公开(公告)号：US11874471B2

公开(公告)日：2024-01-16

申请号：US17533209

申请日：2021-11-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungkeun Lee ,  Youngho Yoon ,  Kyeongsoo Kim ,  Hyunmo Yang ,  Younsang Yoo ,  Haejin Lee ,  Sangchul Jung ,  Seungnyun Kim

IPC: G02B27/01 ,  G02B6/10 ,  H05K7/20

CPC classification number: G02B27/0176 ,  H05K7/20154

Abstract: A wearable electronic device is disclosed, including: a housing including a first surface facing a same direction as a gaze of a user, a second surface facing in a second direction towards a face of the user, and a side surface surrounding a space defined between the two surfaces, a first and second light output device disposed in the housing and configured to output an image, a printed circuit board at least partially disposed between the first and second light output device, and including at least one electronic component, a supportive frame, a battery disposed between the frame and the second surface, and a first heat radiating member disposed between the frame and the battery.

公开(公告)号：US11497141B2

公开(公告)日：2022-11-08

申请号：US16577835

申请日：2019-09-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungha Koo ,  Kuntak Kim ,  Jihong Kim ,  Hongki Moon ,  Hajoong Yun ,  Haejin Lee ,  Seyoung Jang

IPC: H05K7/20 ,  F28F21/06 ,  F28D15/04

Abstract: A heat dissipation device is provided. The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the first plate and the second plate, a wick layer located on an inner wall defined in the interior space by the first plate or the second plate, and a working fluid configured to flow in the interior space in a gaseous state, and flow in the wick layer in a liquefied state, wherein the container further includes a fluoride-based polymer having a predetermined gas permeability.

公开(公告)号：US11304337B2

公开(公告)日：2022-04-12

申请号：US17001017

申请日：2020-08-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haejin Lee ,  Kyungha Koo ,  Min Park ,  Jungje Bang

IPC: H05K7/20 ,  H05K9/00

Abstract: Various embodiments of the present invention relate to an electronic device comprising a shielding structure which is arranged on the periphery of an electronic component, and which has an improved heat-radiating performance. The electronic device comprises: a circuit board; a non-elastic shielding member arranged on one surface of the circuit board, the non-elastic shielding member having a concave portion and an opening formed on a part of the concave portion; a processor contained in the concave portion and arranged on the one surface so as to correspond to the opening; a first heat transfer member arranged to contact the outer surface of the processor in at least a partial area of the opening; an elastic shielding member arranged on the periphery of the opening; and a second heat transfer member arranged to contact the first heat transfer member and the elastic shielding member. The second heat transfer member comprises a metal plate and a heat transfer material having a thermal conductivity higher than 1 W/mK. The heat transfer material may be coupled to the metal plate. The present invention may further comprise various other embodiments.

公开(公告)号：US11047628B2

公开(公告)日：2021-06-29

申请号：US15999729

申请日：2017-02-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haejin Lee ,  Kyungha Koo ,  Chunghyo Jung ,  Se-Young Jang ,  Jungje Bang ,  Jaeheung Ye ,  Chi-Hyun Cho

IPC: H05K7/20 ,  F28D15/02 ,  G06F1/20 ,  H04M1/02 ,  H05K9/00 ,  H01L23/427

Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.