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公开(公告)号：US10976108B2
公开(公告)日：2021-04-13
申请号：US16288735
申请日：2019-02-28
Applicant: Qorvo US, Inc.
Inventor： Gregory Valenti , Dylan Murdock , Eric Jackson
Abstract: Heat exchanger assemblies for electronic devices are disclosed. A heat exchanger assembly may include a heat transfer body that has a face that forms open passageways. A cover structure may be attached to the heat transfer body in a manner to enclose the open passageways, thereby forming a heat exchanger assembly that includes enclosed fluid conduits. In this regard, the enclosed fluid conduits may form complex and intricate patterns within the heat exchanger assembly that are tailored to the heat requirements of a particular application. Heat exchanger assemblies as described herein may be thermally coupled to a center waveguide section of a spatial power-combining device. The enclosed fluid conduits may be tailored based on locations of amplifiers within the center waveguide section to provide improved thermal operation of the spatial power-combining device.
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公开(公告)号：US10855240B2
公开(公告)日：2020-12-01
申请号：US16191541
申请日：2018-11-15
Applicant: Qorvo US, Inc.
Inventor： Christo Bojkov , Dylan Murdock , Robert Charles Dry
Abstract: Improved structures for spatial power-combining devices are disclosed. A spatial power-combining device includes a plurality of amplifier assemblies and each amplifier assembly includes a body structure that supports an input antenna structure, an amplifier, and an output antenna structure. According to embodiments disclosed herein, the body structure comprises a material that is configured to provide the spatial power-combining device with reduced weight while maintaining good thermal dissipation for heat generated by the amplifiers. In certain embodiments, the body structure may comprise an allotrope of carbon such as graphite or graphene, among others. In certain embodiments, the body structure may include one or more thermal vias configured to dissipate heat from the amplifier.
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公开(公告)号：US20200041209A1
公开(公告)日：2020-02-06
申请号：US16288735
申请日：2019-02-28
Applicant: Qorvo US, Inc.
Inventor： Gregory Valenti , Dylan Murdock , Eric Jackson
Abstract: Heat exchanger assemblies for electronic devices are disclosed. A heat exchanger assembly may include a heat transfer body that has a face that forms open passageways. A cover structure may be attached to the heat transfer body in a manner to enclose the open passageways, thereby forming a heat exchanger assembly that includes enclosed fluid conduits. In this regard, the enclosed fluid conduits may form complex and intricate patterns within the heat exchanger assembly that are tailored to the heat requirements of a particular application. Heat exchanger assemblies as described herein may be thermally coupled to a center waveguide section of a spatial power-combining device. The enclosed fluid conduits may be tailored based on locations of amplifiers within the center waveguide section to provide improved thermal operation of the spatial power-combining device.
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公开(公告)号：US20170358515A1
公开(公告)日：2017-12-14
申请号：US15295005
申请日：2016-10-17
Applicant: Qorvo US, Inc.
Inventor： Dylan Murdock
IPC: H01L23/367 , H01L23/00 , H01L23/498 , H01L23/373
CPC classification number: H01L23/3675 , H01L23/3677 , H01L23/3731 , H01L23/3736 , H01L23/49833 , H01L24/17 , H01L24/48 , H01L24/49 , H01L2224/16227 , H01L2224/16245 , H01L2224/32245 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2924/1515 , H01L2924/15747
Abstract: The present disclosure relates to a substrate with an integrated heat spreader. The disclosed substrate includes a substrate core, at least one connecting structure, and a heat spreader. The substrate core has a top surface and a bottom surface opposite the top surface of the substrate. The at least one connecting structure extends through the substrate core from the top surface of the substrate core to the bottom surface of the substrate core. And the heat spreader extends through the substrate core from the top surface of the substrate core to a bottom level that is below the bottom surface of the substrate core.
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公开(公告)号：US20230036197A1
公开(公告)日：2023-02-02
申请号：US17388499
申请日：2021-07-29
Applicant: Qorvo US, Inc.
Inventor： Dylan Murdock
IPC: H01L23/498 , H01L25/16
Abstract: The present disclosure relates to a package capable of handling high radio frequency (RF) power, which includes a carrier, a ring structure attached to a top surface of the carrier, an RF die attached to the top surface of the carrier within an opening of the ring structure and electrically connected to the ring structure, a heat spreader attached to a top surface of the ring structure, and an output signal lead configured to send out RF output signals generated by the RF die. Herein, the heat spreader covers a portion of the top surface of the ring structure at an output side of the package, and the output signal lead is attached to a top surface of the heat spreader. As such, the RF output signals are capable of being transmitted from the RF die to the output signal lead through the ring structure and the heat spreader.
