公开(公告)号：US10888929B2

公开(公告)日：2021-01-12

申请号：US15762504

申请日：2016-09-21

Applicant: NITTO DENKO CORPORATION

Inventor： Nao Kamakura ,  Yuki Sugo

IPC: B32B27/20 ,  B22F7/08 ,  B32B27/36 ,  B32B9/00 ,  B22F7/06 ,  H01L21/683 ,  C09J7/10 ,  H01L23/00 ,  C09J9/00 ,  B22F3/02 ,  B22F1/00 ,  B32B7/06 ,  C08K3/22 ,  C08K3/08 ,  H01L23/31

Abstract: A problem is to provide a sheet which is such that a sintered body produced following sintering has a small amount of remaining organic substances. Solution means relate to a sheet comprising a pre-sintering layer. The pre-sintering layer comprises polycarbonate.

公开(公告)号：US10707184B2

公开(公告)日：2020-07-07

申请号：US15762070

申请日：2016-09-28

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Nao Kamakura

IPC: H01L23/00 ,  H01L21/683 ,  C09J7/28 ,  C09J7/26 ,  C09J9/02 ,  C09J7/25 ,  C09J7/24 ,  C09J11/04 ,  H01L21/56 ,  C09J7/10 ,  C09J201/00 ,  C09J7/20 ,  H01L23/373 ,  C08K3/08 ,  C08K3/22

Abstract: A thermal bonding sheet includes a layer, in which hardness of the layer after being heated at a heating rate of 1.5° C./sec from 80° C. to 300° C. under pressure of 10 MPa, and then held at 300° C. for 2.5 minutes is in a range of 1.5 GPa to 10 GPa in measurement using a nanoindenter.

公开(公告)号：US20190148331A1

公开(公告)日：2019-05-16

申请号：US16308931

申请日：2017-05-23

Applicant: NITTO DENKO CORPORATION

Inventor： Satoshi Honda ,  Yuki Sugo ,  Nao Kamakura

IPC: H01L23/00 ,  C09J1/00 ,  C09J7/38 ,  H01J37/28 ,  C09J9/02 ,  H01L21/683 ,  H01L21/78

Abstract: Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sheet. A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating, and the precursor layer includes sinterable metallic particles and an organic component, the precursor layer has a phase separation structure that is a sea-island structure or a co-continuous structure, and in a SEM surface observation image on at least one surface of the precursor layer, a maximum value among each diameter of the largest inscribed circle for a region occupied by each phase of the phase separation structure is 1 μm or more and 50 μm or less.

公开(公告)号：US20180265744A1

公开(公告)日：2018-09-20

申请号：US15762515

申请日：2016-09-21

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Nao Kamakura

IPC: C09J7/28 ,  C09J9/02 ,  C09J11/04 ,  C09J7/25 ,  C09J7/24 ,  H01L21/683 ,  H01L23/00

Abstract: Provided is a thermal bonding sheet which suppresses a compositional material of the thermal bonding sheet from protruding during bonding and from creeping up onto the surface of an object to be bonded, and provides a strong sintered layer after sintering. A thermal bonding sheet includes a layer. When the layer is analyzed by a differential thermal balance from 23° C. to 500° C. in an air atmosphere at a heating rate of 10° C./min, a value obtained by subtracting a weight decrease amount (%) at 300° C. from a weight decrease amount (%) at 500° C. is in a range of −1% to 0%.

