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公开(公告)号：US20170188459A1
公开(公告)日：2017-06-29
申请号：US15442769
申请日：2017-02-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki YOSUI , Bunta OKAMOTO , Isamu MORITA , Jun SASAKI
CPC classification number: H05K1/115 , H05K1/0237 , H05K1/025 , H05K1/117 , H05K1/165 , H05K3/105 , H05K3/18 , H05K3/182 , H05K3/403 , H05K3/46 , H05K3/4617 , H05K3/4632 , H05K2201/041 , H05K2201/09354 , H05K2203/107
Abstract: A process of manufacturing a multilayer circuit board includes patterning insulating substrates on which conductors are formed to provide a signal conductor, a first ground conductor, and a second ground conductor. The insulating substrates including the signal conductor, the first ground conductor, and the second ground conductor are stacked and thermally crimped to form a laminate. An interlayer connection conductor is formed on a surface of the laminate by a Laser Direct Structuring process.
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公开(公告)号：US20180368252A1
公开(公告)日：2018-12-20
申请号：US16109918
申请日：2018-08-23
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shinya OGURI , Wataru TAMURA , Kanto IIDA , Kuniaki YOSUI , Isamu MORITA
Abstract: An electronic device includes a transmission line and a circuit board. The transmission line includes a signal conductor, a base material, a first external connection conductor, a second external connection conductor, and a ground conductor, and defines a stripline. The circuit board includes a first mounting land conductor, a second mounting land conductor, and a radiation reduction conductor. The first mounting land conductor and the second mounting land conductor are provided in a concave portion on the surface of the circuit board, and are respectively connected to the first external connection conductor and the second external connection conductor. The radiation reduction conductor is provided on the lateral surface of the concave portion in which the transmission line is disposed, and is in contact with or adjacent to the first lateral surface and the second lateral surface of the base material.
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3.发明申请ELECTRICAL ELEMENT, MOBILE DEVICE, AND METHOD FOR MANUFACTURING ELECTRICAL ELEMENT 审中-公开电气元件，移动装置和制造电子元件的方法公开(公告)号：US20160372819A1
公开(公告)日：2016-12-22
申请号：US15256822
申请日：2016-09-06
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Bunta OKAMOTO , Isamu MORITA , Satoshi ISHINO , Jun SASAKI , Yoshihito OTSUBO , Keisuke ARAKI , Norio SAKAI
Abstract: An electrical element includes a flexible antenna and a rigid member higher in rigidity than the flexible antenna. At least one of the flexible antenna and the rigid member is made of thermoplastic resin. A conductor pattern defining at least a portion of a section that performs the main function of the electrical element is provided at the flexible antenna. No conductor pattern that performs the main function of the electrical element is provided at the rigid member. Opposing surfaces of the flexible antenna and the rigid member are directly joined to each other.
Abstract translation: 电气元件包括柔性天线和刚性高于柔性天线的刚性构件。 柔性天线和刚性构件中的至少一个由热塑性树脂制成。 在柔性天线处提供限定执行电气元件的主要功能的部分的至少一部分的导体图案。 没有执行电气元件的主要功能的导体图案设置在刚性构件上。 柔性天线和刚性构件的相对表面彼此直接接合。
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公开(公告)号：US20190207077A1
公开(公告)日：2019-07-04
申请号：US16294975
申请日：2019-03-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki YOSUI , Shingo ITO , Isamu MORITA , Naoki GOUCHI
IPC: H01L41/047 , H01L41/083 , H01L41/09 , H01L41/193 , H01F7/20 , H01F27/28 , H01F27/32 , H05K1/18
CPC classification number: H01L41/0475 , H01F7/20 , H01F27/2804 , H01F27/323 , H01F2027/2809 , H01L41/083 , H01L41/0986 , H01L41/193 , H05K1/02 , H05K1/16 , H05K1/181 , H05K3/46 , H05K2201/1003
Abstract: A multilayer substrate includes a stacked body including first and second flexible insulating base material layers, and an actuator conductor pattern on at least the first insulating base material layer. The stacked body includes a first region including stacked first and second insulating base material layers, and a second region including stacked second insulating base material layers. The first region includes an actuator function portion in a portion thereof, the actuator function portion including the actuator conductor pattern. The thickness of the first insulating base material layer including the actuator conductor pattern is smaller than the thickness of one second insulating base material layer.
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Patent Agency Ranking
公开(公告)号：US20170279191A1
公开(公告)日：2017-09-28
申请号：US15618221
申请日：2017-06-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki YOSUI , Isamu MORITA
CPC classification number: H01Q1/38 , H01Q1/2283 , H01Q9/0421 , H01Q9/42
Abstract: An antenna defined by a conductive pattern is in contact with a laminate including insulator layers, one of which has a conductive pattern thereon. A first insulator layer has a surface that is a first principal surface of the laminate. The laminate includes a thick wall portion and a thin wall portion, and an antenna defined by the conductive pattern is located on the surface of the first insulator layer and a portion of the antenna traverses a boundary between the thick wall portion and the thin wall portion.
