公开(公告)号：US20160290691A1

公开(公告)日：2016-10-06

申请号：US15036688

申请日：2014-11-10

Applicant: NEC CORPORATION ,  NEC PLATFORMS , LTD.

Inventor： Masaki CHIBA ,  Minoru YOSHIKAWA ,  Akira SHOUJIGUCHI ,  Kenichi INABA ,  Arihiro MATSUNAGA ,  Masanori SATO ,  Tadao HOSAKA ,  Yasuhito NAKAMURA

IPC: F25B41/00

CPC classification number: F25B41/003 ,  F16L41/086 ,  F25B23/006 ,  F25B2500/01

Abstract: It is difficult to avoid a decrease in cooling capacity without causing an increase in power consumption if a cooling device including a piping structure grows in size, therefore, a piping structure according to an exemplary aspect of the present invention includes a tubular part including a first flow passage through which a refrigerant flowing and a shell region surrounding the first flow passage; an introduction part composing a part of the shell region and including a second flow passage connected to the first flow passage; and a connection located at an end, between ends of the introduction part, on the side opposite to an end on a side where the second flow passage being connected to the first flow passage.

Abstract translation: 如果包括管道结构的冷却装置的尺寸增大，则难以避免冷却能力的降低而不引起功率消耗的增加，因此，根据本发明的示例性方面的管道结构包括管状部件，其包括第一 流经制冷剂的流动通道和围绕第一流动通道的壳体区域; 引导部分，构成壳体区域的一部分，并且包括连接到第一流动通道的第二流动通道; 以及位于所述导入部的端部之间的端部的与所述第二流路连接到所述第一流路的一侧的端部相反的一侧的连接。

公开(公告)号：US20160147034A1

公开(公告)日：2016-05-26

申请号：US14904450

申请日：2014-07-16

Applicant: NEC CORPORATION

Inventor： Akira SHOUJIGUCHI ,  Minoru YOSHIKAWA ,  Hitoshi SAKAMOTO ,  Masaki CHIBA ,  Kenichi INABA ,  Arihiro MATSUNAGA

IPC: G02B7/02 ,  G03B21/16 ,  F28D15/02 ,  G02B27/00

CPC classification number: G02B7/028 ,  F28D15/02 ,  F28D15/0266 ,  G02B27/0006 ,  G03B21/16

Abstract: A cooling structure of a sealed casing according to the present invention includes sealed containers for housing heat-generation components irradiated with light from a light source to generate heat, an evaporation unit disposed in the sealed container to store a refrigerant, a condensation unit configured to liquefy the refrigerant gasified by the heat received from the heat-generation component, a steam pipe configured to connect the evaporation unit and the condensation unit, through which the gasified refrigerant flows, and a liquid pipe configured to connect the evaporation unit and the condensation unit to each other, through which the liquefied refrigerant flows. Thus, a cooling structure capable of preventing performance deterioration of a cooling target device can be achieved.

Abstract translation: 根据本发明的密封壳体的冷却结构包括用于容纳照射来自光源的光的发热部件以产生热的密封容器，设置在密封容器中以储存制冷剂的蒸发单元，冷凝单元，其构造成 液化通过从发热部件接收的热量气化的制冷剂，配置成连接蒸发单元和冷凝单元的蒸气管，气化的制冷剂流过冷凝单元;液体管，被配置为将蒸发单元和冷凝单元 彼此通过液化制冷剂流过。 因此，能够实现能够防止冷却对象装置的性能恶化的冷却结构。

公开(公告)号：US20160018143A1

公开(公告)日：2016-01-21

申请号：US14378659

申请日：2013-02-13

Applicant: NEC CORPORATION

Inventor： Kenichi INABA ,  Minoru YOSHIKAWA ,  Hitoshi SAKAMOTO ,  Akira SHOUJIGUCHI ,  Masaki CHIBA ,  Arihiro MATSUNAGA

