公开(公告)号：US20210331192A1

公开(公告)日：2021-10-28

申请号：US17359730

申请日：2021-06-28

Applicant: SCREEN Holdings Co., Ltd.

Inventor： Yukifumi YOSHIDA ,  Hiroaki TAKAHASHI ,  Masayuki OTSUJI ,  Manabu OKUTANI ,  Chikara MAEDA ,  Hiroshi ABE ,  Shuichi YASUDA ,  Yasunori KANEMATSU

IPC: B05B12/10 ,  B08B3/10 ,  B08B7/00 ,  H01L21/02 ,  H01L21/67

Abstract: A substrate processing method includes a first processing liquid supplying step of supplying a first processing liquid to an upper surface of the substrate, a holding layer forming step of solidifying or curing the first processing liquid to form a particle holding layer on the upper surface of the substrate, a holding layer removing step of peeling and removing the particle holding layer from the upper surface of the substrate, a liquid film forming step of forming, after removing the particle holding layer from the substrate, a liquid film of the second processing liquid, a solidifying step of cooling the liquid film to a temperature not more than a melting point of the sublimable substance to make the liquid film solidify on the substrate and form a solid film, and a sublimating step of sublimating and thereby removing the solid film from the substrate.

公开(公告)号：US20190366394A1

公开(公告)日：2019-12-05

申请号：US16426115

申请日：2019-05-30

Applicant: SCREEN Holdings Co., Ltd. ,  Merck Patent GmbH

Inventor： Yukifumi YOSHIDA ,  Manabu OKUTANI ,  Shuichi YASUDA ,  Yasunori KANEMATSU ,  Dai UEDA ,  Song ZHANG ,  Tatsuro NAGAHARA ,  Takafumi KINUTA

IPC: B08B7/00 ,  B08B3/08 ,  B08B3/04 ,  B08B3/10 ,  C11D3/37 ,  C11D3/20

Abstract: A substrate processing method includes a processing liquid supplying step of supplying a processing liquid having a solute and a solvent to a front surface of a substrate, a processing film forming step of forming on the front surface of the substrate a processing film which holds a removal object present on the front surface of the substrate by solidifying or curing the processing liquid supplied to the front surface of the substrate, and a peeling step of peeling the processing film from the front surface of the substrate together with the removal object by supplying a peeling liquid to the front surface of the substrate, and the peeling step includes a penetrating hole forming step of forming a penetrating hole on the processing film by dissolving partially the processing film in the peeling liquid.

公开(公告)号：US20190176179A1

公开(公告)日：2019-06-13

申请号：US16203719

申请日：2018-11-29

Applicant: SCREEN Holdings Co., Ltd.

Inventor： Yukifumi YOSHIDA ,  Hiroaki TAKAHASHI ,  Masayuki OTSUJI ,  Manabu OKUTANI ,  Chikara MAEDA ,  Hiroshi ABE ,  Shuichi YASUDA ,  Yasunori KANEMATSU

IPC: B05B12/10 ,  B08B3/10 ,  B05D1/00 ,  B05B1/24 ,  H01L21/67

Abstract: A substrate processing method includes a first processing liquid supplying step of supplying a first processing liquid to an upper surface of the substrate, a holding layer forming step of solidifying or curing the first processing liquid to form a particle holding layer on the upper surface of the substrate, a holding layer removing step of peeling and removing the particle holding layer from the upper surface of the substrate, a liquid film forming step of forming, after removing the particle holding layer from the substrate, a liquid film of the second processing liquid, a solidifying step of cooling the liquid film to a temperature not more than a melting point of the sublimable substance to make the liquid film solidify on the substrate and form a solid film, and a sublimating step of sublimating and thereby removing the solid film from the substrate.

公开(公告)号：US20150217335A1

公开(公告)日：2015-08-06

申请号：US14687649

申请日：2015-04-15

Applicant: SCREEN Holdings Co., Ltd.

Inventor： Tomohiro GOTO ,  Masakazu SANADA ,  Kazuhito SHIGEMORI ,  Osamu TAMADA ,  Shuichi YASUDA

IPC: B08B3/02

CPC classification number: B08B3/024 ,  F26B5/08 ,  H01L21/02057 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051

Abstract: A method and apparatus capable of eliminating occurrence of a development failure when a DI water discharge nozzle 20 is scanned to dry a substrate by spinning. A substrate is held in a horizontal posture by a spin chuck and rotated about a vertical axis by a rotation motor, and when an outlet of the nozzle is scanned from a position opposed to a center of the substrate W to a position opposed to a circumferential edge while a cleaning solution being discharged, immediately after the nozzle has started to move, only one dried core is produced in the vicinity of the center of the substrate, and thus production of not less than two dried cores in the vicinity of the center of the substrate is prevented. The dried region is spread all over the surface of the substrate.

Abstract translation: 当去除去离子水喷嘴20被扫描以通过纺丝干燥基材时，能够消除发生显影故障的方法和装置。 通过旋转卡盘将基板保持在水平姿态，并通过旋转马达绕垂直轴线旋转，并且当喷嘴的出口从与基板W的中心相对的位置扫描到与圆周方向相对的位置时 边缘，同时在喷嘴开始移动之后立即排出的清洁溶液在基板中心附近仅产生一个干燥的芯，从而在中心附近生产不少于两个干燥的芯 防止了基板。 干燥的区域遍布基底的整个表面。