公开(公告)号：US20150299531A1

公开(公告)日：2015-10-22

申请号：US14380964

申请日：2013-01-31

Applicant: NITTO DENKO CORPORATION

Inventor： Midori TOJO ,  Yoshio TERADA ,  Kenji FURUTA

IPC: C09J133/26 ,  C08K3/22

CPC classification number: C09J133/26 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2201/005 ,  C08K2201/014 ,  C09J4/00 ,  C09J7/20 ,  C09J9/00 ,  C09J11/04 ,  C09J133/06 ,  C09J133/066 ,  C09J139/06 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/003 ,  C08F2220/1858 ,  C08F2220/281 ,  C08F226/10 ,  C08F220/58 ,  C08F222/1006

Abstract: A pressure-sensitive adhesive material contains a monomer and/or a polymer and 55 mass % or more of thermally conductive particles. The thermally conductive particles contain first thermally conductive particles having a particle size of primary particle based on volume of less than 10 μm and having a first particle size distribution and second thermally conductive particles having a particle size of primary particle based on volume of 10 μm or more and having a second particle size distribution. The first thermally conductive particles are contained in the thermally conductive particles at a ratio of 10 to 80 mass %. The second thermally conductive particles are contained in the thermally conductive particles at a ratio of 20 to 90 mass %.

Abstract translation: 压敏粘合剂材料含有单体和/或聚合物和55质量％以上的导热性颗粒。 导热性粒子包含第一导热粒子，其具有基于体积小于10μm的初级粒子的粒径，具有第一粒径分布的第一导热粒子和具有基于体积的10μm的一次粒子的粒径的第二导热粒子，或 更多并具有第二粒度分布。 第一导热颗粒以10至80质量％的比例包含在导热颗粒中。 第二导热粒子以20〜90质量％的比例包含在导热性粒子中。

公开(公告)号：US20200224000A1

公开(公告)日：2020-07-16

申请号：US16638340

申请日：2018-08-07

Applicant: NITTO DENKO CORPORATION

Inventor： Yusuke YAMANARI ,  Makoto SAITO ,  Akira HIRAO ,  Kenji FURUTA

IPC: C08J9/00 ,  C09J7/38 ,  C09J7/26 ,  C08J9/12 ,  C08J9/10 ,  C09J11/04

Abstract: A resin sheet with a pressure-sensitive adhesive layer including the resin sheet. The resin sheet including a main surface A and a main surface B opposite to each other across a thickness “d”, where the resin sheet has a 50% compression load of 20 N/cm2 or less at 23±5° C. in a direction of the thickness “d”, which is measured in conformity with a method of measuring a compression hardness described in JIS K 6767:1999; where the resin sheet has a Poisson's ratio at 23° C. of 0.10 or less; and the resin sheet has a thickness recovery ratio of 40% or more when compressed by 20% in the direction of the thickness “d” at 23° C.

公开(公告)号：US20190284447A1

公开(公告)日：2019-09-19

申请号：US16355898

申请日：2019-03-18

Applicant: Nitto Denko Corporation

Inventor： Kenji FURUTA ,  Akira HIRAO ,  Tatsuya SUZUKI ,  Hiroki IEDA

IPC: C09J7/38 ,  G11B25/04 ,  C09J7/40 ,  C09J109/00 ,  C09J133/10

Abstract: Provided is a PSA sheet for use in electronic devices suitable for their downsizing and densification. The PSA sheet for electronic devices provided by this invention comprises a substrate and a PSA layer provided to at least one face of the substrate. The PSA sheet has a laser absorbance of 20% or higher in a wavelength range of 1000 nm to 1100 nm; has a thermal shrinkage SMD in its machine direction and a thermal shrinkage STD in its transverse direction (direction perpendicular to the machine direction) of both −2 % or greater and 2% or less; and has an amount of thermally released gas of 1300 ng/cm2 or less when determined at 80° C. for 3 hours by GC/MS.

公开(公告)号：US20190127610A1

公开(公告)日：2019-05-02

申请号：US16174613

申请日：2018-10-30

Applicant: NITTO DENKO CORPORATION

Inventor： Tatsuya SUZUKI ,  Hiroki IEDA ,  Akira HIRAO ,  Kenji FURUTA

IPC: C09J7/38 ,  C09J7/10 ,  C09J11/04

Abstract: Provided is a PSA sheet having first and second faces. The first face is an adhesive face formed of one surface of a PSA layer. The first face has a maximum static friction force of 4.0 N/cm2 or less and an adhesive strength N2 of 8 N/20mm or greater at 23° C. after subjected to 5 minutes of heating at 80 ° C. after the first face is applied to a stainless steel plate.

公开(公告)号：US20190077999A1

公开(公告)日：2019-03-14

申请号：US15771636

申请日：2017-11-20

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroki IEDA ,  Tatsuya SUZUKI ,  Kenji FURUTA ,  Minami WATANABE ,  Takeshi NAKANO ,  Shogo SASAKI

IPC: C09J7/38 ,  C09J183/04 ,  C09J201/02

Abstract: The present invention provides a pressure-sensitive adhesive (PSA) sheet that achieves both low initial adhesiveness and strong adhesiveness upon use and has excellent transparency of the PSA layer. The PSA sheet provided herein includes a PSA layer having a haze value of 1.0% or less. The PSA sheet is configured so that a pressure-sensitive adhesive strength N1, after the PSA layer is attached to a stainless steel plate and left at 23° C. for 30 minutes, is 1.5 N/20 mm or less, and a pressure-sensitive adhesive strength N2, after the PSA layer is attached to a stainless steel plate and heated at 80° C. for 5 minutes, is 10.0 N/20 mm or more.

