公开(公告)号：US20230243484A1

公开(公告)日：2023-08-03

申请号：US18298784

申请日：2023-04-11

Applicant: NICHIA CORPORATION

Inventor： Seiji KIYOTA ,  Kazuma KOZURU ,  Eiichiro OKAHISA

IPC: F21V5/00 ,  H01S5/00 ,  F21V5/04 ,  G02B19/00 ,  G02B3/00 ,  H01S5/40 ,  H01S5/02216 ,  H01S5/02253 ,  H01S5/02255

CPC classification number: F21V5/007 ,  H01S5/0071 ,  F21V5/04 ,  G02B19/0057 ,  G02B3/0056 ,  H01S5/405 ,  H01S5/4018 ,  H01S5/02216 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/4025 ,  H01S5/02345

Abstract: A light-emitting device includes: a substrate including a base and a side wall; a plurality of semiconductor laser elements arrayed in a first direction on an upper surface of the base; a sealing member fixed to the substrate, wherein the sealing member and the substrate define a sealed space in which the semiconductor laser element is located; and a lens array disposed above the sealing member, the lens array including a plurality of lens sections arrayed in the first direction. In the lens array, a maximum outer diameter of each lens sections is 1.25 times or more than an inter-vertex distance between adjacent ones of the lens sections in the first direction.

公开(公告)号：US20210156525A1

公开(公告)日：2021-05-27

申请号：US17164220

申请日：2021-02-01

Applicant: NICHIA CORPORATION

Inventor： Seiji KIYOTA

IPC: F21K9/65 ,  F21K9/68 ,  F21V7/04 ,  H01S5/00

Abstract: An optical component includes: an upper surface; a lower surface; a first light reflecting surface extending at least partially between the upper surface and the lower surface, the first light reflecting surface comprising a flat surface; and a rounded region formed between the first light reflecting surface and the lower surface. An angular edge is located at a first light reflecting surface side of the upper surface.

公开(公告)号：US20200381893A1

公开(公告)日：2020-12-03

申请号：US16996471

申请日：2020-08-18

Applicant: NICHIA CORPORATION

Inventor： Seiji KIYOTA

IPC: H01S5/022

Abstract: A method of manufacturing a light emitting device includes: providing a first support member having an outer circumferential lateral surface and a first through-hole penetrating from an upper surface to a lower surface; disposing a light-transmissive member containing a fluorescent material in the first through-hole; providing a second support member having an inner circumferential lateral surface and a second through-hole penetrating from an upper surface to a lower surface, an inner dimension of the second support member being smaller than an outer dimension of the first support member at room temperature; and performing shrink fitting, which comprises heating the first support member and the second support member to increase the inner dimension of the second support member to be greater than the outer dimension of the first support member, thereafter disposing the first support member in the second support member.

公开(公告)号：US20170317467A1

公开(公告)日：2017-11-02

申请号：US15496846

申请日：2017-04-25

Applicant: NICHIA CORPORATION

Inventor： Soichiro MIURA ,  Seiji KIYOTA ,  Eiichiro OKAHISA

IPC: H01S5/022 ,  H01S5/40 ,  H01L33/58

CPC classification number: H01S5/02252 ,  H01S5/0071 ,  H01S5/02216 ,  H01S5/02276 ,  H01S5/02288 ,  H01S5/02469 ,  H01S5/32341 ,  H01S5/4018 ,  H01S5/4031

Abstract: A method of manufacturing a light-emitting device includes providing a base body including a base section; fixing a plurality of semiconductor laser elements on an upper surface of the base section; and fixing an optical member to the base body, the optical member including a plurality of lens sections, and a non-lens section disposed at a periphery of the plurality of lens sections in a top view. In the step of fixing the optical member: the optical member is arranged above the base body; (i) an inclination and a height of the optical member are adjusted after interposing an adhesive between the base body and the non-lens section, or (ii) an adhesive is interposed between the base body and the non-lens section after adjusting the inclination and the height of the optical member; and subsequently, the adhesive is cured to fix the optical member to the base body.

公开(公告)号：US20160186936A1

公开(公告)日：2016-06-30

申请号：US14757431

申请日：2015-12-23

Applicant: NICHIA CORPORATION

Inventor： Seiji KIYOTA

IPC: F21K99/00 ,  F21V13/02 ,  F21V19/00 ,  F21V9/16

Abstract: A light emitting device includes a first support member having an outer circumferential lateral surface and a first through-hole, a light-transmissive member including a fluorescent material and disposed in the first through-hole, a second support member having an inner circumferential lateral surface and a second through-hole and a light emitting element disposed below the first support member. At a temperature higher than a first temperature in a range of 200° C. to 800° C., an outer dimension of the first support member is smaller than an inner dimension of the second support member. At room temperature, the outer dimension of the first support member without being fixed is greater than the inner dimension of the second support member without being fixed. The first temperature is a temperature at which a magnitude correlation between the outer dimension of the first support member and the inner dimension of the second support member is reversed.

Abstract translation: 发光装置包括具有外周侧表面和第一通孔的第一支撑构件，包括荧光材料并设置在第一通孔中的透光构件，具有内周侧表面的第二支撑构件 以及设置在所述第一支撑构件下方的第二通孔和发光元件。 在高于200℃至800℃范围内的第一温度的温度下，第一支撑构件的外部尺寸小于第二支撑构件的内部尺寸。 在室温下，不固定第一支撑构件的外部尺寸大于第二支撑构件的内部尺寸而不被固定。 第一温度是第一支撑构件的外部尺寸与第二支撑构件的内部尺寸之间的大小相关性相反的温度。