , G02B27/00 , G02B27/28 , G02B27/10 , F21V8/00 , G06F3/01 , H04N9/31 , G02C5/16 , G02C11/00 , G06F1/16 , G06F1/20 , H05K7/20 , G02B5/18 , G02B6/34 , G02B6/293 , G02B27/30
Abstract: An artifact mitigation system includes a projector assembly and a set of imaging optics optically coupled to the projector assembly. The artifact mitigation system also includes an eyepiece optically coupled to the set of imaging optics. The eyepiece includes a diffractive incoupling interface. The artifact mitigation system further includes an artifact prevention element disposed between the set of imaging optics and the eyepiece. The artifact prevention element includes a linear polarizer, a first quarter waveplate disposed adjacent the linear polarizer, and a color select component disposed adjacent the first quarter waveplate.
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公开(公告)号：US11378256B2
公开(公告)日：2022-07-05
申请号：US16378409
申请日：2019-04-08
Applicant: Magic Leap, Inc.
Inventor： Bradley Jay Sissom , Heidi Leising Hall , Kevin Curtis
IPC: G02B6/00 , F21V13/04 , F21V8/00 , H04N13/315 , G02B27/01 , H04N13/344 , G02B30/50 , G02B6/12 , G02B23/06
Abstract: In some embodiments, optical systems with a reflector and a lens proximate a light output opening of the reflector provide light output with high spatial uniformity and high efficiency. The reflectors are shaped to provide substantially angularly uniform light output and the lens is configured to transform this angularly uniform light output into spatially uniform light output. The light output may be directed into a spatial light modulator, which modulates the light to project an image.
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公开(公告)号：US20180052320A1
公开(公告)日：2018-02-22
申请号：US15683412
申请日：2017-08-22
Applicant: Magic Leap, Inc.
Inventor： Kevin Curtis , Hui-Chuan Cheng , Paul M. Greco , William Hudson Welch , Eric C. Browy , Miller Schuck , Bradley Jay Sissom
Abstract: An artifact mitigation system includes a projector assembly, a set of imaging optics optically coupled to the projector assembly, and an eyepiece optically coupled to the set of imaging optics. The eyepiece includes an incoupling interface. The artifact mitigation system also includes an artifact prevention element disposed between the set of imaging optics and the eyepiece. The artifact prevention element includes a linear polarizer, a first quarter waveplate disposed adjacent the linear polarizer, and a color select component disposed adjacent the first quarter waveplate.
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Patent Agency Ranking
公开(公告)号：US20170248750A1
公开(公告)日：2017-08-31
申请号：US15442564
申请日：2017-02-24
Applicant: Magic Leap, Inc.
Inventor： Kevin Curtis , Heidi Leising Hall , Pierre St. Hilaire , David Tinch
Abstract: In some embodiments, a display system is provided. The display system comprises a plurality of light pipes and a plurality of light sources configured to emit light into the light pipes. The display system also comprises a spatial light modulator configured to modulate light received from the light pipes to form images. The display system may also comprise one or more waveguides configured to receive modulated light from the spatial light modulator and to relay that light to a viewer.
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公开(公告)号：US20240021774A1
公开(公告)日：2024-01-18
申请号：US18476611
申请日：2023-09-28
Applicant: Magic Leap, Inc.
Inventor： Kevin Curtis
CPC classification number: H01L33/62 , G02B27/017 , G02B6/001 , G02B6/0028 , G02B6/005 , G02B6/0076 , G02B27/0172 , H01L33/385
Abstract: In some embodiments, an interconnect electrical connects a light emitter to wiring on a substrate. The interconnect may be deposited by 3D printing and lays flat on the light emitter and substrate. In some embodiments, the interconnect has a generally rectangular or oval cross-sectional profile and extends above the light emitter to a height of about 50 μm or less, or about 35 μm or less. This small height allows close spacing between an overlying optical structure and the light emitter, thereby providing high efficiency in the injection of light from the light emitter into the optical structure, such as a light pipe.
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公开(公告)号：US11692689B2
公开(公告)日：2023-07-04
申请号：US17856829
申请日：2022-07-01
Applicant: Magic Leap, Inc.
Inventor： Bradley Jay Sissom , Heidi Leising Hall , Kevin Curtis
IPC: F21V13/00 , F21V13/04 , F21V8/00 , H04N13/315 , G02B27/01 , H04N13/344 , G02B30/50 , G02B6/12 , G02B23/06
CPC classification number: F21V13/04 , G02B6/005 , G02B6/0076 , G02B6/0055 , G02B23/06 , G02B27/0172 , G02B30/50 , G02B2006/12102 , G02B2027/0134 , G02F2201/00 , H04N13/315 , H04N13/344
Abstract: In some embodiments, optical systems with a reflector and a lens proximate a light output opening of the reflector provide light output with high spatial uniformity and high efficiency. The reflectors are shaped to provide substantially angularly uniform light output and the lens is configured to transform this angularly uniform light output into spatially uniform light output. The light output may be directed into a spatial light modulator, which modulates the light to project an image.
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公开(公告)号：US20220173295A1
公开(公告)日：2022-06-02
申请号：US17671477
申请日：2022-02-14
Applicant: Magic Leap, Inc.
Inventor： Kevin Curtis
Abstract: In some embodiments, an interconnect electrical connects a light emitter to wiring on a substrate. The interconnect may be deposited by 3D printing and lays flat on the light emitter and substrate. In some embodiments, the interconnect has a generally rectangular or oval cross-sectional profile and extends above the light emitter to a height of about 50 μm or less, or about 35 μm or less. This small height allows close spacing between an overlying optical structure and the light emitter, thereby providing high efficiency in the injection of light from the light emitter into the optical structure, such as a light pipe.
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公开(公告)号：US11264548B2
公开(公告)日：2022-03-01
申请号：US15441074
申请日：2017-02-23
Applicant: Magic Leap, Inc.
Inventor： Kevin Curtis
Abstract: In some embodiments, an interconnect electrical connects a light emitter to wiring on a substrate. The interconnect may be deposited by 3D printing and lays flat on the light emitter and substrate. In some embodiments, the interconnect has a generally rectangular or oval cross-sectional profile and extends above the light emitter to a height of about 50 μm or less, or about 35 μm or less. This small height allows close spacing between an overlying optical structure and the light emitter, thereby providing high efficiency in the injection of light from the light emitter into the optical structure, such as a light pipe.
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