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公开(公告)号：US20230262937A1
公开(公告)日：2023-08-17
申请号：US17670113
申请日：2022-02-11
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Ching-Yi SHIH , Kang HSU
CPC classification number: H05K7/20409 , B23P15/26 , F28D21/00 , F28F3/02 , F28F21/084 , H05K7/20727 , B23P2700/10 , F28D2021/0029
Abstract: A heat sink comprises a first portion and a second portion. The first portion is configured to contact a heat-generating electronic component. The first portion is formed from a first group of materials and has a first plurality of fins. The second portion is coupled to the first portion. The second portion is formed from a second group of materials and has a second plurality of fins. The second group of materials is different than the first group of materials. The first group of materials can include extruded aluminum, stamped aluminum, or both. The second group of materials can include die-cast metal. The first plurality of fins can have a smaller fin pitch than the second plurality of fins. The heat sink can further comprise a third portion coupled to the first portion, such that the first portion is positioned between the second portion and the third portion.
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公开(公告)号：US20220190921A1
公开(公告)日：2022-06-16
申请号：US17119430
申请日：2020-12-11
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Te-Chuan WANG
Abstract: An electronic component such as a fan-less component for a 5G system having an expansion card and optical transceivers is disclosed. The electronic component has a chassis heat sink having a contact surface and a printed circuit board. A transceiver cage is located on the printed circuit board. The cage receives the optical transceiver. The transceiver cage is in thermal contact with the optical transceiver. The system includes a bracket having a heat sink support with a flat surface in thermal contact with the contact surface of the chassis heat sink. The bracket has a transceiver support having a flat surface in thermal contact with the optical transceiver and supporting the expansion card. A connector support is coupled to the heat sink support and the transceiver support. Heat from the optical transceiver is transmitted through the transceiver, connector, and the heat sink supports to the chassis heat sink.
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公开(公告)号：US20220174845A1
公开(公告)日：2022-06-02
申请号：US17247149
申请日：2020-12-01
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Yan-Kuei CHEN , Te-Chuan WANG
IPC: H05K7/20
Abstract: A cooling system for an electronic device includes a central processing unit (CPU), a remote heat sink, and a heat-pipe module. The CPU is mounted on a base of the electronic device, and the remote heat sink receives heat generated by the CPU. The heat-pipe module has a plurality of heat pipes for transferring the heat generated by the CPU to the remote heat sink. Each heat pipe has a circular section extending between a first end and a second end. The first end has a flattened, non-circular shape, and is coupled to the base near the CPU. The second end is coupled to the remote heat sink. The first end of each heat pipe is in direct contact with at least another first end of an adjacent heat pipe.
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公开(公告)号：US20190239394A1
公开(公告)日：2019-08-01
申请号：US16048745
申请日：2018-07-30
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yi-Chieh CHEN , Yueh-Chang WU , Jhih-Bin GUAN
CPC classification number: H05K7/20736 , G06F1/20 , G06F11/0766 , G06F11/2015 , G06F11/3003 , H05K7/1492 , H05K7/20909 , H05K7/20945
Abstract: A system and method to ensure the proper operation of a power supply unit in an electronic device. The electronic device has a chassis with a length and a width that includes one area having electronic components. A system fan is located in the chassis relative to the electronic components to generate air flow in the direction of the length of the chassis through the electronic components. A power supply unit is located in parallel to the system fan relative to the width of the chassis. The power supply unit includes an AC input, a DC output and an internal fan. A controller is operable to control the system fan to reduce the air flow when the power supply unit turns on AC power to the AC input, or wakes up from a cold redundant state and outputs DC power from the DC output.
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公开(公告)号：US20190235597A1
公开(公告)日：2019-08-01
申请号：US16047382
申请日：2018-07-27
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yi-Chieh CHEN , Yueh-Chang WU , Ching-Yi SHIH
Abstract: Systems and methods are provided for controlling two or more PSUs of a server system. An exemplary method comprises first determining whether the PSUs are switched on to an AC power source. If the PSUs are found not switched on to an AC power source, the method further comprises restarting the AC power source for the PSUs and completing a software-based recovery process. If the PSUs are found to be switched on to an AC power source, the method further comprises determining whether the PSUs meet a predefined criterion. If the PSUs do meet a predefined criterion, the method further comprises disabling a cold-redundancy mode for the PSUs. If the PSUs do not meet a predefined criterion, the method further comprises starting a wake-up process for a first PSU from a cold-redundancy mode.
