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    Electronic device housing and method for manufacturing the same
    1.
    发明授权
    Electronic device housing and method for manufacturing the same 有权
    电子设备外壳及其制造方法

    公开(公告)号：US09241435B2

    公开(公告)日：2016-01-19

    申请号：US13709472

    申请日：2012-12-10

    Applicant: Po-Feng Ho ,  Shi-Jie Yan

    Inventor： Po-Feng Ho ,  Shi-Jie Yan

    IPC: H05K1/03 ,  H05K13/00 ,  H05K7/00 ,  H01Q1/40 ,  H05K3/18

    CPC classification number: H05K13/00 ,  H01Q1/40 ,  H05K3/184 ,  H05K7/00 ,  H05K2201/0236 ,  H05K2201/0999

    Abstract: An electronic device housing includes a plastic substrate. The plastic substrate includes a first surface. The electronic device housing further includes an activating layer formed on the first surface. The activating layer contains metal powder. The activating layer defines a recessed portion. Some of the metal powder is partially exposed on the surface of the recessed portion. Some of metal powder is partially inserted into the plastic substrate corresponding to the recessed portion. The electronic device housing further includes an antenna layer formed on the recessed portion. The antenna layer is a metal layer. A method for manufacturing the electronic device housing is also disclosed.

    Abstract translation: 电子设备外壳包括塑料基板。 塑料基板包括第一表面。 电子设备壳体还包括形成在第一表面上的激活层。 活化层含有金属粉末。 激活层限定凹陷部分。 一些金属粉末部分露出在凹部的表面上。 一些金属粉末部分地插入到与凹部对应的塑料基板中。 电子设备壳体还包括形成在凹部上的天线层。 天线层是金属层。 还公开了一种用于制造电子设备外壳的方法。

    ELECTRONIC DEVICE HOUSING AND METHOD FOR MANUFACTURING THE SAME
    3.
    发明申请
    ELECTRONIC DEVICE HOUSING AND METHOD FOR MANUFACTURING THE SAME 有权
    电子设备外壳及其制造方法

    公开(公告)号：US20130321988A1

    公开(公告)日：2013-12-05

    申请号：US13709472

    申请日：2012-12-10

    Applicant: PO-FENG HO ,  SHI-JIE YAN

    Inventor： PO-FENG HO ,  SHI-JIE YAN

    IPC: H05K13/00 ,  H05K7/00

    CPC classification number: H05K13/00 ,  H01Q1/40 ,  H05K3/184 ,  H05K7/00 ,  H05K2201/0236 ,  H05K2201/0999

    Abstract: An electronic device housing includes a plastic substrate. The plastic substrate includes a first surface. The electronic device housing further includes an activating layer formed on the first surface. The activating layer contains metal powder. The activating layer defines a recessed portion. Some of the metal powder is partially exposed on the surface of the recessed portion. Some of metal powder is partially inserted into the plastic substrate corresponding to the recessed portion. The electronic device housing further includes an antenna layer formed on the recessed portion. The antenna layer is a metal layer. A method for manufacturing the electronic device housing is also disclosed.

    Abstract translation: 电子设备外壳包括塑料基板。 塑料基板包括第一表面。 电子设备壳体还包括形成在第一表面上的激活层。 活化层含有金属粉末。 激活层限定凹陷部分。 一些金属粉末部分露出在凹部的表面上。 一些金属粉末部分地插入到与凹部对应的塑料基板中。 电子设备壳体还包括形成在凹部上的天线层。 天线层是金属层。 还公开了一种用于制造电子设备外壳的方法。

    METHOD FOR MAKING PATTERNS ON METAL ARTICLE AND THE RESULTING METAL ARTICLE
    4.
    发明申请
    METHOD FOR MAKING PATTERNS ON METAL ARTICLE AND THE RESULTING METAL ARTICLE 审中-公开
    用于制作金属件和结构金属件的图案的方法

    公开(公告)号：US20130171473A1

    公开(公告)日：2013-07-04

    申请号：US13571518

    申请日：2012-08-10

    Applicant: QUAN ZHOU ,  GUI-YUN YANG ,  XIN-WU GUAN ,  PO-FENG HO

    Inventor： QUAN ZHOU ,  GUI-YUN YANG ,  XIN-WU GUAN ,  PO-FENG HO

    IPC: B05D5/06 ,  B05D3/12 ,  B32B15/01 ,  B05D3/06

    CPC classification number: H05K5/0252 ,  B24C1/06 ,  C21D7/04 ,  C21D10/005 ,  H05K5/0243 ,  Y10T428/12993

