公开(公告)号：US20160268327A1

公开(公告)日：2016-09-15

申请号：US15161726

申请日：2016-05-23

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  Chi-Chih Huang

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14605 ,  H01L27/14607 ,  H01L27/14612 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14687 ,  H01L27/14689 ,  H01L27/14698 ,  H01L2224/11

Abstract: A curved image sensor system includes (a) an image sensor substrate having a concave light-receiving surface, a pixel array located along the concave light-receiving surface, and a planar external surface facing away from the concave light-receiving surface, (b) a light-transmitting substrate bonded to the image sensor substrate by a bonding layer, and (c) a hermetically sealed cavity, bounded at least by the concave light-receiving surface, the light-transmitting substrate, and the bonding layer.

Abstract translation: 弯曲图像传感器系统包括：（a）具有凹面光接收面的图像传感器基板，沿着凹面受光面设置的像素阵列，以及背离凹面受光面的平面外表面，（b ）通过接合层与所述图像传感器基板接合的透光性基板，以及（c）至少由所述凹面受光面，所述透光性基板和所述接合层限定的气密密封空腔。

公开(公告)号：US20230076598A1

公开(公告)日：2023-03-09

申请号：US18049668

申请日：2022-10-26

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  En-Chi Li ,  Chi-Chih Huang

IPC: H01L27/146

Abstract: An image sensor module comprises an image sensor having a light sensing area, a cover glass for covering the light sensing area, a dam between the image sensor and the cover glass, which surrounds the light sensing area, and has an outer wall and an inner wall, where a cross-section of the inner wall parallel to the surface of the light sensing area of the image sensor forms a sawtooth pattern and/or, where a cross-section of the inner wall orthogonal to the surface of the light sensing area of the image sensor forms an inclined surface.

公开(公告)号：US20190027531A1

公开(公告)日：2019-01-24

申请号：US15654271

申请日：2017-07-19

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  Chi-Chih Huang ,  Yu-Mei Su

IPC: H01L27/146 ,  H04N1/03 ,  H04N5/225

Abstract: An image sensor module comprises: a substrate having a first side and second side, the first side being an opposite of the second side, an image sensor attached to the first side of the substrate, bonding wires to bond the image sensor to pads on the first side of the substrate, a protective structure disposed on the first side of the substrate surrounding the image sensor, the bonding wires, and the pads, the protective structure having a dam and a lid, a cover glass disposed on the protective structure, and a set of solder balls attached to the second side of the substrate.

公开(公告)号：US10185191B2

公开(公告)日：2019-01-22

申请号：US15226731

申请日：2016-08-02

Applicant: OmniVision Technologies, Inc.

Inventor： En-Chi Li ,  Chi-Chih Huang

IPC: G02F1/1362 ,  G02F1/1345

Abstract: A panel carrier includes a substrate, a die-attach region, a short sidewall, and a conductor. The die-attach region is on a top substrate surface of the substrate for supporting the LCoS panel. The short sidewall is on a first side of the die-attach region and has a top sidewall surface at a first height above the top substrate surface exceeding 0.4 millimeters and an aperture spanning the top sidewall surface and the top substrate surface. The conductor at least partially fills the aperture for electrically connecting to the conductive layer. A method for mechanically and electrically connecting a LCoS panel to a panel carrier having a short sidewall includes electrically connecting a transparent conductive layer of the LCoS panel to a conductive material, within the short sidewall, with a conductive adhesive having a thickness, between the transparent conductive layer and the short sidewall, less than two-hundred micrometers.

公开(公告)号：US09679931B2

公开(公告)日：2017-06-13

申请号：US15161726

申请日：2016-05-23

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  Chi-Chih Huang

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14605 ,  H01L27/14607 ,  H01L27/14612 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14687 ,  H01L27/14689 ,  H01L27/14698 ,  H01L2224/11

Abstract: A curved image sensor system includes (a) an image sensor substrate having a concave light-receiving surface, a pixel array located along the concave light-receiving surface, and a planar external surface facing away from the concave light-receiving surface, (b) a light-transmitting substrate bonded to the image sensor substrate by a bonding layer, and (c) a hermetically sealed cavity, bounded at least by the concave light-receiving surface, the light-transmitting substrate, and the bonding layer.

