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    LAMINATE BODY, METHOD, AND APPARATUS FOR MANUFACTURING ULTRATHIN SUBSTRATE USING THE LAMINATE BODY
    11.
    发明申请
    LAMINATE BODY, METHOD, AND APPARATUS FOR MANUFACTURING ULTRATHIN SUBSTRATE USING THE LAMINATE BODY 有权
    使用层压体制造超薄衬底的层压体，方法和装置

    公开(公告)号：US20090133812A1

    公开(公告)日：2009-05-28

    申请号：US12360869

    申请日：2009-01-28

    申请人： Kazuki Noda ,  Masaru Iwasawa

    发明人： Kazuki Noda ,  Masaru Iwasawa

    IPC分类号： B32B37/14

    CPC分类号： H01L21/67132 ,  B32B43/006 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6839

    摘要： Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

    摘要翻译： 提供了一种层叠体，其包括待研磨的基底和支撑体，其中基底被研磨成非常小的厚度，然后可以与支撑体分离而不损坏基底。 本发明的一个实施方案是一种层叠体，其包括待研磨的基材，与待研磨基材接触的接合层，包含光吸收剂和可热分解树脂的光热转换层和透光性支持体。 在与接合层接触的基板表面研磨后，通过透光层照射层叠体，分解光电转换层，分离基板和透光支撑体。

    Production method of semiconductor chip
    12.
    发明授权
    Production method of semiconductor chip 有权
    半导体芯片的生产方法

    公开(公告)号：US07452752B2

    公开(公告)日：2008-11-18

    申请号：US10595871

    申请日：2004-10-20

    申请人： Kazuki Noda ,  Masaru Iwasawa

    发明人： Kazuki Noda ,  Masaru Iwasawa

    IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

    CPC分类号： H01L21/67092 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6839 ,  H01L2924/3025

    摘要： Provided is a method for producing a semiconductor chip, comprising applying a photothermal conversion layer on a light-transmitting support, provided that upon irradiation of radiation energy, the photothermal conversion layer converts the radiation energy into heat and decomposes due to the heat; laminating the semiconductor wafer and the light-transmitting support through a photocurable adhesive by placing the circuit face and the photothermal conversion layer to face each other, thereby forming a laminated body having a non-circuit face on the outside; grinding the non-circuit face of the semiconductor wafer until the semiconductor wafer reaches a desired thickness; dicing the ground semiconductor wafer from the non-circuit face side to cut it into a plurality of semiconductor chips; irradiating radiation energy from the light-transmitting support side to decompose the photothermal conversion layer, thereby causing separation into a semiconductor chips having the adhesive layer and a light-transmitting support; and optionally removing the adhesive layer from the semiconductor chips.

    摘要翻译： 本发明提供一种半导体芯片的制造方法，其特征在于，在透光性支承体上涂敷光热转换层，只要在辐射能量照射下，光热转换层将辐射能量转化成热量，由于热而分解; 通过将电路面和光热转换层相对地相对地将半导体晶片和透光性支持体层叠在光固化性粘合剂上，从而在外部形成具有非电路面的层叠体; 研磨半导体晶片的非电路面，直到半导体晶片达到期望的厚度; 从非电路面侧切割接地半导体晶片，将其切割成多个半导体芯片; 照射来自透光性支持侧的照射能量以分解光热转换层，从而分离成具有粘合剂层的半导体芯片和透光性支撑体; 并且可选地从半导体芯片去除粘合剂层。