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Patent Agency Ranking
公开(公告)号：US20220279676A1
公开(公告)日：2022-09-01
申请号：US17663878
申请日：2022-05-18
Applicant: Qorvo US, Inc.
Inventor： Dylan Murdock
Abstract: Thermal structures and, more particularly, improved thermal structures for heat transfer devices and spatial power-combining devices are disclosed. A spatial power-combining device may include a plurality of amplifier assemblies and each amplifier assembly includes a body structure that supports an input antenna structure, an amplifier, and an output antenna structure. One or more heat sinks may be partially or completely embedded within a body structure of such amplifier assemblies to provide effective heat dissipation paths away from amplifiers. Heat sinks may include single-phase or two-phase materials and may include pre-fabricated complex thermal structures. Embedded heat sinks may be provided by progressively forming unitary body structures around heat sinks by additive manufacturing techniques.
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公开(公告)号：US11162734B2
公开(公告)日：2021-11-02
申请号：US16288761
申请日：2019-02-28
Applicant: Qorvo US, Inc.
Inventor： Gregory Valenti , Dylan Murdock
Abstract: Heat exchanger assemblies for electronic devices and related methods are disclosed. A heat exchanger assembly may include a heat transfer body that has a face that forms open passageways, and a cover structure attached to the heat transfer body that encloses the open passageways, thereby forming enclosed fluid conduits. Heat exchanger assemblies as described herein may be thermally coupled to a center waveguide section of a spatial power-combining device. Related methods include forming open passageways by selectively removing material from a face of a heat transfer body. Multiple heat transfer bodies may be formed simultaneously by forming multiple groups or patterns of open passageways across a larger area of a heat transfer body material, and subsequently singulating the heat transfer body material into multiple heat transfer bodies. Cover structures as previously described may be formed on the heat transfer bodies before or after singulation.
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公开(公告)号：US10539371B2
公开(公告)日：2020-01-21
申请号：US15874534
申请日：2018-01-18
Applicant: Qorvo US, Inc.
Inventor： Eric Jackson , Dylan Murdock
Abstract: A liquid heat transfer device with improved heat transfer into a heating or cooling fluid is disclosed. The heat transfer device incorporates an element which creates a helical flow path through a fluid conduit to more efficiently dissipate heat within a space-constrained environment without increasing the diameter or overall length of the fluid conduit.
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公开(公告)号：US10418257B1
公开(公告)日：2019-09-17
申请号：US16043710
申请日：2018-07-24
Applicant: Qorvo US, Inc.
Inventor： Dylan Murdock
IPC: H01L23/14 , H01L21/48 , H01L23/373
Abstract: The present disclosure relates to a substrate with a plating configuration and a process for making the same. The disclosed substrate includes a substrate base with a substrate body, and a plating configuration with a plating seed layer and a plating barrier layer. Herein, the substrate body is formed of metal-diamond composites. The plating seed layer is formed of copper, silver, or gold, and the plating barrier layer includes nickel material. The plating seed layer directly covers at least sidewalls of the substrate body, and the plating barrier layer is directly formed over the plating seed layer and encloses the substrate base.
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公开(公告)号：US09911678B2
公开(公告)日：2018-03-06
申请号：US15295005
申请日：2016-10-17
Applicant: Qorvo US, Inc.
Inventor： Dylan Murdock
IPC: H01L23/34 , H01L23/367 , H01L23/498 , H01L23/00 , H01L23/373
CPC classification number: H01L23/3675 , H01L23/3677 , H01L23/3731 , H01L23/3736 , H01L23/49833 , H01L24/17 , H01L24/48 , H01L24/49 , H01L2224/16227 , H01L2224/16245 , H01L2224/32245 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2924/1515 , H01L2924/15747
Abstract: The present disclosure relates to a substrate with an integrated heat spreader. The disclosed substrate includes a substrate core, at least one connecting structure, and a heat spreader. The substrate core has a top surface and a bottom surface opposite the top surface of the substrate. The at least one connecting structure extends through the substrate core from the top surface of the substrate core to the bottom surface of the substrate core. And the heat spreader extends through the substrate core from the top surface of the substrate core to a bottom level that is below the bottom surface of the substrate core.
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