摘要:
A metal nanoparticle composition includes a thermally decomposable or UV decomposable stabilizer. A method of forming conductive features on a substrate, includes providing a solution containing metal nanoparticles with a stabilizer; and liquid depositing the solution onto the substrate, wherein during the deposition or following the deposition of the solution onto the substrate, decomposing and removing the stabilizer, by thermal treatment or by UV treatment, at a temperature below about 180° C. to form conductive features on the substrate.
摘要:
A method of forming a conductive ink silver features on a substrate by printing a silver compound solution and a hydrazine compound reducing agent solution on the surface of a substrate with a printhead. The silver compound solution and the hydrazine compound reducing agent solution are mixed just before, during, or following the printing of both solutions on the surface of the substrate, and the silver compound is then reduced to form conductive silver ink features on the substrate.
摘要:
An ambipolar transistor, including a p-type semiconductor region and an n-type semiconductor region near the p-type semiconductor region. Also a first terminal and second terminal contact both the p-type semiconductor region and the n-type semiconductor region. Furthermore, the p-type semiconductor region and the n-type semiconductor region substantially do not overlap each other. A method of manufacturing an ambipolar transistor is also disclosed, including forming a p-type semiconductor region, forming an n-type semiconductor region near the p-type semiconductor region, forming a first terminal contacting both the p-type semiconductor region and n-type semiconductor region, forming a second terminal contacting both the p-type semiconductor region and n-type semiconductor region; and wherein the p-type semiconductor region and the n-type semiconductor region substantially do not overlap, and have substantially no interfacial area.
摘要:
A imaging member, such as a photoreceptor, incorporating an outer layer having comprising a structured organic film nano- to micron-scale patterns formed on its surface to lower friction with the cleaning blade and improve print quality and performance. Methods for making the improved imaging member are also disclosed.
摘要:
A non-volatile memory device including at least a first electrode and a second electrode provided on a substrate, the first and second electrodes being separated from each other; an organic semiconductive polymer electrically connecting the first and second electrodes; an electrolyte in contact with the organic semiconductive polymer; and a third electrode that is not in contact with the first electrode, the second electrode, and the organic semiconductive polymer; wherein the organic semiconductive polymer has a first redox state in which it exhibits a first conductivity, and a second redox state in which it exhibits a second conductivity.
摘要:
A method of forming a high resolution feature on a substrate, the method includes, depositing a liquid composition comprising a substance and a solvent onto the substrate to form deposited features, heating the deposited features to a heating temperature during or after the depositing to form an intermediate feature having a central region and an edge region, applying an adhesive substance to at least a portion of a surface of the intermediate feature, and removing the adhesive substance together with at least a portion of the central region of the intermediate feature to form the high resolution feature on the substrate.
摘要:
A composition that may be used to form an electronic circuit element includes metal nanoparticles in a metal nanoparticle solution, at least a low-polarity additive and a solvent. The low-polarity additive is either a styrenated terpene resin or a polyterpene resin. The composition may be used to form conductive features on a substrate by depositing the composition onto a substrate, and heating the deposited composition on the substrate to a temperature from about 80° C. to about 200° C. to form conductive features on the substrate.