摘要:
An IC with a memory array having a series architecture is disclosed. The memory cells of the series group are arranged in pairs in which the capacitors of a memory cell pair are stacked one on top of the other. This advantageously allows for larger capacitor arrays without increasing the chip size.
摘要:
A method of calculating yield loss of semiconductor wafers which are tested with a test sequence to derive a total fail region count for each of the wafers, the semiconductor wafers having multiple chips thereon. The method comprises calculating a fail region count for each of the tests in the test sequence, calculating the test sequence limited yield loss for each of the wafers, and apportioning the test sequence limited yield loss to selected ones of the test based upon the absolute or cumulative number of fails identified by the tests of the test sequence. In some embodiments, core parametric test data is correlated with the test sequence limited yield and analyzed to determine reparability.
摘要:
A method for forming uniform-depth recesses across areas of different trench density, in accordance with the present invention, includes providing a substrate having trenches formed therein. The substrate includes regions of different trench density. The trenches are filled with a first filler material, and the first filler material is removed from a surface of the substrate. A second filler material is formed over the surface of the substrate such that the depth of the second filler material is substantially uniform across the regions of different trench density. Recesses are formed in the trenches such that the recess depth below the surface of the substrate is substantially uniform across the regions
摘要:
A semiconductor memory test mode configuration includes a first capacitor for storing digital data. The first capacitor connects a cell plate line to a first bit line through a first select transistor which is activated through a connection to a word line. A second capacitor for storing digital data connects the cell plate line to a second bit line through a second select transistor which is also activated through a connection to the word line. A sense amplifier is connected to the first and second bit lines for measuring a differential read signal on the first and second bit lines. A constant current mover, for example a constant current sink or source, is connected to the first bit line through a third transistor for changing the amount of charge on the first bit line when the third transistor is turned on to reduce the differential read signal.
摘要:
A method of analyzing cells of a memory device is disclosed. The method generally comprises steps of establishing a plurality of fail signatures, wherein each fail signature is associated with a type of failure. Voltages according to a plurality of test patterns are applied to nodes of a cell of the memory device. Fail data of the cell for the plurality of patterns is then analyzed, and a fail signature of the cell is determined. A type of failure of the cell based upon the plurality of fail signatures is then determined. A system for analyzing cells of a memory device is also disclosed. The system preferably comprises a plurality of probes applying different voltages to a cell of the memory device. A control circuit varies the voltages applied to the cell, and compares the failures of the cell as the test voltage applied to the cell is varied to an artificial bit map. Finally, an output device generates an output indicating a type of failure of the cell.
摘要:
An IC with a memory array having a series architecture is disclosed. A memory cell of a series group comprises a transistor coupled to a capacitor in parallel. The capacitor includes first and second subcapacitors, one stacked one on top of the other. Providing a capacitor with two or more subcapacitors in a stack advantageously increases the capacitance of a capacitor without increasing surface area.
摘要:
The present invention includes a method for characterizing semiconductor failure. The method includes determining the dimensions of certain characteristics of a memory chip. The method defines a group of characteristics for a semiconductor of given dimensions. The method defines a ratio based on variables supplied by production test systems. By comparing a set of characteristics for a specific semiconductor to the ratio to determine the dominant type of failure on the semiconductor chip. The invention is an efficient method of obtaining information regarding the types of failures common on semiconductor chips.
摘要:
A method for classifying patterns of failcodes on a semiconductor wafer, in accordance with the present invention, includes determining failcodes for chips on the wafer and checking adjacent chips for each chip on the wafer having a failcode to determine a failcode pattern having a defined number of chips.
摘要:
A FeRAM memory chip comprises an array 5 of non-volatile ferrocapacitor memory cells for storing data. Input pins receive data to be stored, and address data indicating where in the array of memory cells the data should be stored. The FeRAM memory chip further has a reset unit 7 for recognizing an externally applied reset signal. The reset unit 7, upon recognition of the reset signal, initiates a reset operation in which at least a portion of the data stored in the memory cells is set to predetermined values.