公开(公告)号：US20160208142A1

公开(公告)日：2016-07-21

申请号：US14988847

申请日：2016-01-06

Applicant: NITTO DENKO CORPORATION

Inventor： Kenji FURUTA ,  Yoshio TERADA ,  Kota NAKAO

IPC: C09J7/00 ,  C09J5/00

CPC classification number: C09J7/00 ,  C09J7/10 ,  C09J7/401 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2483/005

Abstract: A pressure-sensitive adhesive sheet according to the present invention includes a pressure-sensitive adhesive layer including an acrylic polymer, and a release liner including a release layer made of a silicone release agent, the release layer being applied on the pressure-sensitive adhesive layer. The acrylic polymer includes at least one alkyl(meth)acrylate whose alkyl group being a linear or branched chain alkyl group with a carbon number of 1 to 18 as a monomer unit, and an amount of siloxane gas generated in a unit area of the pressure-sensitive adhesive layer where the release liner is removed is less than 20.0 ng/cm2 after heating at 120° C. for ten minutes.

Abstract translation: 根据本发明的压敏粘合片包括包含丙烯酸类聚合物的压敏粘合剂层和包含由硅氧烷剥离剂制成的剥离层的剥离衬垫，所述剥离层施加在压敏粘合剂层上 。 丙烯酸类聚合物包括至少一种烷基（碳原子数为1至18的直链或支链烷基）作为单体单元的（甲基）丙烯酸烷基酯，以及在压力的单位面积中产生的硅氧烷气体的量 去除剥离衬垫的敏感性粘合剂层在120℃下加热10分钟后小于20.0ng / cm 2。

公开(公告)号：US20160152872A1

公开(公告)日：2016-06-02

申请号：US14892243

申请日：2014-05-29

Applicant: NITTO DENKO CORPORATION

Inventor： Kenji FURUTA ,  Yoshio TERADA

IPC: C09J11/04 ,  C09J133/08 ,  C09J7/02 ,  C09K5/14

CPC classification number: C09J11/04 ,  C08K3/22 ,  C08K2003/2227 ,  C09J7/38 ,  C09J9/00 ,  C09J133/08 ,  C09J2201/122 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2205/102 ,  C09J2433/00 ,  C09K5/14 ,  C08F2220/1858 ,  C08F2220/281 ,  C08F226/10 ,  C08F220/58

Abstract: A thermally-conductive pressure-sensitive adhesive sheet according to the present invention includes a pressure-sensitive adhesive layer containing thermally-conductive particles. One side of the sheet is an adhesive face, and the other side is a non-adhesive face. The thermally-conductive pressure-sensitive adhesive sheet may include a non-adhesive layer on or over only one side of the pressure-sensitive adhesive layer. In this case, the ratio of the thickness of the non-adhesive layer to the thickness of the pressure-sensitive adhesive layer is preferably 0.04 to 0.6. The thermally-conductive pressure sensitive adhesive sheet preferably has a thermal resistance of 6 K·cm2/W or less. The thermally-conductive pressure sensitive adhesive sheet preferably has a total thickness of 50 to 500 μm.

Abstract translation: 根据本发明的导热粘合片包括含有导热颗粒的压敏粘合剂层。 片材的一侧是粘合面，另一面是非粘合面。 导热性粘合片可以在粘合剂层的一侧或多于一侧包含非粘合层。 在这种情况下，非粘合层的厚度与粘合剂层的厚度的比优选为0.04〜0.6。 导热性粘合片的热阻优选为6K·cm 2 / W以下。 导热性粘合片的总厚度优选为50〜500μm。

公开(公告)号：US20140240869A1

公开(公告)日：2014-08-28

申请号：US14185369

申请日：2014-02-20

Applicant: NITTO DENKO CORPORATION

Inventor： Kenji FURUTA ,  Rie NAKAHIRA ,  Yoshihisa FURUTA ,  Koichi IKEDA

IPC: G11B33/14

CPC classification number: G11B33/1446 ,  B32B7/12 ,  B32B15/00 ,  B32B27/08 ,  B32B27/308 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2307/734 ,  B32B2457/00 ,  B32B2581/00 ,  G11B33/1466 ,  Y10T428/24975

Abstract: A pressure-sensitive adhesive sheet according to the present invention includes a base including a metal layer, a first plastic film layer A, and a second plastic film layer B and a pressure-sensitive adhesive layer on a surface of the second plastic film B. The metal layer is positioned between the first plastic film layer A and the second plastic film layer B. The metal layer has a thickness of 2 μm to 15 μm. A total of a thickness Ta of the first plastic film layer A and a thickness Tb of the second plastic film layer B is within a range of 25 μm to 70 μm.

Abstract translation: 根据本发明的压敏粘合片包括在第二塑料膜B的表面上包括金属层，第一塑料膜层A和第二塑料膜层B的基底和压敏粘合剂层。 金属层位于第一塑料膜层A和第二塑料膜层B之间。金属层的厚度为2μm〜15μm。 第一塑料膜层A的厚度Ta和第二塑料膜层B的厚度Tb的总和在25μm至70μm的范围内。