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    Polyamide compositions having high acid ends
    11.
    发明授权
    Polyamide compositions having high acid ends 有权
    具有高酸性末端的聚酰胺组合物

    公开(公告)号：US08530571B2

    公开(公告)日：2013-09-10

    申请号：US12965077

    申请日：2010-12-10

    申请人： Toshikazu Kobayashi ,  Marvin M. Martens ,  Shengmei Yuan

    发明人： Toshikazu Kobayashi ,  Marvin M. Martens ,  Shengmei Yuan

    IPC分类号： C08G69/26 ,  C08L77/06

    CPC分类号： C08L77/06 ,  C08G69/265

    摘要： Disclosed is a thermoplastic composition including (A) a polyamide resin independently selected from the group consisting of Group (I) Polyamides having a melting point of at least 260° C., and comprising (a) greater than 95 mole percent semiaromatic repeat units and (b) less than 5 mole percent aliphatic repeat units; (B) 0 to 60 weight percent of one or more reinforcement agents; and(C) 0 to 50 weight percent of one or more a polymeric tougheners; wherein the weight percentages are based on the total weight of said thermoplastic composition; and wherein said polyamide resin has at least 50 meq/Kg of acid ends.

    摘要翻译： 公开了一种热塑性组合物，其包含（A）聚酰胺树脂，其独立地选自组（I）熔点为至少260℃的聚酰胺，并且包含（a）大于95摩尔％的半芳族重复单元和 （b）小于5摩尔％的脂肪族重复单元; （B）0〜60重量％的一种或多种增强剂; 和（C）0至50重量％的一种或多种聚合物增韧剂; 其中所述重量百分比基于所述热塑性组合物的总重量; 并且其中所述聚酰胺树脂具有至少50meq / Kg的酸末端。

    HEAT RESISTANT POLYAMIDE COMPOSITIONS HAVING HIGH AMINE ENDS
    16.
    发明申请
    HEAT RESISTANT POLYAMIDE COMPOSITIONS HAVING HIGH AMINE ENDS 审中-公开
    具有高碱性末端的耐热聚酰胺组合物

    公开(公告)号：US20140011951A1

    公开(公告)日：2014-01-09

    申请号：US14023759

    申请日：2013-09-11

    申请人： Marvin M. Martens ,  Toshikazu Kobayashi

    发明人： Marvin M. Martens ,  Toshikazu Kobayashi

    IPC分类号： C08K7/14

    CPC分类号： C08K7/14 ,  C09K8/685

    摘要： Disclosed is a thermoplastic composition including (A) a polyamide resin independently selected from the group consisting of Group (IV) Polyamides comprising (aa) about 50 to about 95 mole percent semiaromatic repeat and (bb) about 5 to about 50 mole percent aliphatic repeat units; and Group (VI) Polyamides having no melting point, (B) about 0.25 to about 15 weight percent of one or more polyhydric alcohols having more than two hydroxyl groups and a having a number average molecular weight (Mn) of less than 2000; (C) 0 to 60 weight percent of one or more reinforcement agents; and (D) 0 to 50 weight percent of a polymeric toughener wherein said polyamide resin has at least about 70 meq/Kg of amine ends.

    摘要翻译： 公开了一种热塑性组合物，其包含（A）独立地选自组（IV）聚酰胺的聚酰胺树脂，其包含（aa）约50至约95摩尔％的半芳族重复和（bb）约5至约50摩尔％的脂族重复 单位; 和（VI）族不含熔点的聚酰胺，（B）约0.25至约15重量％的一种或多种具有多于两个羟基并且数均分子量（Mn）小于2000的多元醇; （C）0至60重量％的一种或多种增强剂; 和（D）0至50重量％的聚合物增韧剂，其中所述聚酰胺树脂具有至少约70meq / Kg的胺末端。

    POLYAMIDE COMPOSITIONS WITH IMPROVED SALT RESISTANCE AND HEAT STABILITY
    17.
    发明申请
    POLYAMIDE COMPOSITIONS WITH IMPROVED SALT RESISTANCE AND HEAT STABILITY 失效
    具有改善耐盐碱性和耐热稳定性的聚酰胺组合物

