-
公开(公告)号:US10121809B2
公开(公告)日:2018-11-06
申请号:US15264411
申请日:2016-09-13
Applicant: OmniVision Technologies, Inc.
Inventor: Chin-Poh Pang , Boyang Zhang , Chia-Ying Liu , Wu-Zang Yang , Chih-Wei Hsiung , Chun-Yung Ai
IPC: H01L27/146 , H04N5/374 , H04N9/04
Abstract: A backside-illuminated color image sensor with crosstalk-suppressing color filter array includes (a) a silicon layer including an array of photodiodes and (b) a color filter layer on the light-receiving surface of the silicon layer, wherein the color filter layer includes (i) an array of color filters cooperating with the array of photodiodes to form a respective array of color pixels and (ii) a light barrier grid disposed between the color filters to suppress transmission of light between adjacent ones of the color filters. The light barrier is spatially non-uniform across the color filter layer to account for variation of chief ray angle across the array of color filters.
-
公开(公告)号:US09659989B1
公开(公告)日:2017-05-23
申请号:US15133043
申请日:2016-04-19
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor: Chun-Yung Ai , Chia-Ying Liu , Wu-Zang Yang
IPC: H01L27/146 , H01L21/762
CPC classification number: H01L27/1463 , H01L21/76237 , H01L27/14645 , H01L27/14689
Abstract: An image sensor pixel includes a photodiode disposed in a semiconductor material, and doped regions surrounding the photodiode, at least in part. The doped regions include a doped portion of the semiconductor material. Deep trench isolation structures are disposed in the doped regions, and surround the photodiode at least in part. The deep trench isolation structures include a SiGe layer disposed on side walls of the deep trench isolation structures, a high-k dielectric disposed on the SiGe layer, and a filler material.
-
公开(公告)号:US09735196B2
公开(公告)日:2017-08-15
申请号:US15286392
申请日:2016-10-05
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor: Wu-Zang Yang , Chia-Ying Liu , Chih-Wei Hsiung , Chun-Yung Ai , Dyson H. Tai , Dominic Massetti
IPC: H01L27/146 , H01L49/02
CPC classification number: H01L27/14692 , H01L27/14607 , H01L27/14609 , H01L27/1461 , H01L27/14612 , H01L27/14629 , H01L27/14636 , H01L27/14638 , H01L27/1464 , H01L27/14685 , H01L27/14687 , H01L27/14689 , H01L28/55 , H01L28/56 , H01L28/90
Abstract: A method of fabricating a pixel array includes forming a transistor network along a frontside of a semiconductor substrate. A contact element is formed for every pixel in the pixel array that is electrically coupled to a transistor within the transistor network. An interconnect layer is formed upon the frontside to control the transistor network with a dielectric that covers the contact element. A cavity is formed in the interconnect layer. A conductive layer is formed along cavity walls of the cavity and a dielectric layer is formed over the conductive layer within the cavity. A photosensitive semiconductor material is deposited over the dielectric layer within the cavity. An electrode cavity is formed that extends into the contact element. The electrode cavity is at least partially filled with a conductive material to form an electrode. The electrode, the conductive layer, and the photosensitive semiconductor material form a photosensitive capacitor.
-
公开(公告)号:US20160276380A1
公开(公告)日:2016-09-22
申请号:US14662655
申请日:2015-03-19
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor: Wu-Zang Yang , Chia-Ying Liu , Chih-Wei Hsiung , Chun-Yung Ai , Dyson H. Tai , Dominic Massetti
IPC: H01L27/146
CPC classification number: H01L27/14692 , H01L27/14607 , H01L27/14609 , H01L27/1461 , H01L27/14612 , H01L27/14629 , H01L27/14636 , H01L27/14638 , H01L27/1464 , H01L27/14685 , H01L27/14687 , H01L27/14689 , H01L28/55 , H01L28/56 , H01L28/90
Abstract: An image sensor pixel, and image sensor, and a method of fabricating the same is disclosed. The image pixel includes a photosensitive capacitor and a transistor network. The photosensitive capacitor includes an electrode, a conductive layer, a dielectric layer, and a photosensitive semiconductor material. The conductive layer is disposed around the electrode and the dielectric layer is formed between the conductive layer and the electrode. The photosensitive semiconductor material is for generating an image signal in response to image light and is disposed between the dielectric layer and the electrode. The transistor network is coupled to readout the image signal from the electrode of the photosensitive capacitor.
