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    Substrate holding apparatus, polishing apparatus, and polishing method
    13.
    发明申请
    Substrate holding apparatus, polishing apparatus, and polishing method 有权
    基板保持装置，抛光装置和抛光方法

    公开(公告)号：US20080318499A1

    公开(公告)日：2008-12-25

    申请号：US12222909

    申请日：2008-08-19

    申请人： Hozumi Yasuda ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

    发明人： Hozumi Yasuda ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

    IPC分类号： B24B1/00

    CPC分类号： B24B37/32

    摘要： A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

    摘要翻译： 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体，以及用于按压研磨面的保持环，保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件，该磁体保持抵靠第一构件。

    Polishing Apparatus
    16.
    发明申请
    Polishing Apparatus 有权
    抛光装置

    公开(公告)号：US20080070479A1

    公开(公告)日：2008-03-20

    申请号：US11665648

    申请日：2005-10-31

    申请人： Osamu Nabeya ,  Tetsuji Togawa ,  Makoto Fukushima ,  Hozumi Yasuda

    发明人： Osamu Nabeya ,  Tetsuji Togawa ,  Makoto Fukushima ,  Hozumi Yasuda

    IPC分类号： B24B49/00 ,  B24B51/00 ,  B24B29/00 ,  B24B5/00

    CPC分类号： B24B37/20 ,  B24B37/005 ,  B24B37/10 ,  B24B37/105 ,  B24B37/30 ,  B24B37/32 ,  B24B47/22 ,  B24B49/00 ,  B24B49/16

    摘要： A polishing apparatus (1) has a polishing pad (22), a top ring (20) for holding a semiconductor wafer (W), a vertical movement mechanism (24) operable to move the top ring (20) in a vertical direction, a distance measuring sensor (46) operable to detect a position of the top ring (20) when a lower surface of the top ring (20) is brought into contact with the polishing pad (22), and a controller (47) operable to calculate an optimal position of the top ring (20) to polish the semiconductor wafer (W) based on the position detected by the distance measuring sensor (46). The vertical movement mechanism (24) includes a ball screw mechanism (30, 32, 38, 42) operable to move the top ring (20) to the optimal position.

    摘要翻译： 抛光装置（1）具有抛光垫（22），用于保持半导体晶片（W）的顶环（20），可垂直移动顶环（20）的垂直运动机构（24） 当所述顶环（20）的下表面与所述抛光垫（22）接触时，所述距离测量传感器（46）可操作以检测所述顶环（20）的位置;以及控制器（47），其可操作以 基于由距离测量传感器（46）检测到的位置，计算顶环（20）的最佳位置以对半导体晶片（W）进行抛光。 垂直运动机构（24）包括可操作以将顶环（20）移动到最佳位置的滚珠丝杆机构（30,32,38,42）。

    Substrate holding apparatus, polishing apparatus, and polishing method
    17.
    发明申请
    Substrate holding apparatus, polishing apparatus, and polishing method 有权
    基板保持装置，抛光装置和抛光方法

    公开(公告)号：US20070232193A1

    公开(公告)日：2007-10-04

    申请号：US11730142

    申请日：2007-03-29

    申请人： Hozumi Yasuda ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

    发明人： Hozumi Yasuda ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

    IPC分类号： B24B51/00

    CPC分类号： B24B37/32

    摘要： A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring comprises a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

    摘要翻译： 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体，以及用于按压研磨面的保持环，保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件，该磁体保持抵靠第一构件。

    Substrate polishing machine
    18.
    发明授权
    Substrate polishing machine 失效
    基材抛光机

    公开(公告)号：US07156725B2

    公开(公告)日：2007-01-02

    申请号：US10481591

    申请日：2002-07-10

    申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    IPC分类号： B24B29/00 ,  B24B5/00

    CPC分类号： B24B37/30 ,  B24B37/32

    摘要： There is provided a substrate polishing machine which comprises a polishing surface and a substrate carrier for holding a substrate and bringing it into contact with the polishing surface. The substrate carrier comprises a carrier body, a substrate holding member for holding a substrate with a surface of the substrate to be polished being directed towards the polishing surface. The substrate holding member is mounted on the carrier body in such a manner that the substrate holding member is movable both towards and away from the polishing surface. The substrate polishing machine further comprises a substrate holding member positioning device provided on a side of the substrate holding member opposite to that used for holding the substrate. The substrate holding member positioning device has a flexible member which defines a chamber, and which, upon introduction of a non-compressible fluid, is expanded in a direction towards the polishing surface.

    摘要翻译： 提供了一种衬底抛光机，其包括抛光表面和用于保持衬底并使其与抛光表面接触的衬底载体。 基板载体包括载体主体，用于保持待抛光基板的表面朝向抛光表面的基板的基板保持构件。 衬底保持构件以使得衬底保持构件能够朝向和远离抛光表面移动的方式安装在载体主体上。 基板研磨机还包括基板保持部件定位装置，该基板保持部件定位装置设置在基板保持部件的与保持基板相同的一侧。 衬底保持构件定位装置具有限定腔室的柔性构件，并且在引入不可压缩流体时沿朝向抛光表面的方向膨胀。

    Substrate holding apparatus
    19.
    发明授权
    Substrate holding apparatus 有权
    基板保持装置

    公开(公告)号：US07083507B2

    公开(公告)日：2006-08-01

    申请号：US11028629

    申请日：2005-01-05

    申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    IPC分类号： B24B7/22

    CPC分类号： B24B37/30 ,  B24B41/061

    摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

    摘要翻译： 本发明涉及一种用于保持待抛光的基板并将基板压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于与基板接触的弹性垫，以及用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于与弹性垫接触的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。

    Polishing method and polishing apparatus
    20.
    发明申请
    Polishing method and polishing apparatus 有权
    抛光方法和抛光装置

    公开(公告)号：US20090191791A1

    公开(公告)日：2009-07-30

    申请号：US12320471

    申请日：2009-01-27

    申请人： Makoto Fukushima ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Osamu Nabeya ,  Shingo Saito

    发明人： Makoto Fukushima ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Osamu Nabeya ,  Shingo Saito

    IPC分类号： B24B1/00 ,  B24B49/10 ,  B24B57/02

    CPC分类号： B24B37/345

    摘要： A polishing method can safely detach and lift up a workpiece from a polishing surface without carrying out the operation of making the workpiece overhang the polishing surface. The polishing method includes carrying out processing of a surface to be polished of a workpiece by supplying a liquid to a polishing surface while pressing the surface to be polished of the workpiece held by a holding device against the polishing surface and moving the workpiece and the polishing surface relative to each other, attracting the workpiece after the processing to the holding device while supplying the liquid to the polishing surface at a decreased flow rate, thereby detaching the workpiece from the polishing surface, and lifting up the holding device together with the workpiece on confirmation of detachment of the workpiece from the polishing surface and attachment of the workpiece to the holding device.

    摘要翻译： 抛光方法可以安全地从抛光表面上分离和提起工件，而不必进行使工件伸出抛光表面的操作。 抛光方法包括：通过向抛光表面供给液体来进行待研磨表面的加工，同时将由保持装置保持的工件的待抛光表面压在抛光表面上并移动工件和抛光 相对于彼此的表面，在将处理后的工件吸收到保持装置的同时，以降低的流量向抛光表面供给液体，从而将工件从抛光表面分离，并将工件与工件一起提起 确认工件与抛光表面分离并将工件附着到保持装置上。