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公开(公告)号：US12196781B2
公开(公告)日：2025-01-14
申请号：US17968552
申请日：2022-10-18
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Ming Ting Wu , Dennis R. Smalley
Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner spring elements along their lengths. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
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公开(公告)号：US20240103042A1
公开(公告)日：2024-03-28
申请号：US17967548
申请日：2022-10-17
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Ming Ting Wu , Dennis R. Smalley
CPC classification number: G01R1/07314 , G01R1/06722 , G01R1/06738 , G01R3/00
Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
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公开(公告)号：US20240094256A1
公开(公告)日：2024-03-21
申请号：US17968552
申请日：2022-10-18
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Ming Ting Wu , Dennis R. Smalley
CPC classification number: G01R1/07314 , G01R1/06722 , G01R1/06738 , G01R3/00
Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner spring elements along their lengths. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
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公开(公告)号：US20240044939A1
公开(公告)日：2024-02-08
申请号：US18382406
申请日：2023-10-20
Applicant: Microfabrica Inc.
Inventor： Ming Ting Wu
IPC: G01R1/067
CPC classification number: G01R1/06722
Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays. In the various embodiments, probes include at least two flat spring segments with at least one of those segments being used in a compressive manner wherein the probe additionally includes guide elements, framing structures or other structural configurations that limit or inhibit one or more compressive spring segments from bowing or deflecting out of a desired position when subjected to loading.
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15.发明公开公开(公告)号：US20230324435A1
公开(公告)日：2023-10-12
申请号：US18299648
申请日：2023-04-12
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Ming Ting Wu , Uri Frodis , Heath A. Jensen
CPC classification number: G01R1/06722 , G01R1/06738 , G01R1/07314 , G01R1/06744 , G01R3/00 , G01R1/06761
Abstract: Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components. Some embodiments include one or more compliant pin elements located within a sheath. Some embodiments include pin probes that include locking or latching elements that may be used to fix pin portions of probes into sheaths. Some embodiments provide for fabrication of probes using multi-layer electrochemical fabrication methods.
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Patent Agency Ranking
公开(公告)号：US11768227B1
公开(公告)日：2023-09-26
申请号：US17727336
申请日：2022-04-22
Applicant: Microfabrica Inc.
Inventor： Ming Ting Wu
CPC classification number: G01R1/07357 , G01R1/06716 , G01R31/2863 , H01R13/2471 , H01R2201/20
Abstract: Embodiments are directed to probes formed from multiple layers with at least a portion of the layers including portions that include elastic compliant regions of the probes wherein such elastic portions of different layers are formed of different materials and wherein a plane of preferred elastic deformation of the probes is parallel to a plane containing (1) a normal to the planes of the layers and (2) a longitudinal axes of the probes or a local longitudinal axes of the probes.
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公开(公告)号：US20180078276A1
公开(公告)日：2018-03-22
申请号：US15718780
申请日：2017-09-28
Applicant: Microfabrica Inc.
Inventor： Richard T. Chen , Ming Ting Wu , Arun S. Veeramani , Vacit Arat , Gregory P. Schmitz , Juan Diego Perea , Ronald Leguidleguid , Gregory B. Arcenio , Eric C. Miller
IPC: A61B17/3205
CPC classification number: A61B17/3205 , A61B10/0266 , A61B10/0283 , A61B17/32002 , A61B17/3203 , A61B17/320758 , A61B2017/00345 , A61B2017/00526 , A61B2017/320064 , A61B2017/320775 , A61F2009/00887
Abstract: Various embodiments of a tissue cutting device and methods for using are described. In some variations devices include an elongate tube having a proximal end and a distal end and a central axis extending from the proximal end to the distal end; a first annular element at the distal end of the elongate tube, the first annular element having a cutting portion at its distal; and a second annular element at the distal end of the elongate tube and concentric with the first annular element, the second annular element having a cutting portion at its distal end, the first and second annular elements being rotatable relative to one another to cause the first annular element and the second annular element to pass each other to shear tissue.
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公开(公告)号：US12196782B2
公开(公告)日：2025-01-14
申请号：US17968601
申请日：2022-10-18
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Ming Ting Wu , Dennis R. Smalley
Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner planar spring elements along their length. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
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公开(公告)号：US20240094257A1
公开(公告)日：2024-03-21
申请号：US17968601
申请日：2022-10-18
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Ming Ting Wu , Dennis R. Smalley
CPC classification number: G01R1/07314 , G01R1/06722 , G01R1/06738 , G01R3/00
Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner planar spring elements along their length. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
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20.发明公开公开(公告)号：US20240094249A1
公开(公告)日：2024-03-21
申请号：US17854756
申请日：2022-06-30
Applicant: Microfabrica Inc.
Inventor： Ming Ting Wu , Arun S. Veeramani
IPC: G01R1/067
CPC classification number: G01R1/06722
Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays wherein the probes include at least one flat extension spring segment and wherein in some embodiments the probes also provide: (1) narrowed channel passage segments (e.g. by increasing width of plunger elements or by decreasing channel widths) along portions of channel lengths (e.g. not entire channel lengths) to enhance stability or pointing accuracy while still allowing for assembled formation of movable probe elements, and/or (2) ratcheting elements on probe arms and/or frame elements to allow permanent or semi-permanent transition from a build state or initial state to a working state or pre-biased state.
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