公开(公告)号：US20160093589A1

公开(公告)日：2016-03-31

申请号：US14863837

申请日：2015-09-24

Applicant: Renesas Electronics Corporation

Inventor： Yukihiro SATO ,  Katsuhiko FUNATSU ,  Takamitsu KANAZAWA ,  Masahiro KOIDO ,  Hiroyoshi TAYA

IPC: H01L25/065 ,  H01L23/00

CPC classification number: H01L25/0655 ,  H01L21/4846 ,  H01L23/049 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/49838 ,  H01L23/49844 ,  H01L23/49861 ,  H01L24/09 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/0603 ,  H01L2224/0905 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/16151 ,  H01L2924/16251 ,  H01L2924/181 ,  H02M7/219 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Reduction in reliability of a semiconductor device is suppressed. A semiconductor device includes a plurality of metal patterns formed on a ceramic substrate, and a plurality of semiconductor chips mounted on the plurality of metal patterns. Also, the plurality of metal patterns include metal patterns MPH and MPU which face each other. In addition, a region which is provided between these metal patterns MPH and MPU and which is exposed from the plurality of metal patterns extends so as to zigzag along an extending direction of the metal pattern MPH.

Abstract translation: 抑制半导体器件的可靠性降低。 半导体器件包括形成在陶瓷衬底上的多个金属图案和安装在多个金属图案上的多个半导体芯片。 此外，多个金属图案包括彼此面对的金属图案MPH和MPU。 此外，设置在这些金属图案MPH和MPU之间并且从多个金属图案露出的区域沿着金属图案MPH的延伸方向延伸成锯齿状。