公开(公告)号：US20220397805A1

公开(公告)日：2022-12-15

申请号：US17700759

申请日：2022-03-22

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Sang Jin LEE ,  Ga Yeon JU

IPC分类号： G03B13/36 ,  H01F7/08 ,  H01F7/126

摘要： A camera module includes: a housing; a support frame at least partially disposed the housing; a first lens holder, which includes a lens and which disposed in the housing to be moveable along a first direction parallel to an optical axis direction; and a buffer member disposed on the support frame.

公开(公告)号：US20190164894A1

公开(公告)日：2019-05-30

申请号：US15928845

申请日：2018-03-22

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Min Sek JANG ,  Sang Jin LEE

IPC分类号： H01L23/538 ,  H01L23/31 ,  H01L23/00

摘要： A fan-out semiconductor package includes: a first semiconductor chip having an active surface having first connection pads disposed thereon and an inactive surface opposing the active surface; a second semiconductor chip having an active surface having second connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of each of the first and second semiconductor chips; and a connection member disposed on the active surface of each of the first and second semiconductor chips and including a redistribution layer electrically connected to the first and second connection pads, wherein the first and second semiconductor chips are physically integrated with each other, and the first and second semiconductor chips have internal circuits, respectively.

公开(公告)号：US20180090443A1

公开(公告)日：2018-03-29

申请号：US15453588

申请日：2017-03-08

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Sang Jin LEE ,  Dong Hun LEE

IPC分类号： H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/05124 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/10156 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/35121

摘要： A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant filling at least portions of spaces between walls of the through-hole and side surfaces of the semiconductor chip; and a second interconnection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip through vias, wherein the side surface of the semiconductor chip has a step portion.

公开(公告)号：US20150214463A1

公开(公告)日：2015-07-30

申请号：US14590970

申请日：2015-01-06

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Dong Su MOON ,  Kyung Su PARK ,  Sang Jin LEE ,  Jae Kyung KIM ,  Joon CHOI ,  Yeon Ho SON

IPC分类号： H01L41/053 ,  H01L41/09

CPC分类号： H01L41/0533 ,  B06B1/0603 ,  B06B1/14 ,  H01L41/053 ,  H01L41/09 ,  H01L41/0933

摘要： There is provided a vibration generating apparatus including: an elastic member having both end portions fixed to a housing; a piezoelectric element installed on one surface of the elastic member; and a circuit board connected to the piezoelectric element, wherein the elastic member has support parts formed on both side surfaces of both end portions thereof and bent downwardly in order to be installed in the housing, and a portion of the circuit board passing between the support parts has a flat panel shape.

摘要翻译： 提供一种振动发生装置，包括：弹性构件，其两端部固定在壳体上; 安装在所述弹性构件的一个表面上的压电元件; 以及连接到所述压电元件的电路板，其中所述弹性构件具有形成在其两个端部的两个侧表面上并且向下弯曲以便安装在所述壳体中的支撑部分，并且所述电路板的穿过所述支撑件 零件具有平板形状。