公开(公告)号：US10821543B2

公开(公告)日：2020-11-03

申请号：US16075260

申请日：2016-12-13

Applicant: NITTO DENKO CORPORATION

Inventor： Nao Kamakura ,  Yuki Sugo ,  Satoshi Honda

IPC: B23K20/00 ,  B23K20/16 ,  B22F7/08 ,  B23K35/36 ,  B23K35/02 ,  B22F3/14 ,  B32B15/00 ,  H01L23/00 ,  B23K20/02 ,  B23K103/00 ,  B23K35/38 ,  B23K101/40 ,  B23K101/36 ,  B32B5/16 ,  B32B37/04 ,  B32B37/06 ,  B32B37/10 ,  B32B37/24

Abstract: Provided is a joint manufacturing method including: a step A of preparing a laminate in which two objects to be joined are temporarily adhered with a heat-joining sheet including a pre-sintering layer interposed between the two objects to be joined; a step B of increasing a temperature of the laminate from a temperature equal to or lower than a first temperature defined below to a second temperature; and a step C of holding the temperature of the laminate in a predetermined range after the step B, in which the laminate is pressurized during at least a part of the step B and at least a part of the step C. The first temperature is a temperature at which an organic component contained in the pre-sintering layer is decreased by 10% by weight when the pre-sintering layer is subjected to thermogravimetric measurement.

公开(公告)号：US10685933B2

公开(公告)日：2020-06-16

申请号：US15762066

申请日：2016-09-28

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Nao Kamakura

IPC: H01L23/00 ,  H01L21/683 ,  C09J7/28 ,  C09J7/26 ,  C09J9/02 ,  C09J7/25 ,  C09J7/24 ,  C09J201/00 ,  C09J7/10 ,  C08K3/08 ,  C08K3/22 ,  H01L23/31

Abstract: A thermal bonding sheet includes a layer, in which an average area of a pore portion in a cross section of the layer after being heated at a heating rate of 1.5° C./sec from 80° C. to 300° C. under pressure of 10 MPa, and then held at 300° C. for 2.5 minutes is in a range of 0.005 μm2 to 0.5 μm2.

公开(公告)号：US10669452B2

公开(公告)日：2020-06-02

申请号：US15762515

申请日：2016-09-21

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Nao Kamakura

IPC: H01L23/00 ,  H01L21/683 ,  C09J7/28 ,  C09J7/26 ,  C09J9/02 ,  C09J7/25 ,  C09J7/24 ,  C09J11/04 ,  C09J9/00 ,  C09J7/10 ,  H01L23/31 ,  C08K3/08 ,  C08K3/22

Abstract: Provided is a thermal bonding sheet which suppresses a compositional material of the thermal bonding sheet from protruding during bonding and from creeping up onto the surface of an object to be bonded, and provides a strong sintered layer after sintering. A thermal bonding sheet includes a layer. When the layer is analyzed by a differential thermal balance from 23° C. to 500° C. in an air atmosphere at a heating rate of 10° C./min, a value obtained by subtracting a weight decrease amount (%) at 300° C. from a weight decrease amount (%) at 500° C. is in a range of −1% to 0%.

公开(公告)号：US20180277507A1

公开(公告)日：2018-09-27

申请号：US15762066

申请日：2016-09-28

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Nao Kamakura

IPC: H01L23/00 ,  H01L21/683 ,  C09J7/28 ,  C09J7/26 ,  C09J9/02 ,  C09J7/25 ,  C09J7/24

Abstract: A thermal bonding sheet includes a layer, in which an average area of a pore portion in a cross section of the layer after being heated at a heating rate of 1.5° C./sec from 80° C. to 300° C. under pressure of 10 MPa, and then held at 300° C. for 2.5 minutes is in a range of 0.005 μm2 to 0.5 μm2.

公开(公告)号：US20180269175A1

公开(公告)日：2018-09-20

申请号：US15762070

申请日：2016-09-28

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Nao Kamakura

IPC: H01L23/00 ,  H01L21/683 ,  H01L23/373 ,  C09J9/02 ,  C09J7/20 ,  C09J11/04

Abstract: A thermal bonding sheet includes a layer, in which hardness of the layer after being heated at a heating rate of 1.5° C./sec from 80° C. to 300° C. under pressure of 10 MPa, and then held at 300° C. for 2.5 minutes is in a range of 1.5 GPa to 10 GPa in measurement using a nanoindenter.