公开(公告)号：US11877041B2

公开(公告)日：2024-01-16

申请号：US16937397

申请日：2020-07-23

Applicant: QUALCOMM Incorporated

Inventor： Russell Gruhlke ,  Ravindra Vaman Shenoy ,  Jon Lasiter ,  Donald William Kidwell ,  Khurshid Syed Alam ,  Kebin Li

IPC: H04N23/45 ,  H04N23/55 ,  G01J1/42 ,  G02B13/18

CPC classification number: H04N23/45 ,  G01J1/42 ,  G02B13/18 ,  H04N23/55

Abstract: An image sensor including a planar sensor array, a lens configured to form an optical image on the planar sensor array and characterized by a locus of focal points on a curved surface, and a cover glass with multiple thickness levels or multiple cover glasses of different sizes. The one or more cover glasses are configured to shift the locus of focal points for large field angles, such that there are multiple intersections between the planar sensor array and the locus of focal points for a large FOV, and thus multiple zones with best focus on the planar sensor array.

公开(公告)号：US20220077586A1

公开(公告)日：2022-03-10

申请号：US17016196

申请日：2020-09-09

Applicant: Qualcomm Incorporated

Inventor： Seong Heon Jeong ,  Mohammad Ali Tassoudji ,  Jeremy Darren Dunworth ,  Jon Lasiter ,  Ravindra Vaman Shenoy

IPC: H01Q9/04 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q21/24

Abstract: An apparatus is disclosed for an antenna with a conductive cage. In an example aspect, the apparatus includes a ground plane with at least one opening. The apparatus also includes at least one antenna assembly with at least one radiating element, at least one feed via, and a conductive cage. The radiating element is implemented on a first plane that is substantially parallel to the ground plane. The feed via is connected to the at least one radiating element and is configured to connect to at least one transmission line through the opening. The conductive cage includes at least three ground vias, which are connected to the ground plane at positions that are distributed around the opening. Lengths of the at least three ground vias extend a portion of a distance between the ground plane and the radiating element.

公开(公告)号：US11228086B2

公开(公告)日：2022-01-18

申请号：US16004466

申请日：2018-06-11

Applicant: QUALCOMM Incorporated

Inventor： Jon Lasiter ,  Ravindra Vaman Shenoy ,  Mohammad Ali Tassoudji ,  Seong Heon Jeong ,  Jeremy Darren Dunworth

IPC: H01Q1/22 ,  H01Q21/06 ,  H01L23/66 ,  H01Q9/06

Abstract: An antenna package comprising a chip package including a plurality of feed lines, a first half antenna subassembly electrically coupled to the feed lines, and a second half antenna subassembly electrically coupled to the feed lines, wherein the first and second half antenna subassemblies point away from each other in a direction substantially perpendicular to the chip package. The antenna subassemblies may be millimeter (mm) wave antennas covering from approximately 24 to 43.5 GHz. The antenna subassemblies include a flex substrate formed from printed circuit boards (PCB) or flex-film PCB.

公开(公告)号：US10722918B2

公开(公告)日：2020-07-28

申请号：US15254593

申请日：2016-09-01

Applicant: QUALCOMM Incorporated

Inventor： Donald William Kidwell, Jr. ,  Ravindra Shenoy ,  Jon Lasiter

IPC: B81B7/04 ,  H01L41/332 ,  B06B1/02 ,  B81C1/00 ,  B81B3/00 ,  B06B1/06

Abstract: Methods, systems, computer-readable media, and apparatuses for high density Micro-Electro-Mechanical Systems (MEMS) are presented. In some embodiments, a method for manufacturing a micro-electro-mechanical device on a substrate can comprise etching a release via through a layer of the device. The method can further comprise creating a cavity in the layer of the device using the release via as a conduit to access the desired location of the cavity, the cavity enabling movement of a transducer of the device. The method can then comprise depositing low impedance, electrically conductive material into the release via to form an electrically conductive path through the layer. Finally, the method can comprise electrically coupling the electrically conductive material to an electrode of the transducer.

公开(公告)号：US10394004B2

公开(公告)日：2019-08-27

申请号：US15275148

申请日：2016-09-23

Applicant: QUALCOMM Incorporated

Inventor： Todor Georgiev Georgiev ,  Wen-Yu Sun ,  Zheng-wu Li ,  Jon Lasiter

IPC: G02B27/10 ,  G02B13/00 ,  B32B37/12 ,  G02B5/00 ,  G02B27/00

Abstract: An optical system may include a lens assembly that has two or more single-sided wafer level optics (WLO) lenses arranged to propagate light. The optical system can further include an image sensor, wherein the lens assembly is arranged relative to the image sensor to propagate light received at a first surface of the lens assembly, through the two or more single-sided WLO lenses and to the image sensor. In some embodiments, the optical system further includes a camera which includes the lens assembly and the image sensor. In various embodiments, a smart phone, a tablet computer, or another mobile computing device may include such a camera. In some embodiments, the at least two single-sided wafer level optics (WLO) lenses are each separated by a gap G, wherein the gap may be different between each of the single-sided lenses, and the gap G may be zero.

