公开(公告)号：US20170094793A1

公开(公告)日：2017-03-30

申请号：US15373545

申请日：2016-12-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Keisuke ARAKI ,  Yuki ITO ,  Kenji KUBOTA

IPC: H05K1/14 ,  H05K1/03 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/147 ,  H05K1/0243 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/0313 ,  H05K1/181 ,  H05K7/142

Abstract: A resin substrate combined structure includes a first resin substrate including a flexible resin defining a main material and includes a first portion, a second resin substrate including a flexible resin defining a main material and includes a second portion spaced from the first portion in a thickness direction, and an insulating member that envelops the first portion and the second portion while retaining a relative positional relationship between the first portion and the second portion. The insulating member includes a material with a higher rigidity than any of the main material of the first resin substrate and that of the second resin substrate.

公开(公告)号：US20160044798A1

公开(公告)日：2016-02-11

申请号：US14886607

申请日：2015-10-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masaki KAWATA ,  Yuki ITO

IPC: H05K3/46 ,  H05K3/30

CPC classification number: H05K3/32 ,  H01L2224/16225 ,  H01L2224/81 ,  H05K1/185 ,  H05K1/186 ,  H05K3/0073 ,  H05K3/306 ,  H05K3/4611 ,  H05K3/4632 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2203/061 ,  H05K2203/063

Abstract: A method of manufacturing a resin multilayer substrate is provided in which a component (3) is incorporated in a stacked body obtained by stacking a plurality of thermoplastic resin sheets (2). The method includes the steps of: softening a first resin sheet (2a) by heating, and pressing the component (3) against the first resin sheet (2a), thereby fixing the component (3) to the first resin sheet (2a); stacking the first resin sheet (2a) on a second resin sheet (2b) having a through hole (14) receiving the component (3) and a third resin sheet (2c) located adjacent to a lower side of the component (3) such that the component (3) is inserted into the through hole (14) and the lower surface of the component (3) faces the third resin sheet (2c); and performing compression bonding by heating and pressurizing the stacked body including these resin sheets (2).

Abstract translation: 提供一种制造树脂多层基板的方法，其中将组分（3）结合在通过堆叠多个热塑性树脂片（2）而获得的层叠体中。 该方法包括以下步骤：通过加热软化第一树脂片（2a），并将部件（3）压在第一树脂片（2a）上，从而将部件（3）固定到第一树脂片（2a）上。 将第一树脂片（2a）堆叠在具有容纳部件（3）的通孔（14）的第二树脂片（2b）和位于部件（3）的下侧附近的第三树脂片（2c） 组件（3）插入到通孔（14）中，并且部件（3）的下表面面向第三树脂片（2c）; 并通过对包括这些树脂片（2）的层叠体进行加热加压来进行压接。

公开(公告)号：US20150070577A1

公开(公告)日：2015-03-12

申请号：US14546048

申请日：2014-11-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Nobuo IKEMOTO ,  Shigeru TAGO ,  Yuki ITO

IPC: H04N5/225

CPC classification number: H04N5/2253 ,  G03B17/02 ,  H04N5/2257

Abstract: A camera module includes an imaging function section, a connector forming section, and a connecting section combined in a laminated body. The connecting section is thinner than the imaging function section and is bendable. The imaging function section includes a cavity and a through hole. An image sensor IC is disposed within the cavity. A lens unit is mounted in the imaging function section to be optically coupled to the image sensor IC via the through hole. A light shielding member covers a boundary between the connecting section and the imaging function section that define a height difference.

Abstract translation: 相机模块包括成像功能部分，连接器形成部分和组合在层叠体中的连接部分。 连接部分比成像功能部分薄，可弯曲。 成像功能部分包括空腔和通孔。 图像传感器IC设置在腔内。 透镜单元安装在成像功能部分中，以通过通孔光学耦合到图像传感器IC。 遮光构件覆盖限定高度差的连接部和成像功能部之间的边界。