公开(公告)号：US20220302507A1

公开(公告)日：2022-09-22

申请号：US17834192

申请日：2022-06-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yosuke TOMOSHIGE ,  Mitsuyoshi NISHIDE

IPC: H01M10/0585 ,  H01M50/103 ,  H01M50/553

Abstract: A solid-state battery including a solid-state battery laminate having a positive electrode layer, a negative electrode layer, and a solid electrolyte layer interposed between the positive electrode layer and the negative electrode layer, each of the positive electrode layer and the negative electrode layer having an electrode active material. A first active material contour portion in which the electrode active material in one of the positive electrode layer and the negative electrode layer extends to a first plan-view contour of the solid-state battery laminate, and a first non-active material contour portion in which the electrode active material in the other of the positive electrode layer and the negative electrode layer does not extend to the first plan-view contour of the solid-state battery laminate face each other in a lamination direction.

公开(公告)号：US20220231347A1

公开(公告)日：2022-07-21

申请号：US17716315

申请日：2022-04-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kiyokazu YAMADA ,  Tatsuya HOSOTANI ,  Tomohiro KATO ,  Mitsuyoshi NISHIDE

IPC: H01M10/46 ,  H01M10/42 ,  H01M10/0525 ,  H01M50/14 ,  H01M50/124 ,  H02J50/10 ,  H02J7/00

Abstract: A wireless rechargeable solid-state battery module includes a solid-state battery; an internal structure including an internal circuit electrically connected with the battery; positive and negative electrode terminals, each of which is electrically connected with the solid-state battery, is exposed on an outer surface, and is where the positive or negative electrode terminal can be mounted on an electronic circuit board; barrier layers that entirely or partially contain a conductor and isolate the battery and the internal structure from an outside air environment; and a power receiving terminal electrically connected with an external circuit, which includes a power receiving coil coupled with an external electromagnetic or magnetic field, is electrically connected with the internal circuit, and is in an outside of the barrier layers. The power receiving coil converts the external electromagnetic or magnetic field into electrical energy and supplies current to the internal circuit via the power receiving terminal.

公开(公告)号：US20180308627A1

公开(公告)日：2018-10-25

申请号：US16016726

申请日：2018-06-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru KATO ,  Satoshi ISHINO ,  Mitsuyoshi NISHIDE ,  Shinichiro BANBA ,  Masahiro OZAWA

IPC: H01F27/29 ,  H01F27/28 ,  H01F27/24 ,  H01F41/02 ,  H01F41/04 ,  H01F41/10

CPC classification number: H01F27/292 ,  H01F17/00 ,  H01F27/24 ,  H01F27/28 ,  H01F27/2804 ,  H01F27/29 ,  H01F41/0206 ,  H01F41/04 ,  H01F41/041 ,  H01F41/10 ,  H02M3/00 ,  H02M3/155 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10053

Abstract: A surface mount coil component includes an element body with a first surface, a second surface that opposes the first surface, and a third surface connecting the first surface and the second surface, the element body being defined by a compact including magnetic particles; a first conductor pattern provided at the first surface of the element body; a second conductor pattern provided at the second surface of the element body; input/output terminals provided at the third surface of the element body; and metal pins embedded in the element body, ends of each metal pin being connected to the first and second conductor patterns. The first conductor pattern, the second conductor pattern, and the metal pins define a coil conductor. The input/output terminals are defined by a pair of metal pins exposed at the third surface.

公开(公告)号：US20170092415A1

公开(公告)日：2017-03-30

申请号：US15372715

申请日：2016-12-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinichiro BANBA ,  Yoshihito OTSUBO ,  Norio SAKAI ,  Mitsuyoshi NISHIDE

IPC: H01F27/28 ,  H01F27/29

CPC classification number: H01F27/2823 ,  H01F17/0013 ,  H01F17/062 ,  H01F27/2804 ,  H01F27/2885 ,  H01F27/2895 ,  H01F27/29 ,  H01F2027/2809

Abstract: Substrate-side wiring electrode patterns 16, which form a part of a coil electrode 12, are provided on a wiring substrate 20, and as a result reductions in the size and profile of a resin insulating layer 31, in which a coil core 11 is buried, can be achieved. Therefore, reductions in the size and the profile of a coil module 1 can be achieved compared with a coil module of the related art which is formed by mounting a coil component on a wiring substrate. In addition, since the substrate-side wiring electrode patterns 16, which form a part of the coil electrode 12, are provided on the wiring substrate 20, the heat generated by a coil 10 can be efficiently released from the substrate-side wiring electrode patterns 16 to the wiring substrate 20. Therefore, the heat dissipation property of the coil module 1 can be improved at low cost.