Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive

    公开(公告)号:US11763842B1

    公开(公告)日:2023-09-19

    申请号:US17743435

    申请日:2022-05-12

    IPC分类号: G11B5/48 G11B5/00

    CPC分类号: G11B5/4826 G11B2005/0021

    摘要: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap between an electrode surface of the laser diode and the flexure, and being in unmelted-solid condition.

    Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive

    公开(公告)号:US11749302B1

    公开(公告)日:2023-09-05

    申请号:US17743443

    申请日:2022-05-12

    IPC分类号: G11B5/48 G11B5/00

    摘要: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected with a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap and being in unmelted-solid condition. The head connecting step includes a heat step which an electrode surface of the laser diode is heated.

    Semiconductor Laser and Laser Radar Device Having the Semiconductor Laser

    公开(公告)号:US20220311217A1

    公开(公告)日:2022-09-29

    申请号:US17211818

    申请日:2021-03-25

    摘要: A semiconductor laser includes an active layer which emits laser light and cladding layers being formed so as to sandwich the active layer. The active layer includes a quantum dot layer including a plurality of quantum dots, which respectively confine movements of carriers in the three-dimensional directions. The laser radar device includes a light projection part which projects laser light and a light receiving part which receives reflected light of the laser light. The light projection part includes the semiconductor laser and a scanner which reflects the laser light, emitted from the semiconductor laser, to form a scanning laser light.

    Light source unit and thermally-assisted magnetic head

    公开(公告)号:US10152992B1

    公开(公告)日:2018-12-11

    申请号:US15892771

    申请日:2018-02-09

    摘要: A light source unit for thermally-assisted magnetic head includes a support member and a light source attached on the support member via a solder, and the light source unit further includes a positioning structure formed between the support member and the light source for positioning the light source and the solder. The light source unit can maintain stable height control of the light source, prevent solder over flow and prevent the light source from shifting and moving during the bonding process.

    Thermal assisted magnetic head provided with light detector that detects reflected light

    公开(公告)号:US09666218B1

    公开(公告)日:2017-05-30

    申请号:US15221921

    申请日:2016-07-28

    摘要: A thermal assisted magnetic recording head has a magnetic head slider and a light source unit that is fixed to the magnetic head slider. A first surface of the light source unit and a second surface of the magnetic head slider face each other via a gap. The light source unit includes a light source that emits laser light from an emission part that is positioned on the first surface and a photodetector that detects the laser light. The magnetic head slider includes a waveguide through which the laser light that is incident on an incident part positioned on the second surface propagates, near-field light generation means for generating near-field light on an air bearing surface, the near-field light being generated from the laser light that propagates through the waveguide, and a recording magnetic pole that is provided adjacent to the near-field light generation means and that has an end part positioned on the air bearing surface. A medium for propagating the laser light is continuously formed along a path that includes the gap and that extends from the emission part to a light receiving surface of the photodetector.

    Method of testing thermally-assisted magnetic head
    18.
    发明授权
    Method of testing thermally-assisted magnetic head 有权
    热辅助磁头测试方法

    公开(公告)号:US09437226B1

    公开(公告)日:2016-09-06

    申请号:US14710735

    申请日:2015-05-13

    摘要: A method of testing a TAMH includes providing a slider body having a waveguide embedded therein with an incidence end extending toward a back surface of the slider body; providing a light source unit including a light source and a unit substrate; coating a bonding material layer on the back surface, under the bottom, or both on the back surface and under the bottom of the unit substrate; coating a localization material layer on the back surface; aligning the light source unit to the slider body; causing a light emitted from the light source and allowed to be incident on the incidence end to anneal the localization material layer to generate an annealing mark; removing the light source unit or the light source from the slider body; and measuring a position offset between the annealing mark and the incidence end. The method can evaluate alignment accuracy of a slider body and a light source unit in two dimensional directions.

    摘要翻译: 一种测试TAMH的方法包括:提供一个滑块体,其具有嵌入其中的波导,入射端朝向滑块体的后表面延伸; 提供包括光源和单元基板的光源单元; 在单元基板的背面和底部的背面,底部或两者下方涂覆接合材料层; 在背面涂覆定位材料层; 将光源单元对准滑块体; 使从光源发出的光入射到入射端,使定位材料层退火以产生退火标记; 从滑块主体移除光源单元或光源; 并测量退火标记与入射端之间的位置偏移。 该方法可以评估滑块体和光源单元在二维方向上的对准精度。

    Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive

    公开(公告)号:US11626133B1

    公开(公告)日:2023-04-11

    申请号:US17709402

    申请日:2022-03-30

    IPC分类号: G11B5/48 G11B5/00

    摘要: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which a solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size smaller than a wiring gap between an electrode surface of the laser diode and the flexure, and being in melted-particle condition.