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    MIRROR MICROMECHANICAL STRUCTURE AND RELATED MANUFACTURING PROCESS
    11.
    发明申请
    MIRROR MICROMECHANICAL STRUCTURE AND RELATED MANUFACTURING PROCESS 审中-公开
    镜子微观结构及相关制造工艺

    公开(公告)号：US20170031153A1

    公开(公告)日：2017-02-02

    申请号：US15293061

    申请日：2016-10-13

    Applicant: STMicroelectronics S.r.l.

    Inventor： Roberto Carminati ,  Sebastiano Conti ,  Sonia Constantini

    IPC: G02B26/08 ,  H04N5/225 ,  G02B26/10

    CPC classification number: G02B26/0833 ,  G01B11/2518 ,  G02B26/0841 ,  G02B26/085 ,  G02B26/0858 ,  G02B26/105 ,  G03B21/008 ,  H04N5/2254 ,  H04N5/2256 ,  H04N5/2257 ,  H04N13/211 ,  H04N13/236 ,  H04N13/254 ,  Y10T29/49

    Abstract: A mirror micromechanical structure has a mobile mass carrying a mirror element. The mass is drivable in rotation for reflecting an incident light beam with a desired angular range. The mobile mass is suspended above a cavity obtained in a supporting body. The cavity is shaped so that the supporting body does not hinder the reflected light beam within the desired angular range. In particular, the cavity extends as far as a first side edge wall of the supporting body of the mirror micromechanical structure. The cavity is open towards, and in communication with, the outside of the mirror micromechanical structure at the first side edge wall.

    Abstract translation: 镜面微机械结构具有携带镜子元件的移动质量。 质量可旋转驱动，以反射具有期望角度范围的入射光束。 移动块悬挂在支撑体中获得的空腔上方。 空腔的形状使得支撑体不会将反射的光束阻碍在期望的角度范围内。 特别地，腔延伸到反射镜微机械结构的支撑体的第一侧边缘壁。 腔体在第一侧边缘壁处朝着反射镜微机械结构的外部打开并且与其连通。

    ELECTROSTATICALLY DRIVEN MEMS DEVICE
    12.
    发明申请
    ELECTROSTATICALLY DRIVEN MEMS DEVICE 有权
    静电驱动MEMS器件

    公开(公告)号：US20150217990A1

    公开(公告)日：2015-08-06

    申请号：US14607714

    申请日：2015-01-28

    Applicant: STMicroelectronics S.r.l.

    Inventor： Roberto Carminati ,  Sebastiano Conti

    IPC: B81B3/00 ,  G03B21/14 ,  G03B21/20 ,  G03B21/28

    CPC classification number: B81B3/0062 ,  B81B3/0043 ,  B81B7/008 ,  B81B2201/018 ,  B81B2201/033 ,  B81B2201/042 ,  B81B2201/045 ,  B81B2203/058 ,  G02B26/0841 ,  G03B21/142 ,  G03B21/2033 ,  G03B21/28

    Abstract: The MEMS device has a suspended mass supported via a pair of articulation arms by a supporting region. An electrostatic driving system, coupled to the articulation arms, has mobile electrodes and fixed electrodes that are coupled to each other. The electrostatic driving system is formed by two pairs of actuation assemblies, arranged on opposite sides of a respective articulation arm and connected to the articulation arm through connection elements. Each actuation assembly extends laterally to the suspended mass and has an auxiliary arm carrying a respective plurality of mobile electrodes. Each auxiliary arm is parallel to the articulation arms. The connection elements may be rigid or formed by linkages.

    Abstract translation: MEMS器件具有通过支撑区域经由一对关节臂支撑的悬挂质量。 耦合到关节臂的静电驱动系统具有彼此耦合的移动电极和固定电极。 静电驱动系统由两对致动组件形成，这两对致动组件布置在相应的关节臂的相对侧上，并通过连接元件连接到关节臂上。 每个致动组件横向延伸到悬挂质量块，并具有一个载有相应多个移动电极的辅助臂。 每个辅助臂平行于铰接臂。 连接元件可以是刚性的或通过连杆形成。

    Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof
    13.
    发明授权
    Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof 有权
    组装微机电类型的容性声换能器及其包装

    公开(公告)号：US08787600B2

    公开(公告)日：2014-07-22

    申请号：US13861324

    申请日：2013-04-11

    Applicant: STMicroelectronics S.r.l.

    Inventor： Sebastiano Conti ,  Benedetto Vigna ,  Mario Francesco Cortese

    IPC: H04R25/00

    CPC classification number: B81C1/00158 ,  B81B3/0018 ,  B81B7/0061 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R1/04 ,  H04R1/06 ,  H04R1/086 ,  H04R1/2838 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H01L2224/48471 ,  H01L2224/4554 ,  H01L2924/00012

    Abstract: A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers.

    Abstract translation: 微机电声换能器组件具有：集成具有膜的MEMS感测结构的第一模具，其具有与前室相反流体连通的第一表面和与第一表面相对的第二表面，与第一表面流体连通， 微机电声换能器的腔室能够经受作为入射声压波函数的变形，并且面向刚性电极以形成可变电容电容器; 集成了可操作地耦合到MEMS感测结构并且提供作为电容变化的函数的电输出信号的电子阅读电路; 以及包装体，其容纳所述第一模具和所述第二模具，并且具有带有外部电触点的基底基板。 第一和第二骰子堆叠在包装中并机械和电气直接连接在一起; 该包装限定前室和后室中的至少一个。

    Differential-type MEMS acoustic transducer
    15.
    发明授权
    Differential-type MEMS acoustic transducer 有权

    公开(公告)号：US09961451B2

    公开(公告)日：2018-05-01

    申请号：US14858997

    申请日：2015-09-18

    Applicant: STMicroelectronics S.r.l.

