公开(公告)号：US20140291000A1

公开(公告)日：2014-10-02

申请号：US14223258

申请日：2014-03-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuhiro NISHISAKA ,  Satoshi MATSUNO ,  Akihiro YOSHIDA ,  Yasunori TASEDA

IPC: H01G4/01 ,  H05K1/18 ,  H01G4/008

CPC classification number: H05K1/0306 ,  H01G4/2325 ,  H05K1/185 ,  H05K2201/10636 ,  H05K2203/107 ,  H05K2203/1469 ,  Y02P70/611

Abstract: A ceramic electronic component includes a ceramic body and an outer electrode. The ceramic body includes first and second principal surfaces, first and second lateral surfaces, and first and second end surfaces. The outer electrode is provided on the first principal surface. The outer electrode includes an underlying electrode layer containing Cu and glass, and a Cu plating layer. The underlying electrode layer is disposed on the first principal surface. The Cu plating layer is disposed on the underlying electrode layer. The Cu plating layer is thicker than the underlying electrode layer.

Abstract translation: 陶瓷电子部件包括陶瓷体和外部电极。 陶瓷体包括第一和第二主表面，第一和第二侧表面以及第一和第二端面。 外电极设置在第一主表面上。 外电极包括含有Cu和玻璃的底层电极层和Cu镀层。 底层电极层设置在第一主表面上。 Cu镀层设置在下面的电极层上。 Cu镀层比下面的电极层厚。

公开(公告)号：US20130242458A1

公开(公告)日：2013-09-19

申请号：US13886309

申请日：2013-05-03

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Akihiro MOTOKI ,  Akihiro YOSHIDA ,  Makoto OGAWA

IPC: H01G4/30

CPC classification number: H01G4/30 ,  C23C18/405 ,  C23C28/023 ,  C23C28/028 ,  C25D5/10 ,  C25D5/12 ,  C25D17/20 ,  H01G4/2325 ,  Y10T428/24917

Abstract: A monolithic electronic component includes a laminate including a plurality of stacked insulating layers and a plurality of internal electrodes which extend between the insulating layers and which have end portions exposed at predetermined surfaces of the laminate, first plating layers disposed on the predetermined surfaces of the laminate, and second plating layers disposed on the first plating layer. The first plating layers are made of a metal different from that used to make the internal electrodes. The first plating layers are formed by electroless plating. The second plating layers are formed by electroplating.

Abstract translation: 单片电子部件包括层叠体，该层压体包括多个层叠绝缘层和在绝缘层之间延伸的多个内部电极，并且其端部暴露在层叠体的预定表面处，设置在层压体的预定表面上的第一镀层 以及设置在第一镀层上的第二镀层。 第一镀层由不同于制造内部电极的金属制成。 第一镀层通过无电镀形成。 第二镀层通过电镀形成。