公开(公告)号：US20160148966A1

公开(公告)日：2016-05-26

申请号：US14554970

申请日：2014-11-26

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  Chi-Chih Huang

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14698 ,  H01L2224/05554 ,  H01L2224/24 ,  H01L2224/49175 ,  H01L2924/10156

Abstract: A space-efficient PCB-mountable image sensor includes a semiconductor substrate having a top surface and a side surface, a bond pad on the top surface, and a conductive layer formed on the side surface and electrically connected to the bond pad. A camera module includes a PCB and a space-efficient PCB-mountable image sensor. A conductive layer of the PCB-mountable image sensor is electrically connected between the bond pad and a contact pad of the PCB. A method for fabricating a space-efficient PCB-mountable image sensor includes forming a trench next to an image sensor on a first side of an image sensor wafer, the image sensor including a bond pad. The method also includes forming a conductive layer spanning the bond pad and at least part of a side wall of the trench, and singulating the image sensor wafer along the trench.

Abstract translation: 空间高效的可安装PCB的图像传感器包括具有顶表面和侧表面的半导体衬底，顶表面上的接合焊盘以及形成在侧表面上并电连接到接合焊盘的导电层。 相机模块包括PCB和节省空间的PCB安装图像传感器。 PCB可安装图像传感器的导电层电连接在接合焊盘和PCB的接触焊盘之间。 一种用于制造节省空间的PCB安装图像传感器的方法，包括在图像传感器晶片的第一侧上形成与图像传感器相邻的沟槽，所述图像传感器包括接合焊盘。 该方法还包括形成横跨接合焊盘和沟槽的侧壁的至少一部分的导电层，以及沿沟槽分离图像传感器晶片。

公开(公告)号：US11201124B2

公开(公告)日：2021-12-14

申请号：US16524774

申请日：2019-07-29

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Chia-Ying Liu ,  Wu-Zang Yang ,  Chia-Jung Liu ,  Chi-Chih Huang

IPC: H01L21/762 ,  H01L21/78 ,  H01L23/58 ,  H01L27/146 ,  H01L23/00

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor substrate and a first deep trench isolation (DTI) structure filled with a dielectric material formed on the semiconductor substrate. The first DTI structure is disposed in the first seal ring region and is extended into the semiconductor substrate. The semiconductor substrate has a pixel array region and a first seal ring region. The first seal ring region is proximate to an edge of the semiconductor substrate and surrounds the pixel array region. The first DTI structure is formed in the first seal ring region and surrounds the pixel array region.

公开(公告)号：US10243014B2

公开(公告)日：2019-03-26

申请号：US15899900

申请日：2018-02-20

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  Chi-Chih Huang ,  En-Chi Li

IPC: H01L27/146

Abstract: A method of image sensor package fabrication includes forming a cavity in a ceramic substrate, and placing an image sensor in the cavity in the ceramic substrate. An image sensor processor is also placed in the cavity in the ceramic substrate, and the image sensor and the image sensor processor are wire bonded to electrical contacts. Glue is deposited on the ceramic substrate, and a glass layer is placed on the glue to adhere the glass layer to the ceramic substrate. The image sensor processor and the image sensor are disposed in the cavity between the glass layer and the ceramic substrate.

公开(公告)号：US10163954B2

公开(公告)日：2018-12-25

申请号：US15096136

申请日：2016-04-11

Applicant: OmniVision Technologies, Inc.

Inventor： Yumei Su ,  Chi-Chih Huang ,  Wei-Feng Lin

IPC: H01L27/146 ,  H01L21/78 ,  H01L21/86

Abstract: A trenched device wafer includes a device substrate layer having a top surface; a plurality of devices in the device substrate layer, and a trench in the top surface. The trench extends into the device substrate layer, and is located between a pair of adjacent devices of the plurality of devices. A method for forming a device die from a device wafer includes forming a trench in a top surface of the device wafer between two adjacent devices of the device wafer. The trench has a bottom surface located (a) at a first depth beneath the top surface and (b) at a first height above a wafer bottom surface. The method also includes, after forming the trench, decreasing a thickness of the device wafer, between the two adjacent devices, to a thickness less than the first height.