公开(公告)号：US10122063B2

公开(公告)日：2018-11-06

申请号：US15013551

申请日：2016-02-02

Applicant: Northrop Grumman Systems Corporation

Inventor： Steven J. Mass ,  Anthony L. Long ,  Mansoor K. Siddiqui ,  Marijan D. Grgas ,  Gershon Akerling

IPC: H01P11/00 ,  H01P3/08 ,  H01P3/06 ,  H01P3/12 ,  H01B3/30 ,  C04B35/626

Abstract: A method of making an electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled. The method includes the steps of depositing a plating material into a mold, pouring a foam polymer into the mold and removing the plated foam structure from the mold without etching the section from the mold. The method further includes steps of forming a metallic form into a planar structure, filling the open pores of the foam with a material such as photo-resist, machining a cavity from the foam, electroplating the cavity in the foam then removing the photo-resist material.

公开(公告)号：US20180116052A1

公开(公告)日：2018-04-26

申请号：US15298313

申请日：2016-10-20

Applicant: Northrop Grumman Systems Corporation

Inventor： Steven J. Mass

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/03 ,  H01P3/08 ,  H01L25/18 ,  H01L23/66 ,  H01L23/498 ,  H01L23/373

CPC classification number: H01L23/3732 ,  H01L23/13 ,  H01L23/15 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/66 ,  H01L25/16 ,  H01L25/18 ,  H01L2223/6627 ,  H01L2223/6644 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01P3/08 ,  H01P3/085 ,  H01L2924/00014

Abstract: An apparatus includes: electronic tile packaging, the electronic tile packaging comprising: a plurality of tile layers, at least one of the tile layers comprising a crystalline structure having high thermal conductivity.

公开(公告)号：US20170215286A1

公开(公告)日：2017-07-27

申请号：US15007743

申请日：2016-01-27

Applicant: Northrop Grumman Systems Corporation

Inventor： Matthew J. Pirih ,  Steven J. Mass ,  Andrew Yurko

IPC: H05K1/14 ,  H05K3/02 ,  H05K3/36

CPC classification number: H05K1/144 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/042 ,  H05K2201/10265 ,  H05K2201/10348 ,  H05K2203/0723 ,  H05K2203/095 ,  H05K2203/107

Abstract: In an exemplary method, three dimensional printing forms a micro lattice truss structure with a first end formed in contact with a conductive area on a PCB so that the truss structure is adhered to the conductive area due to the three dimensional printing. The truss structure extends outward from the PCB and has a distal end. The truss structure is formed with resiliency so that the truss structure maintains structural integrity during end-to-end compression. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is conductive so that a resilient electrical connection can be formed between the conductive area of the PCB and another spaced apart surface parallel with the PCB when the distal end of the truss structure is in contact with and compressed by the other surface.

公开(公告)号：US09502780B2

公开(公告)日：2016-11-22

申请号：US14597785

申请日：2015-01-15

Applicant: Northrop Grumman Systems Corporation

Inventor： Loc B. Chau ,  Sudhakar K. Rao ,  Steven J. Mass ,  Dana Quincey

IPC: H01Q1/38 ,  H01Q21/24 ,  H01Q9/28 ,  H01Q21/06

CPC classification number: H01Q21/24 ,  H01Q9/285 ,  H01Q21/062

Abstract: An exemplary antenna array has first self-complementary antenna cells, e.g. bowtie antennas, disposed in a first plane in rows and columns. Additional bowtie antenna cells are disposed in a second plane parallel to the first plane and are aligned in corresponding rows and columns. A first stripline disposed between the first and second planes carries RF signals to/from the first and second bowtie antenna cells. A slot feed couples the RF signals between the first stripline and each of the first and second bowtie antenna cells. A conductive layer in a third plane parallel to the first and second planes serves as a ground plane for signals radiated from/to the first and second bowtie antenna cells.

Abstract translation: 示例性天线阵列具有第一自互补天线单元，例如， bowtie天线，以行和列布置在第一平面中。 另外的蝴蝶结天线单元设置在与第一平面平行的第二平面中并且对齐在相应的行和列中。 设置在第一和第二平面之间的第一带状线将RF信号传送到第一和第二弓状天线单元。 缝隙馈送将RF信号耦合在第一带状线与第一和第二胎圈天线单元中的每一个之间。 平行于第一和第二平面的第三平面中的导电层用作从第一和第二弓形天线单元辐射的信号的接地平面。

公开(公告)号：US20160211585A1

公开(公告)日：2016-07-21

申请号：US14597785

申请日：2015-01-15

Applicant: Northrop Grumman Systems Corporation

Inventor： Loc B. Chau ,  Sudhakar K. Rao ,  Steven J. Mass ,  Dana Quincey

IPC: H01Q21/24 ,  H01Q9/28

CPC classification number: H01Q21/24 ,  H01Q9/285 ,  H01Q21/062

Abstract: An exemplary antenna array has first self-complementary antenna cells, e.g. bowtie antennas, disposed in a first plane in rows and columns. Additional bowtie antenna cells are disposed in a second plane parallel to the first plane and are aligned in corresponding rows and columns. A first stripline disposed between the first and second planes carries RF signals to/from the first and second bowtie antenna cells. A slot feed couples the RF signals between the first stripline and each of the first and second bowtie antenna cells. A conductive layer in a third plane parallel to the first and second planes serves as a ground plane for signals radiated from/to the first and second bowtie antenna cells.

Abstract translation: 示例性天线阵列具有第一自互补天线单元，例如， bowtie天线，以行和列布置在第一平面中。 另外的蝴蝶结天线单元设置在与第一平面平行的第二平面中并且对齐在相应的行和列中。 设置在第一和第二平面之间的第一带状线将RF信号传送到第一和第二弓状天线单元。 缝隙馈送将RF信号耦合在第一带状线与第一和第二胎圈天线单元中的每一个之间。 平行于第一和第二平面的第三平面中的导电层用作从第一和第二弓形天线单元辐射的信号的接地平面。