公开(公告)号：US12249804B2

公开(公告)日：2025-03-11

申请号：US17627296

申请日：2020-06-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Boss ,  Herbert Brunner

IPC: H01S5/00 ,  H01S5/0232 ,  H01S5/02326 ,  H01S5/02345 ,  H01S5/068 ,  H01S5/02253

Abstract: The invention relates to an optoelectronic component comprising a housing, an optoelectronic semiconductor chip and an optical element. The housing comprises a lead frame which has two external electrical contact points and two contact portions. The housing also comprises a housing body in which the lead frame is embedded, wherein each contact portion extends laterally out of one of the external electrical contact points in each case to a mounting surface of the housing, and therefore contact surfaces of the contact portions are exposed on the mounting surface. An electrical contact structure of the optical element is electrically conductively connected to the contact surfaces of the contact portions.

公开(公告)号：US20220278501A1

公开(公告)日：2022-09-01

申请号：US17627296

申请日：2020-06-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Boss ,  Herbert Brunner

IPC: H01S5/0232 ,  H01S5/02326 ,  H01S5/02345

Abstract: The invention relates to an optoelectronic component comprising a housing, an optoelectronic semiconductor chip and an optical element. The housing comprises a lead frame which has two external electrical contact points and two contact portions. The housing also comprises a housing body in which the lead frame is embedded, wherein each contact portion extends laterally out of one of the external electrical contact points in each case to a mounting surface of the housing, and therefore contact surfaces of the contact portions are exposed on the mounting surface. An electrical contact structure of the optical element is electrically conductively connected to the contact surfaces of the contact portions.

公开(公告)号：US10950765B2

公开(公告)日：2021-03-16

申请号：US16491146

申请日：2018-03-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Pindl ,  Markus Burger ,  Markus Boss ,  Matthias Lermer

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/00

Abstract: A method for producing at at least an optoelectronic component and an optoelectronic component are disclosed. In an embodiment a method includes providing a substrate having at least one aperture, applying at least one semiconductor chip to the substrate, arranging barrier structures provided that the barrier structures are not already part of the substrate, wherein the semiconductor chip is spaced apart from the barrier structures as seen in a side cross-section, applying an auxiliary carrier at least to a main radiation exit surface and to the barrier structures, introducing a casting material via the at least one aperture in the substrate so that the casting material is arranged between the barrier structures and the semiconductor chip and between the substrate and the auxiliary carrier, and curing the casting material.

公开(公告)号：US10937825B2

公开(公告)日：2021-03-02

申请号：US15959425

申请日：2018-04-23

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Burger ,  Markus Pindl ,  Markus Boss

IPC: H01L27/146 ,  G02B3/08 ,  G02B6/42 ,  G02B6/43 ,  G02B7/02

Abstract: A method of producing an optoelectronic device includes providing an optical element including an optical lens and including a frame, wherein the frame projects with a receptacle section beyond a first side of the lens, the receptacle section of the frame surrounds a receptacle space, and the receptacle section of the frame includes a bearing face at an inner side; inserting an optoelectronic component and a transparent intermediate element into the receptacle space; placing the intermediate element onto the bearing face; and securing the component and the intermediate element to the frame.

公开(公告)号：US20190184655A1

公开(公告)日：2019-06-20

申请号：US16318879

申请日：2017-07-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Marco Wittmann ,  Markus Boss

IPC: B29D11/00

CPC classification number: B29D11/00375 ,  B29D11/00269 ,  B29D11/00413 ,  B29D11/0048

Abstract: A method of producing optical components includes providing an initial carrier including cutouts; carrying out a molding process to form transparent optical molded parts arranged in the cutouts of the initial carrier, wherein a molding compound is introduced into the cutouts of the initial carrier and the molding compound is molded and cured; and singulating the initial carrier including the optical molded parts so that separate optical components are formed that respectively include a carrier produced from the initial carrier and including a cutout, and an optical molded part arranged in the cutout.