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Patent Agency Ranking
公开(公告)号：US20240268059A1
公开(公告)日：2024-08-08
申请号：US18165849
申请日：2023-02-07
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Te-Chuan WANG , Tzu-Hsuan HSU
IPC: H05K7/20
CPC classification number: H05K7/20145 , H05K7/20209
Abstract: An example compute cabinet assembly includes an equipment room configured to implement electrical components therein, an air inlet channel coupled to a first side of the equipment room, and a cabinet fan module coupled to a second side of the equipment room opposite the first side. A first air outlet channel is coupled to the cabinet fan module and extends along a third side of the equipment room towards a first outlet of the first air outlet channel. Moreover, electric fans are positioned in the cabinet fan module, the electric fans being configured to create an airflow path originating at an inlet of the air inlet channel. The airflow path further extends through the equipment room and cabinet fan module. A guide plate is also positioned adjacent to an inlet of the equipment room, the guide plate being configured to uniformly distribute the airflow path through the equipment room.
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公开(公告)号：US20230309258A1
公开(公告)日：2023-09-28
申请号：US17701333
申请日：2022-03-22
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Ching-Yi SHIH , Po-Cheng SHEN
CPC classification number: H05K7/20181 , H05K7/20154 , H05K5/0256 , H05K5/03 , H05K7/20145 , F04D29/703
Abstract: A dust-proof telecommunication system is disclosed. The dust-proof telecommunication system includes a chassis, critical components located within the chassis, and a filter module located within the chassis near at least some of the critical components that need to be cooled. For example, the critical components include a central processing unit (CPU), a system on chip (SoC), a memory module, a PCIe card, and/or a chipset. The filter module has a filter cover that surrounds at least in part the critical components, a first air filter located at an inlet of an airflow, and a second air filter located at an outlet. The critical components located at a protective space within the chassis receive and are cooled by the airflow passing through the air filter.
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公开(公告)号：US20220346273A1
公开(公告)日：2022-10-27
申请号：US17242035
申请日：2021-04-27
Applicant: QUANTA COMPUTER INC.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Te-Chuan WANG
Abstract: A computing device comprises a heat sink including a base and a multi-dimensional thermal dissipation device disposed adjacent to the base. A thermally-conductive grease layer is disposed between and in direct contact with the multi-dimensional thermal dissipation device and the base. A gasket contains the thermally-conductive grease layer between the multi-dimensional thermal dissipation device and the base.
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公开(公告)号：US20220225541A1
公开(公告)日：2022-07-14
申请号：US17149151
申请日：2021-01-14
Applicant: QUANTA COMPUTER INC.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Te-Chuan WANG , Tzu-Hsuan HSU
IPC: H05K7/20
Abstract: A computing device includes a sealed computer chassis housing, a heat source, a heat spreader, and a thermal pad. The sealed computer chassis housing, defines an interior space and an exterior surface with a heat sink for the interior space. The heat source is disposed within the interior space. The heat spreader includes a plurality of thermally-conductive protrusions coupled to one or more components of the heat source by an intermediate thermally conductive layer. The thermal pad is positioned above and in thermal contact with the heat spreader. The thermal pad is positioned to contact an interior wall of the sealed computer chassis housing opposite to the heat sink.
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公开(公告)号：US20210365087A1
公开(公告)日：2021-11-25
申请号：US16878026
申请日：2020-05-19
Applicant: QUANTA COMPUTER INC.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Yan-Kuei CHEN , Hsin-Yu LIN
IPC: G06F1/20
Abstract: Cooling devices, such as fans, installed in a computing device can be automatically identified by reading an encoded signal from the cooling device's tachometer signal line. A cooling device can temporarily output an encoded signal in response to a trigger event, such as a power on event (e.g., powering-on of the cooling device). A controller, such as a baseboard management controller (BMC), can receive the encoded signal and decode the signal to determine identification information about the cooling device, such as vendor information and/or model information. The identification information about the cooling device can be stored, logged, output, and/or used to customize the operation of the cooling device.
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