公开(公告)号：US20170285308A1

公开(公告)日：2017-10-05

申请号：US15275148

申请日：2016-09-23

Applicant: QUALCOMM Incorporated

Inventor： Todor Georgiev Georgiev ,  Wen-Yu Sun ,  Zheng-wu Li ,  Jon Lasiter

IPC: G02B13/00 ,  B32B37/12

CPC classification number: G02B13/0085 ,  B32B37/12 ,  B32B2307/40 ,  G02B5/005 ,  G02B13/0045 ,  G02B27/0025

Abstract: An optical system may include a lens assembly that has two or more single-sided wafer level optics (WLO) lenses arranged to propagate light. The optical system can further include an image sensor, wherein the lens assembly is arranged relative to the image sensor to propagate light received at a first surface of the lens assembly, through the two or more single-sided WLO lenses and to the image sensor. In some embodiments, the optical system further includes a camera which includes the lens assembly and the image sensor. In various embodiments, a smart phone, a tablet computer, or another mobile computing device may include such a camera. In some embodiments, the at least two single-sided wafer level optics (WLO) lenses are each separated by a gap G, wherein the gap may be different between each of the single-sided lenses, and the gap G may be zero.

公开(公告)号：US20170256699A1

公开(公告)日：2017-09-07

申请号：US15262721

申请日：2016-09-12

Applicant: QUALCOMM Incorporated

Inventor： Donald William Kidwell, JR. ,  Ravindra Shenoy ,  Jon Lasiter

IPC: H01L41/113 ,  H01L41/187 ,  H01L41/23 ,  H01L41/277 ,  B06B1/06 ,  H01L41/04 ,  H01L41/083 ,  H01L41/047

CPC classification number: H01L41/1132 ,  A61B1/041 ,  A61B8/12 ,  A61B8/4472 ,  A61B8/4483 ,  A61B8/4494 ,  B06B1/0622 ,  G10K11/004 ,  H01L41/042 ,  H01L41/0472 ,  H01L41/083 ,  H01L41/187 ,  H01L41/23 ,  H01L41/277

Abstract: Embodiments of a sensor device and methods for manufacturing the same are disclosed. In one embodiment, a sensor device comprises a piezoelectric micromechanical ultrasonic transducer (PMUT) array configured to transmit and receive ultrasonic signals, where the PMUT array comprises a plurality of PMUTs and the PMUT array is flexible, one or more integrated circuits configured to process the ultrasonic signals, a battery configured to provide power to the PMUT array and the one or more integrated circuits, a coupling material configured to hold the PMUT array, the one or more integrated circuits, and the battery, and a capsule configured to seal the PMUT array, the one or more integrated circuits, the battery and the coupling material within the capsule.

公开(公告)号：US20170066014A1

公开(公告)日：2017-03-09

申请号：US15254593

申请日：2016-09-01

Applicant: QUALCOMM Incorporated

Inventor： Donald William Kidwell, JR. ,  Ravindra Shenoy ,  Jon Lasiter

IPC: B06B1/02 ,  H01L41/332 ,  B81B7/04 ,  B06B1/06 ,  B81C1/00 ,  B81B3/00

CPC classification number: B06B1/0292 ,  B06B1/0622 ,  B81B3/0021 ,  B81B3/0097 ,  B81B7/04 ,  B81C1/00134 ,  B81C1/00214 ,  H01L41/332

Abstract: Methods, systems, computer-readable media, and apparatuses for high density Micro-Electro-Mechanical Systems (MEMS) are presented. In some embodiments, a method for manufacturing a micro-electro-mechanical device on a substrate can comprise etching a release via through a layer of the device. The method can further comprise creating a cavity in the layer of the device using the release via as a conduit to access the desired location of the cavity, the cavity enabling movement of a transducer of the device. The method can then comprise depositing low impedance, electrically conductive material into the release via to form an electrically conductive path through the layer. Finally, the method can comprise electrically coupling the electrically conductive material to an electrode of the transducer.

Abstract translation: 提出了用于高密度微机电系统（MEMS）的方法，系统，计算机可读介质和装置。 在一些实施例中，用于在基底上制造微电子机械装置的方法可以包括通过装置的层蚀刻释放通路。 该方法还可以包括使用释放通道作为导管在装置的层中产生空腔，以进入空腔的期望位置，空腔使得能够移动装置的换能器。 该方法然后可以包括将低阻抗导电材料沉积到释放通孔中以形成通过该层的导电路径。 最后，该方法可以包括将导电材料电耦合到换能器的电极。