IPC: F25B43/00 ,  F25B39/00

CPC classification number: F25B43/00 ,  F25B39/00 ,  F25B39/02 ,  F25B39/04 ,  F28D15/0266 ,  G06F1/20 ,  H05K7/20818

Abstract: A cooling apparatus includes N (N is an integer of 2 or larger) refrigerant storage units arranged in a vertical direction and configured to store refrigerants, a condensation unit disposed above the N refrigerant storage units, a steam pipe for circulating gas phase refrigerants flowing out of the N refrigerant storage units to the condensation unit, a liquid pipe for circulating a liquid phase refrigerant flowing out of the condensation unit to an uppermost refrigerant storage unit, and separation piping for circulating a liquid phase refrigerant flowing out of an upper refrigerant storage unit to a lower refrigerant storage unit. The liquid phase refrigerant flows into each refrigerant storage unit via an inlet, and flows out from the refrigerant storage unit via a first connection port formed below the inlet.

Abstract translation: 一种冷却装置，其特征在于，包括N个（N为2以上的整数）制冷剂储存单元，其沿垂直方向配置，构成为储存制冷剂，冷凝单元设置在所述N个制冷剂储存单元的上方;蒸气管，其使流出的气相制冷剂循环 的N个制冷剂储存单元的冷凝装置，将从冷凝装置流出的液相制冷剂循环到最上层的制冷剂储存部的液体管，以及使从上部制冷剂储存部流出的液相制冷剂循环的分离配管 到下部制冷剂储存单元。 液相制冷剂经由入口流入各制冷剂储存单元，经由形成在入口下方的第一连接口从制冷剂储存单元流出。

公开(公告)号：US20230221084A1

公开(公告)日：2023-07-13

申请号：US18116622

申请日：2023-03-02

Applicant: NEC Corporation

Inventor： Koichi TODOROKI ,  Minoru YOSHIKAWA ,  Masaki CHIBA

IPC: F28F9/02 ,  F28F1/10 ,  H05K7/20 ,  F24F13/30 ,  F24F1/0063 ,  F24F1/0323

CPC classification number: F28F9/02 ,  F28F1/10 ,  H05K7/208 ,  F24F13/30 ,  F24F1/0063 ,  F24F1/0323

Abstract: A heat exchanger has a structure in which a heat exchanger main body through which coolant flows is obliquely installed in a box-shaped enclosure, the heat exchanger main body is constituted by a header pipe and a plurality of heat transfer pipes connected to the header pipe and disposed at predetermined intervals along a surface of a part of the header pipe, the header pipe has an area adjacent to an inner surface of the enclosure, and a seal section is provided between the inner surface of the enclosure and the area of the header pipe adjacent to the enclosure.

公开(公告)号：US20220377944A1

公开(公告)日：2022-11-24

申请号：US17764293

申请日：2019-10-02

Applicant: NEC Corporation

Inventor： Nirmal Singh RAJPUT ,  Masaki CHIBA ,  Mahiro HACHIYA ,  Takafumi NATSUMEDA ,  Yoshinori MIYAMOTO ,  Minoru YOSHIKAWA

IPC: H05K7/20 ,  F28D15/06 ,  F28D15/02

Abstract: The present invention provides an attachment for a server rack cooling system having at least one heat exchange condenser, the attachment includes: a pipe extension configured to connect to a portion of the server rack cooling system at which air and refrigerant are able to be transferred into the attachment from the at least one heat exchange condenser; a valve on the pipe extension configured to allow exhaust to the outside through the pipe extension at an open position and to block exhaust to the outside at a closed position; and an sensor disposed at a position inside of the pipe extension between the at least one heat exchange condenser and the valve and configured to provide a detection signal determined by a presence of fluid at the position of the sensor; wherein, the valve is opened and closed based on the detection signal from the sensor.

