公开(公告)号：US20240014718A1

公开(公告)日：2024-01-11

申请号：US18345863

申请日：2023-06-30

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Luca SEGHIZZI ,  Federico VERCESI ,  Gianluca LONGONI

IPC: H02K15/02 ,  H02K15/00

CPC classification number: H02K15/026 ,  H02K15/0068 ,  H02K2215/00

Abstract: A stator for an electric actuator or motor, including: a solid body; a ferromagnetic core region between the layers of semiconductor material, electrically insulated from the layers of semiconductor material; a plurality of conductive through vias through the solid body; a first plurality of conductive strips, which extend parallel to one another above the core; and a second plurality of conductive strips, which extend parallel to one another above the core and opposite to the first plurality of conductive strips; wherein the first plurality of conductive strips, the plurality of conductive through vias, and the second plurality of conductive strips form a winding or coil of the stator.

公开(公告)号：US20230110175A1

公开(公告)日：2023-04-13

申请号：US17948075

申请日：2022-09-19

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Andrea NOMELLINI ,  Luca SEGHIZZI

IPC: B01L3/00 ,  C23C16/24 ,  C23C16/40 ,  C23C16/04

Abstract: Process for manufacturing a microfluidic device, wherein a sacrificial layer is formed on a semiconductor substrate; a carrying layer is formed on the sacrificial layer; the carrying layer is selectively removed to form at least one release opening extending through the carrying layer; a permeable layer of a permeable semiconductor material is formed in the at least one release opening; the sacrificial layer is selectively removed through the permeable layer to form a fluidic chamber; the at least one release opening is filled with non-permeable semiconductor filling material, forming a monolithic body having a membrane region; an actuator element is formed on the membrane region and a cap element is attached to the monolithic body and surrounds the actuator element.

公开(公告)号：US20210351338A1

公开(公告)日：2021-11-11

申请号：US17137220

申请日：2020-12-29

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Domenico GIUSTI ,  Carlo Luigi PRELINI ,  Marco FERRERA ,  Carla Maria LAZZARI ,  Luca SEGHIZZI ,  Nicolo' BONI ,  Roberto CARMINATI ,  Fabio QUAGLIA

IPC: H01L41/09 ,  F16K99/00 ,  G05D7/06 ,  B01L3/00

Abstract: The MEMS actuator is formed by a substrate, which surrounds a cavity; by a deformable structure suspended on the cavity; by an actuation structure formed by a first piezoelectric region of a first piezoelectric material, supported by the deformable structure and configured to cause a deformation of the deformable structure; and by a detection structure formed by a second piezoelectric region of a second piezoelectric material, supported by the deformable structure and configured to detect the deformation of the deformable structure.

公开(公告)号：US20210188620A1

公开(公告)日：2021-06-24

申请号：US17126903

申请日：2020-12-18

Applicant: STMicroelectronics S.r.l.

Inventor： Luca SEGHIZZI ,  Nicolo' BONI ,  Laura OGGIONI ,  Roberto CARMINATI ,  Marta CARMINATI

IPC: B81B3/00 ,  B81C1/00

Abstract: For manufacturing an optical microelectromechanical device, a first wafer of semiconductor material having a first surface and a second surface is machined to form a suspended mirror structure, a fixed structure surrounding the suspended mirror structure, elastic supporting elements which extend between the fixed structure and the suspended mirror structure, and an actuation structure coupled to the suspended mirror structure. A second wafer is machined separately to form a chamber delimited by a bottom wall having a through opening. The second wafer is bonded to the first surface of the first wafer in such a way that the chamber overlies the actuation structure and the through opening is aligned to the suspended mirror structure. Furthermore, a third wafer is bonded to the second surface of the first wafer to form a composite wafer device. The composite wafer device is then diced to form an optical microelectromechanical device.

公开(公告)号：US20210119105A1

公开(公告)日：2021-04-22

申请号：US17070548

申请日：2020-10-14

Applicant: STMicroelectronics S.r.l.

Inventor： Luca SEGHIZZI ,  Federico VERCESI ,  Claudia PEDRINI

IPC: H01L41/083 ,  H01L41/113 ,  H01L41/25 ,  H01L41/35

Abstract: A transducer includes a supporting body and a suspended structure mechanically coupled to the supporting body. The suspended structure has a first and a second surface opposite to one another along an axis, and is configured to oscillate in an oscillation direction having at least one component parallel to the axis. A first piezoelectric transducer is disposed on the first surface of the suspended structure, and a second piezoelectric transducer is disposed on the second surface of the suspended structure.