    公开(公告)号：US20120029134A1

    公开(公告)日：2012-02-02

    申请号：US13015613

    申请日：2011-01-28

    申请人： SHAILESH RATILAL DOSHI ,  Annakutty Mathew ,  Marvin M. Martens

    发明人： SHAILESH RATILAL DOSHI ,  Annakutty Mathew ,  Marvin M. Martens

    IPC分类号： C08L77/06 ,  C08L33/14 ,  C08K3/40 ,  C08L33/02 ,  C08K7/14 ,  C08K3/34 ,  C08G69/26 ,  C08L51/06

    CPC分类号： C08G69/265 ,  C08K5/053 ,  C08K5/06 ,  C08L51/06 ,  C08L77/06

    摘要： Disclosed is a polyamide composition including at least one semi-aromatic copolyamide, said semi-aromatic copolyamide consisting essentially of about 25 to about 55 mole percent repeat units of the formula —C(O)(CH2)mC(O)NHCH2ArCH2NH—  (I) and about 45 to about 75 mole percent repeat units of the formula —C(O)(CH2)mC(O)NH(CH2)2NH—(II) wherein m is 8, 10, and/or 12, n is 6, 10 and/or 12 and Ar is a meta-substituted benzene ring; and said polyamide has a melting point equal to or less than 225° C.; and 0.1 to 15 weight percent of one or more polyhydric alcohols having more than two hydroxyl groups and having a number average molecular weight (Mn) of less than 2000. Also disclosed are molded or extruded articles including the polyamide composition.

    摘要翻译： 公开了包含至少一种半芳族共聚酰胺的聚酰胺组合物，所述半芳族共聚酰胺基本上由约25至约55摩尔％的式-C（O）（CH 2）m C（O）NHCH 2 ArCH 2 NH-（I ）和约45至约75摩尔％的式-C（O）（CH 2）m C（O）NH（CH 2）2 NH-（II）的重复单元，其中m为8,10和/或12，n为6 ，10和/或12，Ar是间位取代的苯环; 并且所述聚酰胺具有等于或小于225℃的熔点; 和0.1至15重量％的一种或多种具有多于两个羟基并且数均分子量（Mn）小于2000的多元醇。还公开了包含聚酰胺组合物的模制或挤出制品。

    HEAT AGING RESISTANT POLYAMIDE COMPOSITIONS INCLUDING POLYHYDROXY POLYMERS
    18.
    发明申请
    HEAT AGING RESISTANT POLYAMIDE COMPOSITIONS INCLUDING POLYHYDROXY POLYMERS 审中-公开
    耐高温聚酰胺组合物，包括聚羟基聚合物

    公开(公告)号：US20110028621A1

    公开(公告)日：2011-02-03

    申请号：US12842115

    申请日：2010-07-23

    申请人： Marvin M. Martens ,  Toshikazu Kobayashi

    发明人： Marvin M. Martens ,  Toshikazu Kobayashi

    IPC分类号： C08K5/13 ,  C08K5/18

    CPC分类号： C08L77/00 ,  C08K3/013 ,  C08K5/005 ,  C08L29/04 ,  C08L77/02 ,  C08L77/06 ,  C08L2205/02 ,  C08L2205/03 ,  C08L2666/04 ,  C08L2666/20 ,  C08L2666/02

    摘要： Disclosed is a thermoplastic composition including A) a polyamide resin having a melting point and/or glass transition; B) 0.25 to 20 weight percent of at least one polyhydric polymer; C) 0 to 3 weight percent of one or more co-stabilizer(s); and, D) 0 to about 60 weight percent of one or more reinforcement agents, wherein said polyamide resin is selected from the group consisting of Group (III) Polyamides having said melting point of at least 210° C., and including about 20 to about 35 mole percent semiaromatic repeat units, Group (IV) Polyamides comprising about 50 to about 95 mole percent semiaromatic repeat units, Group (V) Polyamides having said melting point of at least 260° C., and including greater than 95 mole percent semiaromatic repeat units, and Group (VI) Polyamides having no melting point; with the proviso that when less than 10 weight percent said one or more reinforcement agent(s) is present, at least 0.1 weight % of said one or more co-stabilizer(s) also is present.

    摘要翻译： 公开了一种热塑性组合物，其包括A）具有熔点和/或玻璃化转变的聚酰胺树脂; B）0.25至20重量％的至少一种多羟基聚合物; C）0至3重量％的一种或多种共稳定剂; 和D）0至约60重量％的一种或多种增强剂，其中所述聚酰胺树脂选自具有所述熔点至少为210℃的组（III）聚酰胺，并且包括约20至 约35摩尔％半芳族重复单元的组（IV）聚酰胺，其包含约50至约95摩尔％半芳族重复单元，（V）族聚酰胺，其熔点至少为260℃，并且包括大于95摩尔％的半芳族化合物 重复单元和不具有熔点的第（VI）族聚酰胺; 条件是当存在少于10重量％的所述一种或多种增强剂时，还存在至少0.1重量％的所述一种或多种共稳定剂。