公开(公告)号：US20210003327A1

公开(公告)日：2021-01-07

申请号：US16982790

申请日：2019-03-20

Applicant: NEC Corporation

Inventor： Koichi TODOROKI ,  Minoru YOSHIKAWA ,  Kunihiko ISHIHARA ,  Masaki CHIBA ,  Yoshinori MIYAMOTO ,  Takafumi NATSUMEDA ,  Nirmal Singh RAJPUT

IPC: F25B41/00

Abstract: In order to efficiently distribute a heat medium at a low heat medium pressure, a heat exchange apparatus includes a heat exchange pipe 2 configured to accommodate a heat medium L to be evaporated by heat absorption from a gas to be cooled, the heat exchange pipe being disposed in an inclined state, a supply pipe 1 configured to supply the heat medium L in a liquid-phase state, the supply pipe being placed in a vicinity of a lower part of the heat exchange pipe 2, a discharge pipe 3 configured to receive a heat medium L to be evaporated in the heat exchange pipe 2 and discharged from an upper part of the heat exchange pipe, and a connecting pipe 4 placed, directing downward, between an upper part of the heat exchange pipe 2 and the discharge pipe 3.

公开(公告)号：US20180266744A1

公开(公告)日：2018-09-20

申请号：US15761150

申请日：2016-09-21

Applicant: NEC CORPORATION

Inventor： Hisato SAKUMA ,  Minoru YOSHIKAWA ,  Masaki CHIBA

IPC: F25B49/02 ,  F25B5/02 ,  F25B41/04

CPC classification number: F25B49/02 ,  F25B5/02 ,  F25B23/006 ,  F25B41/04 ,  H01L23/427 ,  H05K7/2029

Abstract: A cooling performance of a phase-change cooling system that circulates a refrigerant liquid using a driving source is remarkably lowered immediately after the startup. Thus, the phase-change cooling system according to the present invention includes: an evaporator that contains the refrigerant liquid for receiving the heat from the heating source; a condenser that releases the heat of the refrigerant vapor generated by the vaporization of the refrigerant liquid at the evaporator and generates the refrigerant liquid; the refrigerant liquid driving means for circulating the refrigerant liquid; the first piping unit for connecting the evaporator with the condenser; the second piping unit for connecting the condenser with the refrigerant liquid driving means; the third piping unit for connecting the refrigerant liquid driving means with the evaporator; and the fourth piping unit that has one end, at the first connection point, connected with the first piping unit and the other end, at the second connection point, connected with the second piping unit, in which the first connection point is positioned at a lower place than a position of an interface between the refrigerant liquid and the refrigerant vapor within the first piping unit when the refrigerant liquid driving means is started up.

公开(公告)号：US20160295749A1

公开(公告)日：2016-10-06

申请号：US15037859

申请日：2014-11-14

Applicant: NEC Corporation

Inventor： Minoru YOSHIKAWA ,  Kenichi INABA ,  Masanori SATO ,  Akira SHOUJIGUCHI ,  Arihiro MATSUNAGA ,  Masaki CHIBA

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20818 ,  F28D15/0266 ,  F28D15/0275 ,  F28D2015/0216 ,  F28F2250/06 ,  G06F1/20

Abstract: A vapor pipe 103 connects a heat dissipation portion 200 and each of a plurality of heat receiving portions 102. A liquid pipe 104 connects the heat dissipation portion 200 and each of a plurality of the heat receiving portions 102. A bypass pipe 105 connects the vapor pipe 103 and the liquid pipe 104. A valve 106 opens and closes a flow path of the bypass pipe 105. A first connection portion 107 connects the vapor pipe 103 and the bypass pipe 105. A second connection portion 108 connects the liquid pipe 103 and the bypass pipe 105. The first connection portion 107 is disposed at a position higher than that of the second connection portion 108. As a result, refrigerant can be efficiently transported in a short time.

