Abstract:
An object is to provide a semiconductor device having improved reliability by preventing, in forming a nonvolatile memory and MOSFETS on the same substrate, an increase in the size of grains in a gate electrode. The object can be achieved by forming the control gate electrode of the nonvolatile memory and the gate electrodes of the other MOSFETs from films of the same layer, respectively, and configuring each of the control gate electrode and the gate electrodes from a stack of two polysilicon film layers.
Abstract:
Improvements are achieved in the characteristics of a semiconductor device having a nonvolatile memory (MONOS). In a SOI substrate having a supporting substrate, an insulating layer formed thereover, and a silicon layer formed thereover, the MONOS is formed. The MONOS has a control gate electrode and a memory gate electrode formed so as to be adjacent to the control gate electrode above the semiconductor layer. The MONOS also has a first impurity region formed in the supporting substrate under the control gate electrode and a second impurity region formed in the supporting substrate under the memory gate electrode and having an effective carrier concentration lower than that of the first impurity region. By thus providing the first and second impurity regions for adjusting the respective thresholds of the control transistor and the memory transistor, variations in the thresholds of the individual transistors are reduced to reduce GiDL.