HOUSING OF AN ELECTRONIC DEVICE AND METHOD FOR MAKING SAME
    14.
    发明申请
    HOUSING OF AN ELECTRONIC DEVICE AND METHOD FOR MAKING SAME 审中-公开
    电子设备的外壳及其制造方法

    公开(公告)号:US20110222214A1

    公开(公告)日:2011-09-15

    申请号:US12904239

    申请日:2010-10-14

    CPC classification number: H05K5/0017 B29C45/14434 B29C45/1671 B29L2031/3481

    Abstract: A housing of the electronic device includes a transparent window frame, a first housing unit, and a second housing unit. The window frame has a internal surface and a peripheral wall; The first housing unit integrally joins to the peripheral wall of the window frame by injection molding; The second housing unit integrally joins to the internal surface of the window frame to form a window area, the second housing unit integrally joins to the internal surface of the first housing unit.

    Abstract translation: 电子设备的外壳包括透明窗框,第一外壳单元和第二外壳单元。 窗框具有内表面和周壁; 第一壳体单元通过注模成型连接到窗框的周壁; 第二壳体单元一体地连接到窗框的内表面以形成窗口区域,第二壳体单元一体地连接到第一壳体单元的内表面。

    ELECTRONIC DEVICE HOUSING AND METHOD FOR MANUFACTURING THE SAME
    16.
    发明申请
    ELECTRONIC DEVICE HOUSING AND METHOD FOR MANUFACTURING THE SAME 有权
    电子设备外壳及其制造方法

    公开(公告)号:US20130321988A1

    公开(公告)日:2013-12-05

    申请号:US13709472

    申请日:2012-12-10

    Abstract: An electronic device housing includes a plastic substrate. The plastic substrate includes a first surface. The electronic device housing further includes an activating layer formed on the first surface. The activating layer contains metal powder. The activating layer defines a recessed portion. Some of the metal powder is partially exposed on the surface of the recessed portion. Some of metal powder is partially inserted into the plastic substrate corresponding to the recessed portion. The electronic device housing further includes an antenna layer formed on the recessed portion. The antenna layer is a metal layer. A method for manufacturing the electronic device housing is also disclosed.

    Abstract translation: 电子设备外壳包括塑料基板。 塑料基板包括第一表面。 电子设备壳体还包括形成在第一表面上的激活层。 活化层含有金属粉末。 激活层限定凹陷部分。 一些金属粉末部分露出在凹部的表面上。 一些金属粉末部分地插入到与凹部对应的塑料基板中。 电子设备壳体还包括形成在凹部上的天线层。 天线层是金属层。 还公开了一种用于制造电子设备外壳的方法。

    METHOD FOR MAKING PATTERNS ON METAL ARTICLE AND THE RESULTING METAL ARTICLE
    17.
    发明申请
    METHOD FOR MAKING PATTERNS ON METAL ARTICLE AND THE RESULTING METAL ARTICLE 审中-公开
    用于制作金属件和结构金属件的图案的方法

    公开(公告)号:US20130171473A1

    公开(公告)日:2013-07-04

    申请号:US13571518

    申请日:2012-08-10

    Abstract: A method for making patterns on a metal article comprises providing a metal substrate having an outer surface. A light-absorbing coating is formed on selected regions of the outer surface to reduce the surface laser reflectivity of the metal substrate. The selected regions cooperatively have a shape of a desired pattern. The selected regions are treated by laser-quenching, thereby hardening the selected regions. The outer surface is sandblasted, enabling the outer surface besides the selected regions to have a greater surface roughness than the selected regions. A metal article made by the method is also provided.

    Abstract translation: 在金属制品上制作图案的方法包括提供具有外表面的金属基底。 在外表面的选定区域上形成光吸收涂层,以减少金属基板的表面激光反射率。 所选择的区域协同地具有期望图案的形状。 通过激光淬火处理所选择的区域,从而硬化所选择的区域。 外表面经过喷砂处理,除了选定区域之外,外表面具有比所选区域更大的表面粗糙度。 还提供了通过该方法制成的金属制品。

    DEVICE HOUSING AND METHOD FOR MAKING THE DEVICE HOUSING
    18.
    发明申请
    DEVICE HOUSING AND METHOD FOR MAKING THE DEVICE HOUSING 审中-公开
    用于制造设备外壳的设备外壳和方法

    公开(公告)号:US20130049557A1

    公开(公告)日:2013-02-28

    申请号:US13332583

    申请日:2011-12-21

    CPC classification number: H05K5/0243

    Abstract: A device housing includes a stainless steel substrate having a first metallic coating and a second metallic coating formed thereon and in that order. The stainless steel substrate has at least one recess defined in an outer surface. The first metallic coating and a second metallic coating have different colors. The first metallic coating is left exposed in the recesses but covered elsewhere by the second metallic coating to form a desired symbol, logo, or pattern on the device housing. A method for making the present device housing also is provided.

    Abstract translation: 装置壳体包括具有第一金属涂层和其上形成的第二金属涂层的不锈钢衬底并且依次。 不锈钢基材具有限定在外表面中的至少一个凹部。 第一金属涂层和第二金属涂层具有不同的颜色。 第一金属涂层被露出在凹槽中,但被其他地方覆盖在第二金属涂层上,以在装置壳体上形成所需的符号,标志或图案。 还提供了一种制造本装置壳体的方法。

    HOUSING FOR ELECTRONIC DEVICES AND METHOD FOR MAKING THE SAME
    19.
    发明申请
    HOUSING FOR ELECTRONIC DEVICES AND METHOD FOR MAKING THE SAME 审中-公开
    用于电子设备的外壳及其制造方法

    公开(公告)号:US20110233094A1

    公开(公告)日:2011-09-29

    申请号:US12911839

    申请日:2010-10-26

    Abstract: A housing includes a hollow sleeve, a top wall, and a cover. The top wall is integrally formed with the hollow sleeve. The top wall seals an end of the hollow sleeve to define a receiving chamber. An open end is formed at an opposite end of the top wall. The open end communicates with the receiving chamber. The hollow sleeve and the top wall include a transparent first molded article, a decorative layer, and a transparent second molded article. The decorative layer partially is formed on the transparent first molded article, and a transparent display window of the transparent first molded article is exposed from the decorative layer. The transparent second molded article is formed on the decorative layer and the transparent display window. The cover seals the open end. The present disclosure further discloses a method for making the housing.

    Abstract translation: 壳体包括中空套管,顶壁和盖子。 顶壁与中空套筒一体形成。 顶壁密封中空套筒的端部以限定接收室。 开口端形成在顶壁的相对端。 开口端与接收室连通。 中空套筒和顶壁包括透明的第一模塑制品,装饰层和透明的第二模塑制品。 装饰层部分地形成在透明的第一模制品上,并且透明的第一模制品的透明显示窗从装饰层露出。 透明的第二模制品形成在装饰层和透明显示窗上。 盖子封闭开口端。 本公开还公开了一种用于制造壳体的方法。

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