    Abstract: A method for making patterns on a metal article comprises providing a metal substrate having an outer surface. A light-absorbing coating is formed on selected regions of the outer surface to reduce the surface laser reflectivity of the metal substrate. The selected regions cooperatively have a shape of a desired pattern. The selected regions are treated by laser-quenching, thereby hardening the selected regions. The outer surface is sandblasted, enabling the outer surface besides the selected regions to have a greater surface roughness than the selected regions. A metal article made by the method is also provided.

    Abstract translation: 在金属制品上制作图案的方法包括提供具有外表面的金属基底。 在外表面的选定区域上形成光吸收涂层，以减少金属基板的表面激光反射率。 所选择的区域协同地具有期望图案的形状。 通过激光淬火处理所选择的区域，从而硬化所选择的区域。 外表面经过喷砂处理，除了选定区域之外，外表面具有比所选区域更大的表面粗糙度。 还提供了通过该方法制成的金属制品。

    DEVICE HOUSING AND METHOD FOR MAKING THE DEVICE HOUSING
    5.
    发明申请
    DEVICE HOUSING AND METHOD FOR MAKING THE DEVICE HOUSING 审中-公开
    用于制造设备外壳的设备外壳和方法

    公开(公告)号：US20130049557A1

    公开(公告)日：2013-02-28

    申请号：US13332583

    申请日：2011-12-21

    Applicant: PO-FENG HO ,  XIN-WU GUAN ,  CHAO-SHENG HUANG

    Inventor： PO-FENG HO ,  XIN-WU GUAN ,  CHAO-SHENG HUANG

    IPC: H05K5/02 ,  B05D3/06 ,  B05D5/00 ,  B05D3/10

    CPC classification number: H05K5/0243

    Abstract: A device housing includes a stainless steel substrate having a first metallic coating and a second metallic coating formed thereon and in that order. The stainless steel substrate has at least one recess defined in an outer surface. The first metallic coating and a second metallic coating have different colors. The first metallic coating is left exposed in the recesses but covered elsewhere by the second metallic coating to form a desired symbol, logo, or pattern on the device housing. A method for making the present device housing also is provided.

    Abstract translation: 装置壳体包括具有第一金属涂层和其上形成的第二金属涂层的不锈钢衬底并且依次。 不锈钢基材具有限定在外表面中的至少一个凹部。 第一金属涂层和第二金属涂层具有不同的颜色。 第一金属涂层被露出在凹槽中，但被其他地方覆盖在第二金属涂层上，以在装置壳体上形成所需的符号，标志或图案。 还提供了一种制造本装置壳体的方法。

    HOUSING FOR ELECTRONIC DEVICES AND METHOD FOR MAKING THE SAME
    6.
    发明申请
    HOUSING FOR ELECTRONIC DEVICES AND METHOD FOR MAKING THE SAME 审中-公开
    用于电子设备的外壳及其制造方法

    公开(公告)号：US20110233094A1

    公开(公告)日：2011-09-29

    申请号：US12911839

    申请日：2010-10-26

    Applicant: KAI-RONG LIAO ,  PENG-CHENG TONG ,  PO-FENG HO ,  SHIH-WEI YANG

    Inventor： KAI-RONG LIAO ,  PENG-CHENG TONG ,  PO-FENG HO ,  SHIH-WEI YANG

    IPC: B65D85/00 ,  B29C45/14

    CPC classification number: H05K5/0243 ,  B29C45/14811 ,  B29C45/1671 ,  B29C2045/1673 ,  B29K2995/002 ,  B29K2995/0026 ,  B29K2995/0087 ,  B29L2031/3481

    Abstract: A housing includes a hollow sleeve, a top wall, and a cover. The top wall is integrally formed with the hollow sleeve. The top wall seals an end of the hollow sleeve to define a receiving chamber. An open end is formed at an opposite end of the top wall. The open end communicates with the receiving chamber. The hollow sleeve and the top wall include a transparent first molded article, a decorative layer, and a transparent second molded article. The decorative layer partially is formed on the transparent first molded article, and a transparent display window of the transparent first molded article is exposed from the decorative layer. The transparent second molded article is formed on the decorative layer and the transparent display window. The cover seals the open end. The present disclosure further discloses a method for making the housing.

