Abstract:
An optical film includes a polarizing film including a polyolefin and a dichroic dye, a first photo-alignment layer on a side of the polarizing film, and a first liquid crystal layer on a side of the first photo-alignment layer, wherein the polarizing film and the first liquid crystal layer are in close contact with the first photo-alignment layer to provide a self-integrated structure. A method of manufacturing the same and a display device including the optical film are also provided.
Abstract:
There is provided a method of forming patterns for a semiconductor device. The method sequentially forming a first mask layer and a second mask layer on a substrate. The method also includes forming a second mask pattern layer by patterning the second mask layer. The method further includes forming a first mask pattern layer having a negative slope portion, by etching the first mask layer exposed through the second mask pattern layer. The method also includes forming a thin film layer on the substrate exposed through the first mask pattern layer.
Abstract:
A light emitting device includes a first electrode and a second electrode facing each other, a light emitting layer disposed between the first electrode and the second electrode, and the light emitting layer including quantum dots, wherein the light emitting layer includes a first light emitting layer proximate to the first electrode and a second light emitting layer proximate to the second electrode, the quantum dots of the first light emitting layer include a first ligand on a surface, and the quantum dots of the second light emitting layer include a second ligand on a surface, the first ligand different from the second ligand, a HOMO energy level of the first light emitting layer is lower (shallower) than a HOMO energy level of the second light emitting layer.
Abstract:
A retardation film including a retardation coating layer including a polyimide and a solvent, wherein the solvent has a vapor pressure of less than about 15 Torr at 20° C. and a solubility parameter satisfying Relationship Formula 1. 16≤√{square root over (δD2+δP2+δH2)}
Abstract:
A liquid crystal display includes a lower substrate and an upper substrate facing each other, a liquid crystal layer disposed between the lower substrate and the upper substrate, a color conversion layer disposed on the liquid crystal layer, a first polarizing layer and a first phase difference layer disposed between the liquid crystal layer and the color conversion layer, and a second polarizing layer and a second phase difference layer disposed between a light source and the lower substrate, wherein the first phase difference layer has a refractive index satisfying Inequality 1 and the second phase difference layer has refractive indexes satisfying Inequality 2. nx1≥ny1>nz1 [Inequality 1] nx2>nz2>ny2 [Inequality 2] In Inequalities 1 and 2, nx1, nx2, ny1, ny2, nz1, and nz2 are the same in the detailed description.
Abstract:
A compensation film satisfies Inequalities 1 and 2, and an antireflective film and a display device are provided with the compensation film. 0.90 ≤ R e ( θ° ) + R e ( - θ° ) 2 R e ( 0 ° ) ≤ 1.20 [ Inequality 1 ] R e ( 450 nm )
Abstract:
An organic light emitting diode device includes an organic light emitting display panel and a circular polarizing plate disposed on the organic light emitting display panel and including a polarizer and a compensation film, where a retardation of the compensation film in a first direction is determined based on a retardation of the organic light emitting display panel in the first direction.
Abstract:
A compensation film includes an elongation film having an elongation rate of greater than or equal to about 200% in a uniaxial direction and having a surface energy of about 40 mJ/m2 to about 65 mJ/m2 and a liquid crystal layer disposed on one side of the elongation film and including liquid crystals.
Abstract:
A polymerizable liquid crystal compound represented by Chemical Formula 1: wherein in Chemical Formula 1, groups and variables are the same as defined in the detailed description.
Abstract:
There is provided a method of manufacturing a substrate for mounting an electronic device. The method includes disposing a protective layer on a surface of the substrate except for an edge portion thereof . An oxide film is disposed on the entirety of the surface of the substrate except for where the protective layer is disposed The oxide film is grown. A through hole is formed in a thickness direction of the substrate by selectively etching the protective layer. The oxide film is removed. In the manufacturing method, defects in the substrate for mounting an electronic device may be reduced and manufacturing costs can be reduced.