公开(公告)号：US20190074127A1

公开(公告)日：2019-03-07

申请号：US16175884

申请日：2018-10-31

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shingo ITO

IPC: H01F27/06 ,  H01F27/28 ,  H05K1/16 ,  H05K3/24 ,  H01F41/04 ,  H01F41/26

Abstract: A mounting substrate includes a resin layer and a first conductor including a contact surface in contact with the resin layer. The first conductor includes a first surface facing toward the mounting surface and a second surface on a side opposite to the first surface and extends in a direction parallel or substantially parallel to the mounting surface. The first conductor has a difference of a maximum value and a minimum value of a distance between the first surface and the mounting surface smaller than a difference of a maximum value and a minimum value of a distance between the second surface and the mounting surface. The resin layer includes a resin wall portion surrounding an opening portion partially exposing the first conductor on the mounting surface side, and the first conductor includes an exposed portion defining a mounting electrode.

公开(公告)号：US20220130617A1

公开(公告)日：2022-04-28

申请号：US17501001

申请日：2021-10-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shingo ITO ,  Koichi IKEDA ,  Ken TAKAKURA ,  Satoshi YOSHIDA ,  Syuichi NABEKURA ,  Takahiro HIRAO ,  Masanori NAKAMURA ,  Kyosuke UNO ,  Haruhiko UENO ,  Yohei MUKOBATA

IPC: H01G4/35 ,  H01G4/232

Abstract: A three-terminal capacitor includes a main body having a cylindrical or substantially cylindrical shape extending in a first direction and including first and second inner electrodes alternately laminated together with dielectric layers interposed therebetween, a pair of first outer electrodes on two end surfaces of the main body in the first direction and electrically connected to the first inner electrodes, and a second outer electrode electrically connected to the second inner electrodes. The main body includes a projecting portion projecting in a direction perpendicular or substantially perpendicular to the first direction at a position between the pair of first outer electrodes. The second outer electrode is provided on one surface of the projecting portion viewable when viewed in the first direction.

公开(公告)号：US20190207077A1

公开(公告)日：2019-07-04

申请号：US16294975

申请日：2019-03-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI ,  Shingo ITO ,  Isamu MORITA ,  Naoki GOUCHI

IPC: H01L41/047 ,  H01L41/083 ,  H01L41/09 ,  H01L41/193 ,  H01F7/20 ,  H01F27/28 ,  H01F27/32 ,  H05K1/18

CPC classification number: H01L41/0475 ,  H01F7/20 ,  H01F27/2804 ,  H01F27/323 ,  H01F2027/2809 ,  H01L41/083 ,  H01L41/0986 ,  H01L41/193 ,  H05K1/02 ,  H05K1/16 ,  H05K1/181 ,  H05K3/46 ,  H05K2201/1003

Abstract: A multilayer substrate includes a stacked body including first and second flexible insulating base material layers, and an actuator conductor pattern on at least the first insulating base material layer. The stacked body includes a first region including stacked first and second insulating base material layers, and a second region including stacked second insulating base material layers. The first region includes an actuator function portion in a portion thereof, the actuator function portion including the actuator conductor pattern. The thickness of the first insulating base material layer including the actuator conductor pattern is smaller than the thickness of one second insulating base material layer.

公开(公告)号：US20180343740A1

公开(公告)日：2018-11-29

申请号：US16051524

申请日：2018-08-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shingo ITO

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/46

CPC classification number: H05K1/118 ,  H05K1/14 ,  H05K1/144 ,  H05K3/361 ,  H05K3/368 ,  H05K3/46 ,  H05K3/4638 ,  H05K2201/0367 ,  H05K2201/041 ,  H05K2203/167

Abstract: A composite substrate includes a flat cable and a mounting board. The flat cable includes a first end portion and a second end portion, and a first bonding portion, a circuit portion, and a second bonding portion in this order in the length direction from the first end portion toward the second end portion. A positioning hole is disposed between the first end portion and the first bonding portion in the length direction. Another positioning hole is disposed between the second end portion and the second bonding portion in the length direction. The mounting board includes a mounting land conductor and a convex portion. The convex portion is fitted in the positioning hole. The mounting land conductor is bonded by surface mounting to an external connection conductor of the first bonding portion and an external connection conductor of the second bonding portion.