Abstract translation: 公开了一种图像传感器像素和图像传感器及其制造方法。 图像像素包括光敏电容器和晶体管网络。 感光电容器包括电极,导电层,电介质层和光敏半导体材料。 导电层设置在电极周围,并且介电层形成在导电层和电极之间。 感光半导体材料用于响应于图像光产生图像信号,并且设置在电介质层和电极之间。 晶体管网络被耦合以从光敏电容器的电极读出图像信号。
-
公开(公告)号:US20160099266A1
公开(公告)日:2016-04-07
申请号:US14505923
申请日:2014-10-03
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor: Wei Zheng , Chia-Ying Liu , Chun-Yung Ai , Wu-Zang Yang , Chih-Wei Hsiung , Chen-Wei Lu
IPC: H01L27/146
CPC classification number: H01L27/1463 , H01L27/1462 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/14645 , H01L27/14685
Abstract: An image sensor includes a semiconductor layer with a plurality of photodiodes. A plurality of isolation structures is disposed in the back side of the semiconductor layer between individual photodiodes in the plurality of photodiodes. The plurality of isolation structures extend into the back side of the semiconductor layer a first depth and extend out of the back side of the semiconductor layer a first length. A plurality of light filters is disposed proximate to the back side of the semiconductor layer such that the plurality of isolation structures is disposed between individual light filters in the plurality of light filters. An antireflection coating is also disposed between the semiconductor layer and the plurality of light filters.
Abstract translation: 图像传感器包括具有多个光电二极管的半导体层。 多个隔离结构设置在多个光电二极管中的各个光电二极管之间的半导体层的背面。 多个隔离结构延伸到半导体层的背面第一深度并从半导体层的后侧延伸出第一长度。 多个滤光器设置在半导体层的背面附近,使得多个隔离结构设置在多个滤光器中的各个滤光器之间。 在半导体层和多个滤光器之间还设置防反射涂层。
-
公开(公告)号:US11201124B2
公开(公告)日:2021-12-14
申请号:US16524774
申请日:2019-07-29
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor: Chia-Ying Liu , Wu-Zang Yang , Chia-Jung Liu , Chi-Chih Huang
IPC: H01L21/762 , H01L21/78 , H01L23/58 , H01L27/146 , H01L23/00
Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor substrate and a first deep trench isolation (DTI) structure filled with a dielectric material formed on the semiconductor substrate. The first DTI structure is disposed in the first seal ring region and is extended into the semiconductor substrate. The semiconductor substrate has a pixel array region and a first seal ring region. The first seal ring region is proximate to an edge of the semiconductor substrate and surrounds the pixel array region. The first DTI structure is formed in the first seal ring region and surrounds the pixel array region.
-
公开(公告)号:US20170025468A1
公开(公告)日:2017-01-26
申请号:US15286392
申请日:2016-10-05
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor: Wu-Zang Yang , Chia-Ying Liu , Chih-Wei Hsiung , Chun-Yung Ai , Dyson H. Tai , Dominic Massetti
IPC: H01L27/146
CPC classification number: H01L27/14692 , H01L27/14607 , H01L27/14609 , H01L27/1461 , H01L27/14612 , H01L27/14629 , H01L27/14636 , H01L27/14638 , H01L27/1464 , H01L27/14685 , H01L27/14687 , H01L27/14689 , H01L28/55 , H01L28/56 , H01L28/90
Abstract: A method of fabricating a pixel array includes forming a transistor network along a frontside of a semiconductor substrate. A contact element is formed for every pixel in the pixel array that is electrically coupled to a transistor within the transistor network. An interconnect layer is formed upon the frontside to control the transistor network with a dielectric that covers the contact element. A cavity is formed in the interconnect layer. A conductive layer is formed along cavity walls of the cavity and a dielectric layer is formed over the conductive layer within the cavity. A photosensitive semiconductor material is deposited over the dielectric layer within the cavity. An electrode cavity is formed that extends into the contact element. The electrode cavity is at least partially filled with a conductive material to form an electrode. The electrode, the conductive layer, and the photosensitive semiconductor material form a photosensitive capacitor.