    Inventor： Germano Nicollini ,  Silvia Adorno ,  Andrea Barbieri ,  Federica Barbieri ,  Sebastiano Conti ,  Edoardo Marino ,  Sergio Pernici

    IPC: H04R3/00 ,  H04R19/00 ,  H04R19/04 ,  H04R19/02 ,  H04R25/00

    CPC classification number: H04R19/005 ,  H04R19/02 ,  H04R19/04 ,  H04R2201/003 ,  H04R2499/11 ,  H04R2499/15

    Abstract: A MEMS acoustic transducer has: a detection structure, which generates an electrical detection quantity as a function of a detected acoustic signal; and an electronic interface circuit, which is operatively coupled to the detection structure and generates an electrical output quantity as a function of the electrical detection quantity. The detection structure has a first micromechanical structure of a capacitive type and a second micromechanical structure of a capacitive type, each including a membrane that faces and is capacitively coupled to a rigid electrode and defines a respective first detection capacitor and second detection capacitor; the electronic interface circuit defines an electrical connection in series of the first detection capacitor and second detection capacitor between a biasing line and a reference line, and further has a first single-output amplifier and a second single-output amplifier, which are coupled to a respective one of the first detection capacitor and the second detection capacitor and have a respective first output terminal and second output terminal, between which the electrical output quantity is present.

    Microelectromechanical sensing structure for a capacitive acoustic transducer including an element limiting the oscillations of a membrane, and manufacturing method thereof
    19.
    发明授权
    Microelectromechanical sensing structure for a capacitive acoustic transducer including an element limiting the oscillations of a membrane, and manufacturing method thereof 有权
    一种用于电容式声换能器的微机电感测结构，包括限制膜的振荡的元件及其制造方法

    公开(公告)号：US09226079B2

    公开(公告)日：2015-12-29

    申请号：US14220985

    申请日：2014-03-20

    Applicant: STMicroelectronics S.r.l.

    Inventor： Alessandra Sciutti ,  Matteo Perletti ,  Sebastiano Conti ,  Roberto Carminati

    IPC: H04R25/00 ,  H04R19/00 ,  H04R19/04

    CPC classification number: H04R19/005 ,  B81B7/0029 ,  B81B2201/0257 ,  B81B2203/0118 ,  B81B2203/0127 ,  G01L9/0073 ,  H04R19/04

    Abstract: A microelectromechanical sensing structure for a capacitive acoustic transducer, including: a semiconductor substrate; a rigid electrode; and a membrane set between the substrate and the rigid electrode, the membrane having a first surface and a second surface, which are in fluid communication, respectively, with a first chamber and a second chamber, respectively, the first chamber being delimited at least in part by a first wall portion and a second wall portion formed at least in part by the substrate, the second chamber being delimited at least in part by the rigid electrode, the membrane being moreover designed to undergo deformation following upon incidence of pressure waves and facing the rigid electrode so as to form a sensing capacitor having a capacitance that varies as a function of the deformation of the membrane. The structure moreover includes a beam, which is connected to the first and second wall portions and is designed to limit the oscillations of the membrane.

    Abstract translation: 一种用于电容式声换能器的微机电感测结构，包括：半导体衬底; 刚性电极; 以及膜，其设置在所述基底和所述刚性电极之间，所述膜具有第一表面和第二表面，所述第一表面和第二表面分别与第一腔室和第二腔室流体连通，所述第一腔室至少在 部分由第一壁部分和至少部分地由基底形成的第二壁部分，第二室至少部分地由刚性电极限定，该膜还被设计成在压力波入射之后经历变形，并且面向 刚性电极，以形成感测电容器，该感测电容器具有作为膜的变形的函数而变化的电容。 该结构还包括梁，其连接到第一和第二壁部分并被设计成限制膜的振荡。

    CAPACITIVE MICRO-ELECTRO-MECHANICAL FORCE SENSOR AND CORRESPONDING FORCE SENSING METHOD
    20.
    发明申请
    CAPACITIVE MICRO-ELECTRO-MECHANICAL FORCE SENSOR AND CORRESPONDING FORCE SENSING METHOD 有权
    电容式微机电力传感器及相应的力传感方法

    公开(公告)号：US20150135860A1

    公开(公告)日：2015-05-21

    申请号：US14539640

    申请日：2014-11-12

    Applicant: STMicroelectronics S.r.l.

    Inventor： Sebastiano Conti ,  Daniele Prati ,  Domenico Giusti

    IPC: G01L1/14

    CPC classification number: G01L1/142 ,  G01L1/148

    Abstract: A MEMS force sensor has: a substrate; a fixed electrode coupled to the substrate; and a mobile electrode suspended above the substrate at the fixed electrode to define a sensing capacitor, the mobile electrode being designed to undergo deformation due to application of a force to be detected. A dielectric material region is set on the fixed electrode and spaced apart by an air gap from the mobile electrode, in resting conditions. The mobile electrode comes to bear upon the dielectric material region upon application of a minimum detectable value of the force, so that a contact surface between the mobile electrode and the dielectric material region increases, in particular in a substantially linear way, as the force increases.

    Abstract translation: MEMS力传感器具有：基板; 耦合到所述衬底的固定电极; 以及在所述固定电极处悬置在所述基板上方的移动电极，以限定感测电容器，所述移动电极被设计为由于施加要检测的力而发生变形。 在静止状态下，介电材料区域设置在固定电极上并与气动间隙隔开间隔开。 通过施加力的最小可检测值，移动电极承受电介质材料区域，使得当力增加时，移动电极和电介质材料区域之间的接触表面尤其以基本线性的方式增加 。

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