公开(公告)号：US20190221479A1

公开(公告)日：2019-07-18

申请号：US16246627

申请日：2019-01-14

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Shogo OKITA ,  Atsushi HARIKAI ,  Noriyuki MATSUBARA ,  Hidefumi SAEKI ,  Akihiro ITOU

IPC: H01L21/78 ,  H01L21/3065 ,  H01L21/683 ,  H01L21/56

CPC classification number: H01L21/78 ,  H01L21/3065 ,  H01L21/561 ,  H01L21/6836

Abstract: A manufacturing process of an element chip comprises steps of preparing a substrate including dicing regions and element regions, attaching a holding sheet held on a frame with a die attach film in between, forming a protective film covering the substrate, forming a plurality of grooves in the protective film along the dicing regions, plasma-etching the substrate to expose the die attach film and then die attach film along the dicing regions, and picking up each of the element chips along with the separated die attach film away from the holding sheet, wherein the die attach film has an area greater than that of the substrate, and wherein the protective film includes a first covering portion covering the substrate and a second covering portion covering at least a portion of the die attach film that extends beyond an outer edge of the substrate.

公开(公告)号：US20180326537A1

公开(公告)日：2018-11-15

申请号：US15962056

申请日：2018-04-25

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hidehiko KARASAKI ,  Hidefumi SAEKI

IPC: B23K26/142

CPC classification number: B23K26/142

Abstract: Provided is a laser processing apparatus comprises a stage holding a substrate, the stage being movable in a first direction, a laser beam source radiating a laser beam onto the substrate, a dust-suction duct having a first optical path extending in a second direction perpendicular to the first direction, the laser beam travelling along the first optical path thereof, and an air aspirator aspirating an air toward a direction opposite to the first direction, wherein the dust-suction duct includes a pair of air-guiding plates opposed to each other along a third direction perpendicular to the first and second directions, and wherein the pair of the air-guiding plates are configured to have a gap therebetween such that it is narrowest in an optical path region and gets wider as it is far away from the optical path region in upstream and downstream regions thereof.

公开(公告)号：US20180197777A1

公开(公告)日：2018-07-12

申请号：US15860827

申请日：2018-01-03

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hidehiko KARASAKI ,  Hidefumi SAEKI ,  Atsushi HARIKAI

IPC: H01L21/78 ,  H01L23/544 ,  H01L21/268 ,  H01L21/3065 ,  H01L21/02 ,  B23K26/00

CPC classification number: H01L21/78 ,  B23K26/062 ,  B23K26/359 ,  B23K2103/56 ,  H01J37/321 ,  H01J2237/334 ,  H01L21/02076 ,  H01L21/268 ,  H01L21/3065 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/82 ,  H01L23/544 ,  H01L2223/5446

Abstract: Provided is a manufacturing process of an element chip, which comprises a preparation step for preparing a substrate including a semiconductor layer having first and second sides and a wiring layer on the first side thereof, the substrate having a plurality of dicing regions and element regions defined by the dicing regions, a scribing step for radiating a laser beam towards the first side of the wiring layer onto the dicing regions to form apertures exposing the semiconductor layer along the dicing regions, and a dicing step for dicing the substrate along the apertures into a plurality of the element chips, wherein the laser beam has a beam profile having a M-shaped distribution whose peripheral intensity is greater than a central intensity in a width direction of the laser beam along the dicing regions.