公开(公告)号：US20170250061A1

公开(公告)日：2017-08-31

申请号：US15427721

申请日：2017-02-08

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Issei YAMAMOTO ,  Atsushi SHIMIZU ,  Yoichi TAKAGI ,  Hideo NAKAGOSHI ,  Toru KOMATSU ,  Hideki SHINKAI ,  Tetsuya ODA

IPC: H01J37/34 ,  C23C14/50 ,  C23C14/56

Abstract: A vacuum device includes a processing target placement unit that is arranged inside a vacuum chamber and a vacuum evacuation unit that is connected to the vacuum chamber. The processing target placement unit has one main surface on which processing targets are placed and a side surface that is connected to the one main surface. The processing target placement unit is provided with a plurality of grooves that have openings at the one main surface. When the processing target placement unit is viewed from the one main surface side thereof, the smallest width of the opening of each groove in the one main surface is equal to or less than half the smallest width of the processing target.

公开(公告)号：US20230413418A1

公开(公告)日：2023-12-21

申请号：US18458270

申请日：2023-08-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toru KOMATSU ,  Tadashi NOMURA

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0204 ,  H05K1/0209 ,  H05K2201/0715 ,  H05K1/0266 ,  H05K2201/0212 ,  H05K1/181

Abstract: To provide electronic circuit module capable of dissipating heat generated by electronic component while suppressing increase in thickness, and capable of improving identifiability and visibility of identification character and identification mark as compared with conventional technique. Electronic circuit module according to present disclosure includes board, plurality of electronic components mounted on upper surface of board; and sealing resin configured to cover electronic component. Sealing resin has lower surface in contact with upper surface of board, and upper surface positioned on opposite side from board with respect to electronic component to face in opposite direction from lower surface. Identification recess constituting at least one of identification character and identification mark when viewed from thickness direction of board is formed in upper surface of sealing resin. Identification recess is filled with filler made of material having higher thermal conductivity than material of sealing resin.

公开(公告)号：US20230225092A1

公开(公告)日：2023-07-13

申请号：US18185621

申请日：2023-03-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toru KOMATSU ,  Motohiko KUSUNOKI ,  Tadashi NOMURA

IPC: H05K9/00 ,  H05K3/28 ,  H05K1/18

CPC classification number: H05K9/003 ,  H05K1/186 ,  H05K3/284 ,  H05K3/3442

Abstract: An electronic component module includes a substrate having a main surface, an electronic component mounted on the main surface, a sealing resin having an insulation property and covering the electronic component and the main surface, and a conductive film that covers an outer surface of the sealing resin. The electronic component includes a housing whose outer surface has an insulation property, and a first external electrode arranged at one end of the housing. The electronic component module includes a conductive auxiliary layer that covers a part of the first external electrode and a part of the housing on a side of the electronic component opposite to the substrate. The sealing resin has a recessed portion that exposes the conductive auxiliary layer. A conductive portion is formed in the recessed portion and is connected to the conductive film and the conductive auxiliary layer.

公开(公告)号：US20220310317A1

公开(公告)日：2022-09-29

申请号：US17806748

申请日：2022-06-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Minoru KOMIYAMA ,  Motohiko KUSUNOKI ,  Mitsuo ISHIDO ,  Toru KOMATSU

IPC: H01F27/29 ,  H05K3/46 ,  H01F27/28

Abstract: An electronic component module includes a substrate with a first main surface and a second main surface. Mount electronic components and a second conductive member are mounted on the second main surface, and the second conductive member is disposed between the mount electronic component and the mount electronic component. The second conductive member is connected to a shield film disposed near the second main surface through a depression. Mount electronic components and a first conductive member are mounted on the first main surface, and the first conductive member is disposed between the mount electronic component and the mount electronic component. The first conductive member is connected to a shield film disposed near the first main surface through a depression.