公开(公告)号：US20220285083A1

公开(公告)日：2022-09-08

申请号：US17751794

申请日：2022-05-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shingo ITO ,  Naoki GOUCHI ,  Hirotaka FUJII ,  Kazutaka MURAOKA

IPC: H01F27/28 ,  H01F17/00 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

Abstract: A multilayer substrate includes a stacked body of insulating base material layers and conductor patterns on the insulating base material layers. A thickness adjustment base material layer includes a frame portion, an opening portion inside the frame portion, and an island shaped portion inside the frame portion, and connection portions to connect the island shaped portion to the frame portion. The conductor patterns, in a stacking direction of the insulating base material layers, are wound around the island shaped portion. A line width of the connection portions is smaller than the width of the island shaped portion connected to the frame portion through the connection portions. An area overlapped with the conductor patterns is larger in the opening portion than in the frame portion and the island shaped portion.

公开(公告)号：US20190206648A1

公开(公告)日：2019-07-04

申请号：US16297766

申请日：2019-03-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI ,  Shingo ITO

IPC: H01H50/44

CPC classification number: H01H50/443 ,  H02K11/01 ,  H02K11/30 ,  H02K33/16

Abstract: An actuator includes a coil substrate including a coil, a base substrate including insulating base layers that are stacked, capacitors disposed in the base substrate, and a magnet to receive a magnetic field from the coil. The base substrate includes a coil driving circuit, and a first region closer to the coil and a second region farther from the coil. The first and second regions are defined by two portions of the base substrate divided in a direction in which the insulating base layers are stacked. The capacitors are disposed in the first region more densely than in the second region.

公开(公告)号：US20190198195A1

公开(公告)日：2019-06-27

申请号：US16293899

申请日：2019-03-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI ,  Shingo ITO ,  Shuichi KEZUKA ,  Takahiro BABA

IPC: H01B7/08 ,  H01P3/08 ,  H05K1/02 ,  H01P3/02

CPC classification number: H01B7/08 ,  H01P3/026 ,  H01P3/082 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/147 ,  H05K2201/052 ,  H05K2201/10037 ,  H05K2201/10189

Abstract: A transmission line includes, in a stacked insulator in which insulator layers are stacked, a first transmission line portion including a first ground conductor pattern, a second ground conductor pattern, and a first signal conductor pattern, and a second transmission line portion including a third ground conductor pattern, a fourth ground conductor pattern, and a second signal conductor pattern. The first signal conductor pattern extends along the second signal conductor pattern. The first ground conductor pattern and the third ground conductor pattern are provided on different insulator layers and at least partially overlap each other in a plan view.

公开(公告)号：US20190159347A1

公开(公告)日：2019-05-23

申请号：US16257148

申请日：2019-01-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shingo ITO ,  Kanto IIDA ,  Naoki GOUCHI

IPC: H05K3/46 ,  B32B15/04 ,  B32B15/20 ,  C08J5/24 ,  H05K1/16 ,  H05K1/02 ,  H01F17/00 ,  H05K1/03

Abstract: A method of manufacturing a multilayer board includes forming conductor patterns on four or more insulating base material layers, forming a multilayer body by stacking the insulating base material layers in a state in which the conductor patterns face each other with prepreg layers therebetween, and heat-pressing the multilayer body. In a state before the step of heat-pressing, among the prepreg layers, a thickness of an outermost prepreg layer is larger than a thickness of a prepreg layer other than the outermost prepreg layer.

公开(公告)号：US20190096558A1

公开(公告)日：2019-03-28

申请号：US16188430

申请日：2018-11-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shingo ITO ,  Naoki GOUCHI ,  Kosuke TAKEUCHI

IPC: H01F7/20 ,  H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H05K1/18 ,  H04R9/00 ,  H04R7/00

Abstract: An electronic component includes an insulating base material including insulating base material layers, a first main surface that is a mounting surface, a coil, mounting electrodes provided on the first main surface, and a projection. The coil includes coil conductors provided on the insulating base material layers and a winding axis in a laminating direction of the insulating base material layers. The projection is provided in an electrode non-forming portion of the first main surface, the electrode non-forming portion including no mounting electrodes therein, and provided along the coil conductors in planar view of the first main surface.

公开(公告)号：US20190090359A1

公开(公告)日：2019-03-21

申请号：US16197403

申请日：2018-11-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shingo ITO

IPC: H05K3/46 ,  H05K1/02 ,  H01L23/544

Abstract: An electronic component includes a multilayer body including insulating base materials laminated on each other and including first and second main surfaces perpendicular or substantially perpendicular to a lamination direction, and an alignment mark is defined by a conductor on one of the insulating base materials. The multilayer body includes a first layer area at a side of the first main surface and a second layer area at a side of the second main surface with respect to the alignment mark. An insulating base material in the first layer area has higher translucency than an insulating base material in the second layer area. The alignment mark is a trapezoidal cross-sectional shape including a first base at the side of the first main surface and a second base at the side of second main surface, the first base being longer than the second base.