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公开(公告)号：US20170012339A1
公开(公告)日：2017-01-12
申请号：US15271503
申请日：2016-09-21
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromitsu ITO , Isamu MORITA
CPC classification number: H01Q1/2208 , G06K19/0775 , G06K19/07783 , H01Q1/2225 , H01Q1/243 , H01Q1/36 , H01Q1/38 , H01Q7/00
Abstract: An antenna device includes an insulating substrate, a spiral-shaped coil conductor on a main surface of the substrate, and a routing member with first and second connection portions electrically connected to each other. At least a portion of the routing member between the first connection portion and the second connection portion faces the coil conductor. At least either of the first connection portion and the second connection portion of the routing member is connected to an inner peripheral portion or an outer peripheral portion of the coil conductor via a conductive joining material. Thus, the routing member is mounted using a conductive joining material and is surface mounted in the same way as a typical surface mount device such as an RFIC element.
Abstract translation: 天线装置包括绝缘基板，在基板的主表面上的螺旋形线圈导体和具有彼此电连接的第一和第二连接部分的布线构件。 第一连接部分和第二连接部分之间的路由部件的至少一部分面向线圈导体。 路由部件的第一连接部分和第二连接部分中的至少一个通过导电接合材料连接到线圈导体的内周部分或外周部分。 因此，布线构件使用导电接合材料安装，并且以与诸如RFIC元件的典型表面安装装置相同的方式进行表面安装。
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公开(公告)号：US20190116659A1
公开(公告)日：2019-04-18
申请号：US16217096
申请日：2018-12-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Isamu MORITA , Bunta OKAMOTO
Abstract: An inductor bridge includes an inductor in a flexible, flat plate-shaped element body including resin bases that are laminated, and a wiring unit connected in series to the inductor. The inductor includes wound conductor patterns, each with a winding axis in a laminating direction of the resin bases and respectively provided on each of the resin bases, and an interlayer connection conductor interlayer-connecting the wound conductor patterns. The wiring unit includes a wiring pattern at a layer between a first surface of the wound conductor pattern and a layer farthest from the first surface and interlayer connection conductors conducted to the wiring pattern.
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公开(公告)号：US20190037685A1
公开(公告)日：2019-01-31
申请号：US16149162
申请日：2018-10-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shinya OGURI , Yuki ITO , Yuya DOKAI , Isamu MORITA
Abstract: A multilayer board includes a flexible base material including laminated insulator layers and curved along an X-axis direction on a plane orthogonal or substantially orthogonal to a lamination direction, an interlayer connection conductor on the flexible base material, and a notch pair on the flexible base material at positions symmetrical or substantially symmetrical in the X-axis direction with respect to a position of the interlayer connection conductor, the notch pair extending in a Y-axis direction orthogonal or substantially orthogonal to the X-axis direction on the plane. The interlayer connection conductor is within a region defined by the notch pair and lines respectively joining ends of the notch pair in the Y-axis direction. A radius of curvature of a region of the flexible base material between the notch pair in the X-axis direction being greater than curvature radii of regions outside of the notch pair.
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9.发明申请公开(公告)号：US20180153037A1
公开(公告)日：2018-05-31
申请号：US15881858
申请日：2018-01-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Isamu MORITA , Kuniaki YOSUI
IPC: H05K1/11 , H05K3/02 , H01R24/50 , H05K1/02 , H05K1/03 , H05K1/14 , H05K3/46 , H05K3/40 , H01Q1/38 , H05K1/18 , H01R103/00 , H05K5/04
CPC classification number: H05K1/115 , H01Q1/38 , H01Q1/40 , H01Q9/42 , H01Q23/00 , H01R24/50 , H01R2103/00 , H05K1/0242 , H05K1/032 , H05K1/144 , H05K1/181 , H05K1/182 , H05K1/188 , H05K3/027 , H05K3/4069 , H05K3/4617 , H05K3/4652 , H05K3/4697 , H05K5/04 , H05K2201/0129 , H05K2201/10015 , H05K2201/1003 , H05K2201/10098
Abstract: A multilayer substrate includes a base in which insulating base material layers including a thermoplastic resin are stacked, a conductor provided on at least one of the insulating base material layers, a ground electrode and a ground conductor, and a metal member connected to the conductor. The metal member is disposed inside the base and includes a portion extending in at least a stacking direction of the insulating base material layers and a portion extending in a planar direction parallel or substantially parallel to a principal surface of the insulating base material layers, and the metal member defines at least a portion of a circuit in contact with the base.
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