Abstract translation: 蒸气管103将散热部200与多个受热部102中的每一个连接。液体管104将散热部200与多个受热部102连接。旁通管105将蒸气 管道103和液体管道104.阀门106打开和关闭旁通管道105的流路。第一连接部分107连接蒸汽管道103和旁路管道105.第二连接部分108将液体管道103和 旁通管105.第一连接部107设置在比第二连接部108高的位置。结果，可以在短时间内有效地输送制冷剂。

公开(公告)号：US20160014933A1

公开(公告)日：2016-01-14

申请号：US14769935

申请日：2014-02-19

Applicant: NEC CORPORATION

Inventor： Arihiro MATSUNAGA ,  Minoru YOSHIKAWA ,  Hitoshi SAKAMOTO ,  Masaki CHIBA ,  Akira SHOUJIGUCHI ,  Kenichi INABA

IPC: H05K7/20 ,  B23P19/00

CPC classification number: H05K7/20818 ,  B23P19/00 ,  F28D15/0266 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20827

Abstract: [Problem]To provide an electronic apparatus cooling system having superior cooling characteristics and portability.[Solution] A rack 2 is installed within a container 1. A heat receiving apparatus 3 is disposed on a lateral face of the rack 2, and receives heat emitted within the rack 2 by a liquid-phase cooling medium gasifying and becoming a gaseous-phase cooling medium. A gaseous-phase tube 6 is disposed extending in plumb direction, and transports the gaseous-phase cooling medium from the heat receiving apparatus 3. A heat radiating apparatus 4 is disposed above the rack 2 outside the container 1, and radiates the heat which the heat receiving apparatus 3 has received by cooling the gaseous-phase cooling medium flowing from the gaseous-phase tube 6, making said gaseous-phase cooling medium into the liquid-phase cooling medium. A liquid-phase tube 7 transports the liquid-phase cooling medium from the heat radiating apparatus 4 to the heat receiving apparatus 3. The gaseous-phase tube 6 further comprises a gaseous-phase tube bend part 6c whereat cooling medium droplets, which arise from the condensation of the gaseous phase cooling medium as a result of the gaseous-phase tube 6 being exposed to the environment external to the container 1, are collected.

Abstract translation: 提供具有优异的冷却特性和便携性的电子设备冷却系统。 [解决方案]机架2安装在容器1内。热接收装置3设置在齿条2的侧面上，并且通过液相冷却介质接收气体发生的气体发生的热量， 相冷却介质。 气相管6设置在铅垂方向延伸，并从热接收装置3输送气相冷却介质。散热装置4设置在容器1外部的齿条2的上方，并辐射热量 通过冷却从气相管6流出的气相冷却介质，接收热量接收装置3，使气相冷却介质进入液相冷却介质。 液相管7将液相冷却介质从散热装置4输送到热接收装置3.气相管6还包括气相管弯曲部6c，其中冷却介质液滴由 收集由于气相管6暴露于容器1外部的环境导致的气相冷却介质的冷凝。

公开(公告)号：US20150351286A1

公开(公告)日：2015-12-03

申请号：US14649172

申请日：2013-12-03

Applicant: NEC CORPORATION

Inventor： Hitoshi SAKAMOTO ,  Minoru YOSHIKAWA ,  Akira SHOUJIGUCHI ,  Masaki CHIBA ,  Kenichi INABA ,  Arihiro MATSUNAGA

IPC: H05K7/20

CPC classification number: H05K7/20663 ,  F25B1/00 ,  F25B21/02 ,  F25B2339/047 ,  F25B2400/24 ,  H05K7/20818

Abstract: The present invention includes: a heat receiving portion that receives heat generated by an electronic apparatus and causes a phase of a first heating medium to change from a liquid phase to a gas; a heat radiating portion that causes a phase of the first heating medium to change from the gas to the liquid and supplies the first heating medium to the heat receiving portion; and a compressor that raises a temperature of the first heating medium supplied from the heat receiving portion and supplies the first heating medium to the heat radiating portion.

Abstract translation: 本发明包括：受热部，其接收由电子设备产生的热量，并使第一加热介质的相位从液相变为气体; 散热部，其使所述第一加热介质的相位从所述气体向所述液体变化，并将所述第一加热介质供给到所述受热部; 以及压缩机，其升高从所述受热部供给的所述第一加热介质的温度，并将所述第一加热介质供给到所述散热部。