公开(公告)号：US20230015749A1

公开(公告)日：2023-01-19

申请号：US17935412

申请日：2022-09-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Eiji ISO ,  Isao IDA ,  Hiroshi OKUIZUMI ,  Takao KAWACHI

IPC: H01F1/14 ,  H01F41/04 ,  H01F27/255 ,  H01F27/28 ,  H01F17/00 ,  H01F41/02 ,  H01F17/04 ,  H01F27/29

Abstract: A manufacturing method for an electronic component includes preparing a first composite magnetic section provided with a first composite magnetic layer and at least one marker layer disposed on the first composite magnetic layer; and preparing a second composite magnetic section provided with a second composite magnetic layer and at least one coil formed by winding a conductive wire and buried in the second composite magnetic layer with part of the coil being exposed. The manufacturing method further includes obtaining a multilayer body by disposing the first composite magnetic section so that a surface on the opposite side of the first composite magnetic section to a surface where the marker layer is disposed opposes a surface of the second composite magnetic section; and obtaining a molded body having a marker area formed with non-conductive particles pressed into the first composite magnetic layer.

公开(公告)号：US20220392687A1

公开(公告)日：2022-12-08

申请号：US17820786

申请日：2022-08-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Keita MUNEUCHI ,  Eiji ISO ,  Isao IDA ,  Kenichi ARAKI ,  Noriko SHIMIZU ,  Takashi TOMOHIRO

IPC: H01F27/255 ,  H01F17/04 ,  H01F17/00 ,  B22F3/24 ,  C22C32/00 ,  H01F41/04 ,  B22F1/16 ,  H01F1/147 ,  H01F1/20 ,  H01F27/29

Abstract: An electronic component includes an element body made of a composite material of a resin material and metal powder. A plurality of particles of the metal powder are exposed from the resin material and make contact with one another on the outer surface of the element

公开(公告)号：US20170271081A1

公开(公告)日：2017-09-21

申请号：US15613498

申请日：2017-06-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshifumi MAKI ,  Hirotsugu TOMIOKA ,  Shinichiro IZUMI ,  Eiji ISO

IPC: H01G4/248 ,  H03H1/00 ,  H01F27/28 ,  H01G4/30 ,  H01G4/40

CPC classification number: H01G4/248 ,  H01F17/0013 ,  H01F27/02 ,  H01F27/2823 ,  H01F27/29 ,  H01F27/36 ,  H01G4/12 ,  H01G4/232 ,  H01G4/252 ,  H01G4/30 ,  H01G4/40 ,  H03H1/00 ,  H03H2001/0057

Abstract: In electronic devices, as a result of miniaturization, the distance between a mounting board and an upper board or a shield case and the like, or the distance between the mounting board and other electronic components mounted adjacent thereto has become smaller. An electronic component is provided with: an element body internally containing a circuit element; and a terminal formed on the element body. The terminal is formed over an end surface of the element body and a surface adjacent to the end surface. An insulating film covering the terminal is formed on the element body. The terminal is exposed from the insulating film at least at a mounting surface of the element body, and a plating film containing tin is formed on a portion of the terminal exposed from the insulating film.