    Abstract translation: 壳体包括中空套管，顶壁和盖子。 顶壁与中空套筒一体形成。 顶壁密封中空套筒的端部以限定接收室。 开口端形成在顶壁的相对端。 开口端与接收室连通。 中空套筒和顶壁包括透明的第一模塑制品，装饰层和透明的第二模塑制品。 装饰层部分地形成在透明的第一模制品上，并且透明的第一模制品的透明显示窗从装饰层露出。 透明的第二模制品形成在装饰层和透明显示窗上。 盖子封闭开口端。 本公开还公开了一种用于制造壳体的方法。

    Positioning mechanism for use in mold structure
    7.
    发明授权
    Positioning mechanism for use in mold structure 失效
    用于模具结构的定位机构

    公开(公告)号：US08007265B2

    公开(公告)日：2011-08-30

    申请号：US12164257

    申请日：2008-06-30

    Applicant: Juan-Rong Wu ,  Po-Feng Ho ,  Zhi-Zhong Xiao ,  Guan-Qun Zeng ,  Bo Zhang ,  Kao-Hua Guan

    Inventor： Juan-Rong Wu ,  Po-Feng Ho ,  Zhi-Zhong Xiao ,  Guan-Qun Zeng ,  Bo Zhang ,  Kao-Hua Guan

    IPC: B29C45/14 ,  B29C70/78

    CPC classification number: B29C45/14065 ,  B29C45/14688 ,  B29C2045/14918 ,  B29L2031/3437

    Abstract: A positioning mechanism (24) for use in a mold structure (100) to position a film (30) within the mold structure is provided. The mold structure includes a core mold portion (10) and a cavity mold portion (20) mating with the core mold portion. The core mold portion includes a core plate (12) and a core insert (14) formed on the plate. The cavity mold portion includes a positioning mechanism having a moveable cavity insert (242) and an elastic member (244) for outwardly biasing the cavity insert.

    Abstract translation: 提供了一种用于在模具结构（100）中将膜（30）定位在模具结构内的定位机构（24）。 模具结构包括芯模部分（10）和与芯模部分配合的模腔部分（20）。 芯模部分包括芯板（12）和形成在板上的芯插入件（14）。 空腔模具部分包括定位机构，该定位机构具有可移动的空腔插入件（242）和用于向外偏压空腔插入件的弹性构件（244）。

    Method for strengthening housing and housing made by same
    10.
    发明授权
    Method for strengthening housing and housing made by same 有权
    加强住房和住房的方法

    公开(公告)号：US09156732B2

    公开(公告)日：2015-10-13

    申请号：US13451808

    申请日：2012-04-20

    Applicant: Ren-Bo Wang ,  Xin-Wu Guan ,  Po-Feng Ho

    Inventor： Ren-Bo Wang ,  Xin-Wu Guan ,  Po-Feng Ho

    IPC: C03C21/00 ,  H05K5/00

    CPC classification number: C03C21/00 ,  C03C21/002 ,  H05K5/00 ,  Y10T428/13 ,  Y10T428/131 ,  Y10T428/1314 ,  Y10T428/1317

    Abstract: A method for strengthening a housing comprises the following steps: providing a housing being made of colored glaze and having an initial temperature of about 480° C. to about 550° C.; and spraying the surface of the housing using a spray solution containing potassium nitrate, potassium silicate, diatomite, and water to create an exterior layer on the surface. The exterior layer contains K+ ions, and the concentration of the K+ ions gradually decreases from a maximum value in the area of the outside surface of the exterior layer to zero in the area of the inside of the housing.

    Abstract translation: 一种用于加强壳体的方法包括以下步骤：提供由有色釉料制成的壳体，其初始温度为约480℃至约550℃; 并使用含有硝酸钾，硅酸钾，硅藻土和水的喷雾溶液喷涂壳体的表面，以在表面上形成外部层。 外层含有K +离子，并且K +离子的浓度从外层的外表面的面积的最大值逐渐减小到在壳体内部的区域中的零。

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