Abstract translation: 制造像素阵列的方法包括沿着半导体衬底的前侧形成晶体管网络。 形成像素阵列中与晶体管网络内的晶体管电耦合的每个像素的接触元件。 在前侧形成互连层,以用覆盖接触元件的电介质来控制晶体管网络。 在互连层中形成空腔。 沿着空腔的空腔壁形成导电层,并且在腔内的导电层上形成电介质层。 感光半导体材料沉积在空腔内的电介质层上。 形成延伸到接触元件的电极腔。 电极腔至少部分地填充有导电材料以形成电极。 电极,导电层和感光半导体材料形成感光电容器。
-
公开(公告)号:US09490282B2
公开(公告)日:2016-11-08
申请号:US14662655
申请日:2015-03-19
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor: Wu-Zang Yang , Chia-Ying Liu , Chih-Wei Hsiung , Chun-Yung Ai , Dyson H. Tai , Dominic Massetti
IPC: H01L27/14 , H01L27/146
CPC classification number: H01L27/14692 , H01L27/14607 , H01L27/14609 , H01L27/1461 , H01L27/14612 , H01L27/14629 , H01L27/14636 , H01L27/14638 , H01L27/1464 , H01L27/14685 , H01L27/14687 , H01L27/14689 , H01L28/55 , H01L28/56 , H01L28/90
Abstract: An image sensor pixel, and image sensor, and a method of fabricating the same is disclosed. The image pixel includes a photosensitive capacitor and a transistor network. The photosensitive capacitor includes an electrode, a conductive layer, a dielectric layer, and a photosensitive semiconductor material. The conductive layer is disposed around the electrode and the dielectric layer is formed between the conductive layer and the electrode. The photosensitive semiconductor material is for generating an image signal in response to image light and is disposed between the dielectric layer and the electrode. The transistor network is coupled to readout the image signal from the electrode of the photosensitive capacitor.
Abstract translation: 公开了一种图像传感器像素和图像传感器及其制造方法。 图像像素包括光敏电容器和晶体管网络。 感光电容器包括电极,导电层,电介质层和光敏半导体材料。 导电层设置在电极周围,并且介电层形成在导电层和电极之间。 感光半导体材料用于响应于图像光产生图像信号,并且设置在电介质层和电极之间。 晶体管网络被耦合以从光敏电容器的电极读出图像信号。
-
公开(公告)号:US11557625B2
公开(公告)日:2023-01-17
申请号:US16853684
申请日:2020-04-20
Applicant: OmniVision Technologies, Inc.
Inventor: Chia-Ying Liu , Wu-Zang Yang , Chia-Jung Liu , Ming Zhang , Yin Qian , Alireza Bonakdar
IPC: H01L27/146 , H01L31/0216 , H01L31/14 , H01L31/0352
Abstract: An image sensor with embedded wells for accommodating light emitters includes a semiconductor substrate including an array of doped sensing regions respectively corresponding to an array of photosensitive pixels of the image sensor. The semiconductor substrate forms an array of wells. Each well is aligned with a respective doped sensing region to facilitate detection, by the photosensitive pixel that includes said respective doped sensing region, of light emitted to the photosensitive pixel by a light emitter disposed in the well. The image sensor further includes, between adjacent doped sensing regions, a light-blocking barrier to reduce propagation of light to the doped sensing-region of each photosensitive pixel from wells not aligned therewith.
-
10.
公开(公告)号:US20180076247A1
公开(公告)日:2018-03-15
申请号:US15264411
申请日:2016-09-13
Applicant: OmniVision Technologies, Inc.
Inventor: Chin-Poh Pang , Boyang Zhang , Chia-Ying Liu , Wu-Zang Yang , Chih-Wei Hsiung , Chun-Yung Ai
IPC: H01L27/146 , H04N5/374 , H04N9/04
CPC classification number: H01L27/14623 , H01L27/14621 , H01L27/14627 , H01L27/14629 , H01L27/1464 , H01L27/14645 , H01L27/14685 , H04N5/374 , H04N9/045
Abstract: A backside-illuminated color image sensor with crosstalk-suppressing color filter array includes (a) a silicon layer including an array of photodiodes and (b) a color filter layer on the light-receiving surface of the silicon layer, wherein the color filter layer includes (i) an array of color filters cooperating with the array of photodiodes to form a respective array of color pixels and (ii) a light barrier grid disposed between the color filters to suppress transmission of light between adjacent ones of the color filters. The light barrier is spatially non-uniform across the color filter layer to account for variation of chief ray angle across the array of color filters
-
-
-
-
-
-
-
-
-